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Nihon Superior Sets New Standards in Lead-Free Soldering Technology at APEX 2024

03/13/2024 | PVA
Nihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth 1325 during the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California.

Indium Corporation to Showcase Proven EV Products and High-Reliability Alloys at Productronica China

02/28/2024 | Indium Corporation
As a materials pioneer and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 20-22, in Shanghai.

UL-Authorization Received for Ventec High-CTI, Halogen Free FR15.1 Substrates VT-447C and VT-441C

02/27/2024 | Ventec
Ventec International Group Co., Ltd. , is pleased to announce that UL’s evaluation of two of Ventec’s halogen-free, phenolic cured high-CTI substrates have received authorization to apply the UL mark.

KIC to Discuss Revolutionary Contact-less Thermal AnalysisTM at SMTA Dallas Expo and Tech Forum

02/09/2024 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, will exhibit its latest breakthrough technology, Contact-less Thermal AnalysisTM, at the SMTA Dallas Expo and Tech Forum.

AIM to Highlight NC259FPA Ultrafine Solder Paste & Present on Low Temp Solder at IPC APEX 2024

02/09/2024 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming IPC APEX EXPO 2024 taking place April 9-11 at the Anaheim Convention Center in Anaheim, California.
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