Matrix's NEW Hakuto Dry Film Laminator Impresses at IPC


Reading time ( words)

Matrix is delighted with customer reaction at last month’s North American IPC unveiling of the new Hakuto Mach 630NP/6630NP Series Dry Film Laminators and is now ready to provide Sales and Service to all regions of North America.

During the recent APEX/IPC Show in Las Vegas, customers were amazed at the new and Innovative technology such as changing rolls in a matter of seconds.

Matrix believes the NEW Hakuto Mach 630NP Dry Film Laminator will change the game for PCB manufacturing.

Fred Long, Matrix Business Development says: “The new Mach 630NP machine addresses the accuracy needed to assist in the transfer of very fine lines on the latest HSLL laminates using Super Low Profile Copper surfaces.  This is made possible by the new Lamination Module with its EVEN Heat and EVEN Pressure across the entire surface of the laminated panel.  In addition, the ability to change the rubber lamination rolls in seconds will not only increase productivity but will also offer alternative “quick change” rubber solutions for different product needs.  The complete redesign of the film lamination approach will now begin to reach the most important users of this latest technology.  Matrix is eager to show manufacturers that by using the new system, Productivity and Yield will now surpass all traditional ROI expectations.”

See the PCB007 IPC Interview with Dan Feinberg and Fred Long discussing the new laminating machine and its innovative features, click here.

During the next few weeks, Matrix is scheduled to place additional machines in three specific regional areas in the US.  Customers will then be able to travel to these sites and see the machines in operation.

About Matrix USA Inc.

Committed to the motto, “Quality Products, Dependable People”, Matrix was established in 1977 with the objective of providing quality raw materials to the North American Printed Circuit Board Industry. Matrix has four rapid-response warehouses located throughout the US and Canada that fulfill high quality, fast delivery, and custom orders daily. For further information, click here.

 

Share




Suggested Items

IPC APEX EXPO 2023 Special Session: Advanced Packaging

03/13/2023 | Pete Starkey, I-Connect007
The IPC APEX EXPO Special Session on Advanced Packaging this year attracted enormous interest, with Conference Room 2 at capacity long before the session began. Even with lots of extra seats squeezed around the edges, the session was standing room only for the just-in-time arrivals. IPC Chief Technology Officer Matt Kelly opened proceedings by introducing a distinguished panel of experts: Jan Vardaman, president and founder of TechSearch International; Sam Salama, CEO of Hyperion Technology; Matt Neely, director of process engineering at TTM Technologies; and Jim Fuller, VP of engineering technology at Sanmina.

EIPC Winter Conference 2023: Day 1 Review

02/27/2023 | Pete Starkey, I-Connect007
The EIPC Winter Conference returned to the Metropolis of Lyon in eastern France this month. In 2018, the venue was Villeurbanne in the Auvergne-Rhône-Alpes region. Five years later the setting was the Groupama Stadium in Décines-Charpieu, and leaders of the European printed circuit community gathered in expectation of a spectacular programme of 16 presentations, a visit to a nuclear power station, and an invaluable networking opportunity. They weren’t disappointed.

Real Time with... IPC APEX EXPO 2023: DART NextGen Technology

02/15/2023 | Real Time with...IPC APEX EXPO
Brendan Hogan from MivaTek Global describes recent developments in direct imaging technology, particularly the capability to achieve on-the-fly scaling and feature-size control with digital adaptive rasterization technology (DART).



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.