Laser Pointers: Automate to Innovate in Flex Processing


Reading time ( words)

Introduction

The growing market demand for mobile devices, wearables and Internet of Things (IoT) devices continues to create new challenges for suppliers and manufacturers in the electronics value chain. Along with this market demand comes a challenging set of market requirements for the underlying circuits and components that drive such devices. These requirements are primarily related to functional attributes such as speed and functionality, and to form factor constraints such as size, build quality and durability. At the same time, the big brands—the manufacturers’ customers—are not only battling to differentiate themselves among myriad alternatives, but are also striving to be the first to address new and broader markets with a wider range of devices.

Effectively responding to these new requirements—and doing so profitably—requires that manufacturers continually innovate, but with a focus on maintaining processing quality without sacrificing throughput or increasing costs. They must adopt new processes, new techniques and new technologies, and be willing to creatively adapt their production capabilities to match the changing needs of their customers.

In their drive to aggressively cut costs out of their business, manufacturers are looking for more creative ways to optimize production, increase efficiency and improve yields. All factors that affect a lower cost of ownership for capital equipment.

One of the ways flexible printed circuit (FPC) manufacturers have been effective in staying ahead of the throughput/cost curve is through the deployment of appropriate automation. Yet, although automation may be one of the lowhanging fruits for flex PCB processors, its application should be viewed in the context of a production flow that may already include other innovations.

Read the full article here.

Editor's Note: This article originally appeared in the May 2016 issue of The PCB Magazine.

Share




Suggested Items

PCB Technologies’ InPack to Focus on Miniaturization, Packaging

05/16/2022 | Andy Shaughnessy, Design007 Magazine
I recently spoke with PCB Technologies’ Jeff De Serrano, Yaniv Maydar, and Alon Menache about their new venture, InPack. They explain their plans to focus on advanced packaging, miniaturization, and other high-end technology, with much faster time to market, and they offer a view of the global market as well.

EIPC Technical Snapshot: Supporting Autonomous Driving

05/12/2022 | Pete Starkey, I-Connect007
EIPC’s 17th Technical Snapshot webinar on May 4 focused on developments in automotive electronics, particularly on advances in the technologies required to support the evolution of autonomous driving. The team brought together two expert speakers to present their detailed views on topics encompassed within “CASE,” the acronym that appears to be taking over the automotive industry.

EIPC Technical Snapshot: High-end PCB Market Requirements and Technology Trends

03/30/2022 | Pete Starkey, I-Connect007
The European Institute for the PCB Community (EIPC) continues to provide an efficient platform for following and pursuing new developments. Its Technical Snapshot webinar has become established as a must-attend monthly event, and consistently delivers essential information of the highest calibre and relevance. The 16th in the series on March 23 focused on market requirements and technology trends at the high end of the PCB and semiconductor packaging industries, with two eminent speakers.



Copyright © 2022 I-Connect007. All rights reserved.