Largest Flexible X-Ray Detector Made with Thin Film Transistors
December 28, 2015 | PARCEstimated reading time: 2 minutes
The Flexible Electronics and Display Center (FEDC) at Arizona State University and PARC, a Xerox company, announced today that they have successfully manufactured the world's largest flexible X-ray detector prototypes using advanced thin film transistors (TFTs).
Measuring 10 diagonal inches, the device has been jointly developed at the FEDC and PARC in conjunction with the Army Research Lab (ARL) and the Defense Threat Reduction Agency (DTRA). The device will be used to advance the development of flexible X-ray detectors for use in thin, lightweight, conformable and highly rugged devices.
“This achievement is a fantastic example of how academia, industry and government can collaborate to advance key technologies and national priorities,” said Sethuraman “Panch” Panchanathan, senior vice president for Knowledge Enterprise Development at ASU. “Flexible electronics hold tremendous potential to accelerate our global competitiveness in the area of advanced manufacturing by partnering with federal agencies and industry leaders."
The TFT and PIN diode processing was done on the 470 mm by 370 mm Gen II line at the FEDC. This device showcases the center's successful scale up to GEN II, and the ability to produce sensors and displays using TFTs in standard process flows with the center’s proprietary bond/de-bond technology. These detectors are unique in that they showcase both of the flexible substrates the center uses to make devices. Some of the new detectors are on PEN (Polyethylene Naphthalate) and some are on polyimide.
“This success came from a rewarding collaboration that combines FEDC’s flexible array fabrication technology and PARC’s experience with digital x-ray systems,” said Bob Street, PARC Senior Research Fellow.
The system design and integration was done at PARC. The flexible X-ray sensor was coupled to a tablet device for control and image viewing. This system shows PARC’s capability to build user-defined prototype systems incorporating novel device physics, materials and technology. PARC has extensive experience in building large-area electronic systems, display and backplane prototypes, and organic and printed electronics.
Page 1 of 2
Suggested Items
Zentech’s Board of Directors Announces the Return of Matt Turpin as President and CEO
04/22/2024 | Zentech ManufacturingTurpin draws upon over 35 years of experience in the electronics industry and has an 18-year history with Zentech. He previously served as President and CEO from 2006 to 2019 after which time he has remained active in the EMS industry as an advisor to Zentech and other industry organizations.
Aaron Woolf, Dylan Peterson Join SIA Team
04/22/2024 | SIAThe Semiconductor Industry Association (SIA) announced Aaron Woolf and Dylan Peterson have joined the SIA team. Woolf will serve as director of global policy for economic security and Peterson will be a communications associate. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
It’s Only Common Sense: OCCAM—the Time Is Now
04/22/2024 | Dan Beaulieu -- Column: It's Only Common SenseOne of my favorite books is a little tome called Who Moved My Cheese? Even those of you who don’t spend a lot of time reading books have at least heard of it and know that it refers to people, especially in business, who are so stuck in their ways that they get upset when something changes. In our business, we know this kind of thinking is especially true. In fact, it always makes me laugh when one of my innovative friends finds a new way to do something and is afraid that someone will steal his idea. I always tell him that no one in our business, especially a PCB engineer, has ever thought about someone else’s innovative idea enough to steal it.
Digitalisation and ESG
04/19/2024 | Marina Hornasek-Metzl, AT&SDigitalisation and ESG are prominent and high-priority topics in the global business community. The first focuses on applying technology throughout the value chain to produce faster, smarter, and more desirable business outcomes. The latter emphasises the broader value a business is expected to create for its stakeholders from an environmental, social, and governance perspective.
Real Time with... IPC APEX EXPO 2024: Looking Back, Looking Forward With IEC
04/19/2024 | Real Time with...IPC APEX EXPOIEC came to the RTW booth and discussed both the legacy of IEC's past and the vision for its future. Industry veteran Bruno Ferri highlighted his quarter-century tenure in the industry and with IEC since its founding. He still exhibits boundless enthusiasm for the industry. Brando Stone, a young professional and a future face of IEC, talked about IEC's plans going forward and his experience at this year's IPC APEX EXPO.