Selecting Flex Materials: Do Your Homework
While the layout of the circuit gives us much of the electrical characteristics of the design, your choice of materials can affect the mechanical and electrical characteristics of the circuit. Material choices affect not only the design of the circuit for its environment, but also the manufacturing and assembly processes. While the layout of the circuit gives us much of the electrical characteristics of the design, your choice of materials can affect the mechanical and electrical characteristics of the circuit.
Challenges of DFM Analysis for Flex and Rigid-flex Design, Part 2
Everyday rigid FR-4 PCBs have a well-known layer stackup recipe: dielectrics, PCB conductor layers, plane layers, mask, and silkscreen (nomenclature or legend). More advanced layer types may include embedded or screened components or cavities with bonded bare die. Flex and rigid-flex stackups include those similar to rigid PCBs, such as dielectrics, conductor, mask, and silkscreen layers, but that is where the similarity ends. There are many additional layer types present for this genre of PCB. They include types like coverlay, adhesive, conductive film, conductive foil, conductive adhesive, bondply, and stiffener.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week’s must-reads contains a veritable potpourri of information from around the industry. We have a Pete Starkey review of the latest EIPC webinar on ultra HDI and thin film resistors, an interview with the founder of an electronics trade school in Texas, and an update from PCBAA about their lobbying efforts in Washington. We also have news about our brand-new podcast, or “pod,” as the kids say, and a column about the wisdom of Don Draper that just might serve technologists and managers well. Read on, folks!
I-Connect007 Launches 'On the Line with...' Podcast with Series on Sustainability
Expanding its avenues of content delivery, I-Connect007 is excited to announce the launch of our latest educational product, On the Line with.., available on Spotify, Apple and all the major podcast platforms. In this podcast, we speak with industry experts to get the latest insights and perspectives on the most relevant topics in the electronics industry today.
Flex, Rigid-flex, and Rigidized Flex: What’s Right for You?
I recently spoke with Mike Morando, director of sales and marketing for PFC Flexible Circuits and a contributor for Flex007. I asked Mike to discuss the latest innovations at PFC, as well as some of the trends he’s seeing in flex and rigid-flex circuits now. Mike also discusses rigidized flex, a technology that is an alternative to rigid-flex circuits—one that can save customers up to 20% compared to rigid-flex. Innovation in the flex arena never seems to stop.
DownStream Discusses Rigid-flex and DFM Trends
I recently sat down with Joe Clark, founder, and Ray Fugitt, technical marketing manager, of DownStream Technologies to discuss trends in tool design and manufacturing, including rigid-flex design and refreshed graphical user interfaces (GUI).
RF Antenna Design and Layout Tips for Your PCB
These days, it’s hard to think of a consumer product that doesn’t contain an antenna. Even my garage door opener can connect to my phone via Bluetooth or Wi-Fi. Each time a new RF antenna gets added to a PCB layout, it can create a new headache for RF designers, especially as analog design skills start to become critical again. With so many RF capabilities being added to new PCBs, how can designers ensure the signals in their system are not corrupted and signal integrity is preserved?
DFM Analysis for Flex and Rigid-flex Design, Part 1
Flex and rigid-flex PCB constructions are not new concepts. It has become commonplace as engineers look for alternative circuit packaging for ever-shrinking electronic products. A flat, one-sheet schematic for a straight ribbon cable is analogous to its physical flat substrate. A flat, multi-sheet schematic that details circuitry for a rigid-flex design bears little visual resemblance to its three-dimensional, variable material rigid-flex assembly. However, in both schematic examples, schematic-based analysis tools are applied equally. This same truth also applies to common FR-4-based two-layer or multilayer PCBs.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
How was your week? We’ve been pretty busy ourselves, bringing you coverage of the SMTA Expo & Tech Forum in Boise, Idaho. Tabletops shows like this offer a great value during the spring, in between the bigger shows like IPC APEX EXPO and SMTA International. In fact, SMTA schedules approximately 30 regional shows around the United States and abroad.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Texans like to say that everything is bigger in Texas. That certainly seems to be the case for the SMTA Dallas Expo & Tech Forum. Publisher Barry Matties and I attended SMTA Dallas on Tuesday, and the tabletop show has now grown to 100 exhibitors, up from 92 vendors last year. It’s become more than a local or regional show, with some exhibitors flying in from Silicon Valley and the East Coast.
Nick Koop: A Commitment to Lifelong Learning
Nick Koop, director of flex technology at TTM Technologies, reflects on the powerful impact the electronics manufacturing industry has had on the world, as well as the many learning opportunities offered by actively participating in IPC. Nick urges aspiring young professionals to reach out and create the lasting connections that will guide them throughout their careers.
A Week-long Industry Extravaganza
We were back in San Diego, maybe for a “long vacation,” as IPC APEX EXPO is in Anaheim next year. Before we get to Anaheim, though, let’s talk about the show: It was a great week. I spent Sunday and Monday visiting some excellent Professional Development courses. As you know, this is a fast-changing industry, and we have to keep learning to stay ahead. On Monday, I attended the Microvia Weak Interface/Reliability subcommittee, and on Tuesday, the Ultra-HDI Technology Committee.
Real Time with... IPC APEX EXPO 2023: Arlon's Growth Continues
In this interview, Andy Shaughnessy meets with Mark Carlson, global OEM marketing manager for Arlon EMC, to discuss Arlon’s expansion and integration with EMC, as well as products they are releasing in 2023.
Real Time with... IPC APEX EXPO 2023: Flat Flex Cable a Potentially Disruptive Idea
Managing Editor Andy Shaughnessy and Jason Michaud, VP of sales and marketing for Miraco, discuss the company's flat flex cable, which could replace the flexible circuit in certain situations. Jason explains why the company is happy to offer customers less expensive options, even if it costs them money in the short run.
Real Time with... IPC APEX EXPO 2023: Positioning in the Market
Mycronic’s Kevin Clue shares with guest editor Jesse Vaughan new innovations in Mycronic AOI and their position in the dispensing/coating equipment market. As a leading global partner for flexible PCB assembly solutions, Mycronic continues to respond to growing customer demand for standardized software integration and state-of-the-art inspection technologies. In addition to PCB assembly, jet printing, dispensing, coating and material handling solutions, the company has introduced major advances in 3D inspection technologies and factory connectivity.
Don't Blink: The IPC APEX EXPO Time-lapse
It’s a tradition here at I-Connect007 to set up a time-lapse for IPC APEX EXPO. There’s something satisfying, mesmerizing even, to watch the show floor build out and see the moment when the doors open and visitors fill the exhibit hall. Based on what others have said over the years, I know I’m not the only one whose favorite part is when the carpet gets rolled out and the whole character of the exhibition changes. This time lapse starts on the Saturday prior and continues through the Thursday tear-down phase.
It’s Here: The Launch of IPC Community Magazine
IPC Community Magazine launches today at IPC APEX EXPO 2023, both in digital and print form. It is now widely available for download at no cost. This magazine helps tell the stories of IPC, particularly for IPC members who use and interact with the trade organization. IPC worked closely with I-Connect007 (IPC Publishing Group) to develop the concept for the publication, and asked John W. Mitchell, president and CEO of IPC, to share a few thoughts as he looked at the magazine for the first time in print.
Classes and Meetings Under Way at IPC APEX EXPO
IPC APEX EXPO 2023 doesn’t officially kick off until Tuesday, but there’s plenty of action going on here at the San Diego Convention Center. Booths are sprouting up on the show floor, and exhibitors are starting to arrive. Upstairs, committee meetings have been taking place all weekend; the IPC-J-STD-001 and IPC-A-610 Joint Task Group, and IPC-A-600 and IPC-6012 Joint Task Group meetings, were abuzz with activity. The Professional Development classes began on Sunday, covering everything from design through assembly processes, flex and rigid-flex, and technologies of the future.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
“New year, new you.” That tagline seems to be everywhere right now. All five must-reads this week reflect this theme. Does this apply to you and your company? We have quite a duke’s mixture of articles. We’ve got AT&S outlining their market position on advanced packaging, and Auburn University doing research on smart manufacturing processes. Keysight is coordinating practical 6G research in Europe, Technica shares where they see the market growing, and SEMI adds new members to a key board responsible for market guidance. These five stories drew a lot of reader attention this week.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
The youngsters are back in school, and we’re all back to work. The water is back on for most of us in Atlanta; when temps dropped down to 8 degrees Fahrenheit, our pipes started bursting left and right. After a Christmas dinner with no water, I have a new appreciation for H2O. It’s been a busy week, and we published a variety of articles, columns, and news items. In this week’s top five, we have news about the market in Southeast Asia, a look at what the CHIPS Act really entails, a deep dive into CMMC, and a peek at how printed electronics developers are using flexible circuit concepts to facilitate PEC. We also say goodbye to a Top Gun PCB designer who left us way too soon.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Normally, the holiday season is a slow(ish) news time, but this year just feels different. My opinion is that the technology industry banked up a whole bunch of innovations and new products during the pandemic disruptions, which are coming to market as quickly as possible. The November/December news is full of technology discussion, as my selections this week clearly demonstrate.
Web vs. Direct Imaging
As flexible printed circuits (FPC) continue making waves in PCB manufacturing, the Altix team of Alexis Guilbert, Damien Boureau, and Alexandre Camus look at today’s use cases for FPCs, and detail the finer points of roll-to-roll technology vs. direct imaging. For example, how long can a flexible circuit be? Which technology works best with extremely long circuits, and how does a customer know which one to use? The I-Connect007 Editorial Team explores these trending topics and what it means for PCB manufacturers.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We’re heading into the holiday season, and tradeshow season is in full swing. Managing Editor Nolan Johnson and technical editor Pete Starkey have spent the week in Munich covering electronica, and apparently the attendance was wunderbar. COVID still persists, but everyone is ready to return to some normalcy. There’s a lot going on in our industry. In this week’s roundup, we have articles on everything from rigid-flex to the supply chain, as well as a primer on the role of physics in PCB design. As we move into the new year, you should check out this Top 10 list of tech trends for 2023, courtesy of Gartner.
DownStream Flexes in Rigid-Flex
During PCB West, I caught up with DownStream Technologies co-founder Joe Clark and Senior Product Marketing Manager Mark Gallant. We discussed some of their latest tool updates, including a greater focus on bringing post-processing functionality, such as inter-layer analysis capability, to rigid-flex circuits. Joe also offered a look at global design trends going into 2023, as more engineers take on PCB designer roles while senior designers are retiring.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
The industry news cycle seems to be picking up speed lately. Of course, 30 days into the quarter is about when public companies announce their results, and in the midst of this worldwide financial situation, we’ve got all eyes on anything coming out from our counterparts in the industry. I’ve noticed that global corporate results (Nan Ya PCB and TTM, in particular) do seem to be on everyone’s radar. In addition to financial news, trade shows are popping back up around the world—Europe, India, and a special report from editor Andy Shaughnessy, who took his own road trip to Raleigh, reporting on PCB Carolina, which had its own heyday this year.
PCB Carolina Breaks Attendance Record
PCB Carolina has been growing consistently for the past decade, and this year the show reached a milestone: more than 1,000 attendees. Yesterday, the show was the busiest I’ve ever seen it; I almost had to park off the NC State University campus. Fortunately, I’m an expert at “the parking lot game.” I waited until a guy was leaving and then I sniped his spot. Bam!
IPC to Unveil New Member Magazine, ‘IPC Community’ at IPC APEX EXPO 2023
IPC, in partnership with IPC Publishing Group (I-Connect007) will unveil an exciting new publication, "IPC Community," at IPC APEX EXPO 2023, as a continuation of its commitment to better serve the electronics industry and provide additional value for IPC members.
The Printed Electronics Roundtable, Part 3
We recently conducted a roundtable with a team of printed electronic circuit experts from companies that run the gamut: John Lee and Kevin Miller of Insulectro, Mike Wagner of Butler Technologies, Tom Bianchi of Eastprint, and John Voultos of Sheldahl Flexible Technologies.
In this third and final installment of the roundtable, these experts discuss some of the differences and similarities between PEC and traditional PCB processes, the future of printed electronic circuits, and why the best way to learn about this technology is through networking with veterans of this segment who are eager to share their expertise with the next generation.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Where did the year go? I can’t believe we’re planning our January and February issues now. It was 84 degrees most of last week in Atlanta, and now it’s 31. I guess I should take my Hawaiian shirts out of rotation! This week we have quite a variety of articles for you. It’s officially show time and the industry is back in business in a major way. We have some news coming out of last week’s advanced packaging event in Washington, D.C., and an article about navigating SMTA International, which opens on Halloween this year in Minneapolis. We have a great column on avoiding EMI with good routing strategies, and an article on electrically conductive inks. To top it off, I-Connect007 has published a new book, written by Matt Stevenson of Sunstone Circuits, that posits a new “design for”: Designing for Reality. If you’re a designer, isn’t designing for reality what it’s all about?
The Chip Shortage Leads to Innovation
The chip shortage is by no means over, with estimates expecting it will last into 2023. Some could see it taking even longer, such as Intel CEO Pat Gelsinger, who expects it to see shortages into 2024 due to those now impacting electronics production equipment. But if there’s any bright spot to be had, it’s that a crisis often leads to long-term solutions. In this case, it’s the increase in government funding for semiconductor production in the United States. Once the CHIPS Act proceeds, we can significantly accelerate building semiconductor fabs in the United States and work toward preventing future chip shortages that would put us back into our current situation.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s officially fall now, and in Atlanta the temperature has plummeted to the mid-80s. We’ve all bumped our air conditioners up to 74 degrees. That means it’s trade show season, and I’ve been busy looking for my suitcase. This week, we have an assortment of news about associations, education, and advocacy, as well as another installment of our Printed Electronics Roundtable. And if you’re looking for a job, you are in luck; our jobConnect007 section is chock-full of open positions at all levels in this industry.
Part 2: The Printed Electronics Roundtable
We recently held a roundtable with a team of printed electronic circuit experts from companies that run the gamut: John Lee and Kevin Miller of Insulectro, Mike Wagner of Butler Technologies, Tom Bianchi of Eastprint, and John Voultos of Sheldahl Flexible Technologies. In the first part of this roundtable, the team dispelled a variety of myths surrounding PEC. In this second part of the roundtable, the participants discuss what designers and fabricators need to know to jump into printed electronics, and some of the drivers behind this growing technology.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
“You are the average of the five people that you spend the most time with.” This saying is attributed to Jim Rohn, and I couldn’t help thinking of that quote as I put together this week’s listings. Hear me out: 1) There are five items on our list; 2) These items zoomed to the top based on reader interest; 3) Every single one of these news items has an “association” association—IPC, iNEMI, SMTA, and NextFlex are all represented in what you, dear reader, chose to explore this last week.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
The CHIPS Act continues to captivate the attention of industry insiders, as evidenced by the reader interest in our U.S. legislation coverage. When talking with all of you, we hear a wide range of opinion regarding the CHIPS Act funding, ranging from enthusiasm to cynicism—sometimes in the same conversation with the same person. You can expect ongoing coverage as news continues to unfold. Advanced packaging and the CHIPS Act are increasingly being linked together on the printed circuit side of the industry conversation. Perfect timing, then, that IPC is hosting a symposium on advanced packaging October 11-12 in Washington, D.C.
FCT: Powerful Growth in the Flex Segment
After the initial impact of the global pandemic led to a somewhat flat 2020, Carey Burkett, vice president of Flexible Circuit Technologies, explains how the company’s growth took off in 2021, positioning it well for industry trends that continue to show great promise in medical, automotive, consumer, and more. In this interview, Carey breaks down the reasons behind the company’s recent success and how R&D, and a new Zhuhai facility, have positioned them for continued growth.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week we have quite a variety of articles for you. There has been so much electronics industry news coming out of Washington, D.C., that it can be hard to keep track of what’s going on. So, Editor Michelle Te compiled a handy-dandy reference guide to recent legislation news, including our exclusive coverage. We need to keep an eye on these senators and representatives. They’ve been talking about the importance of our industry for the past year, but this is an election year, after all. They’ve been known to say one thing and do another.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
There was some good news this week, as Republicans and Democrats managed to cooperate long enough to pass the CHIPS Act. Members of the House and Senate don’t usually act until they get worried about being voted out of office, so pardon me if I’m not ready to sing “Happy Days Are Here Again” just yet. But this is still really good news; the politicians are on the record now, and we can hold them accountable.
Myths vs. Facts: The Printed Electronics Roundtable, Part 1
We recently held a roundtable with a team of printed electronic circuit experts from companies that run the gamut: John Lee and Kevin Miller of Insulectro, Mike Wagner of Butler Technologies, Tom Bianchi of Eastprint, and John Voultos of Sheldahl Flexible Technologies. In this first part of the roundtable, the participants dispel 10 common myths that have been floating around regarding printed electronic circuits (PEC). They also discuss the progress that’s been made in PEC development in just the past decade, and what the future may hold for this technology.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Our biggest news this week: I-Connect007 has been acquired by IPC. Every member of the team, including founder and Publisher Barry Matties, is included in this deal. We’ve enjoyed working closely with IPC for decades, especially at events like IPC APEX EXPO, and we have four IPC columnists writing in our magazines and newsletters. This move makes sense for both parties. It enables us to take our magazine, newsletters, and book publishing to the next level, and IPC won’t have to spend years building a media company from the ground up. It really is a win-win.
IPC Acquires Media Company I-Connect007, Strengthening Relationship to Drive Growth and Innovation in the Electronics Industry
IPC, a global electronics manufacturing industry association, has acquired media company I-Connect007, a global source for news and original content serving the printed circuit design, fabrication and assembly/EMS markets.
The Importance of Rigid-Flex PCB Design Guidelines
I have the tendency to try to replicate the delicacies I’ve ordered at restaurants in my own kitchen. One of my latest attempts at creating restaurant-worthy dishes was a Korean pancake that’s crispy on the outside but soft on the inside. With my amateur cooking skills, it proved to be an impossible task—I could either make only a hard pancake or one that was total fluff. While I’m still struggling to figure out the trick to bringing together the different textures of a Korean pancake, I’ve had more success in bringing together the hardboard elements and flexible PCB elements of a rigid-flex PCB. Compared to making Korean pancakes, striking the right balance of flexibility and rigidity on a rigid-flex PCB is easy if you abide by rigid-flex PCB design guidelines.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
I’m getting a lot of out-of-office replies. Are you all on the beach now? It’s 91 degrees every day here in Atlanta lately, but each afternoon it rains like we’re in a horror movie, and that drops the temperature down to the subtropical arena. Still, I’ll take heat over freezing any day. Things are heating up in our industry too, as we see from my top five choices this week. First-quarter electronic design revenue is up year-on-year, but PCB revenue barely moved the needle YOY. Editor Nolan Johnson spent the week at SEMICON West and the FLEX Conference, and he brings us a review of these conferences, co-located at the Moscone Center in San Francisco. As he notes, printed electronic circuits are beginning to gain a foothold in the market.
FLEX Conference 2022: If You Build It, We Will Buy It
Key presentations from companies like Boeing highlight FLEX Conference and Exhibition 2022, held in concert with the annual SEMICON West show this week in San Francisco’s Moscone Center. SEMICON West claims to be “North America’s premier microelectronics exhibition and conference,” uniting players across the entire electronics manufacturing and design supply chain.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
In more than one conversation while discussing the industry this week, the themes have included industry turmoil, lots of business opportunities, and the urgent need to build out to meet changing demands. In fact, our July issue of PCB007 Magazine, which publishes later this month, will focus on these very topics. It’s definitely one not to be missed!
These themes also emerged in this week’s top five news items as well. Top stories include an acquisition in the soldering machinery space, sales and service expansion in Mexico, industry data from SIA on semiconductor global sales data, and strong financial numbers from two China-based manufacturers. Now, with the U.S. Congress putting its focus on the PCB industry, things could really heat up. It’s going to be an interesting year.
EIPC Summer Conference 2022: Day 2 Review
Örebro, Sweden on June 15 brought a bright and early start to Day 2 of the EIPC Summer Conference for those who had enjoyed the previous evening’s networking dinner, but had resisted the temptation to over-indulge or to carry on their long-awaited catch-up conversations with old friends into the small hours. All but a few were in their seats for 9 a.m., awake and attentive for Session 4 of the conference, on the theme of new process technologies, moderated by Martyn Gaudion, CEO of Polar Instruments.
EIPC Summer Conference 2022: Day 1 Review
At last, a live EIPC conference and this time in the Swedish city of Örebro, “where history and contemporary culture converge,” a pleasant and convenient location for an event that included a privileged visit to the Ericsson facility in Kumla. Around 100 delegates made the journey and the Örebro Scandic Grand Hotel was an excellent conference venue for the June 14-15 conference.
Ventec’s Book on Thermal Management: The Summer Sequel You’ve Been Waiting For
I-Connect007 is excited to announce the release of the second title in Ventec’s series on thermal management, "The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates, Volume 2." This second volume covers the latest developments in the field of thermal management, particularly in insulated metal substrates, using state-of-the-art products as examples, and focusing on specific solutions and enhanced properties of IMS.
Review: Institute of Circuit Technology 2022 Annual Symposium
The British Motor Museum in Warwickshire, housing the world's largest collection of historic British cars, was venue for the 2022 Annual Symposium of the Institute of Circuit Technology on June 8, which attracted a substantial gathering of manufacturers and suppliers from the UK printed circuit industry. ICT chair Emma Hudson reflected upon lessons learned during the pandemic lock-down and how the industry has successfully adapted to circumstances. She commented that the UK’s PCB fabricators are extremely busy, as she introduced an outstanding conference programme including a keynote from the incomparable Happy Holden.
PCB Technologies' Subsidiary iNPACK to Exhibit at IMS Show
Jeff De Serrano, president of PCB Technologies USA, discusses the launch of their new company, iNPACK, which focuses on high-tech substrate technologies, microelectronics assembly, and electronics packaging. He details his plans to continue expanding InPack over the next year and to meet with customers and exhibit at the International Microwave Symposium Show in Denver June 19-24.
A Definitive Review of New Expert Guide to High-Performance Materials
I am always surprised when a colleague produces a statement about PCB laminates that seems incorrect or out of date. This need not happen today as the specialists at Isola have written an excellent book about high performance materials, now available for download from I-Connect007. Author Michael Gay, a 25-year veteran of laminate manufacturing, meticulously guides readers through the most pertinent questions regarding rigid laminates. This is essential information for everyone, including the experts, because the materials and applications for laminates in printed circuits are constantly changing.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s been a crazy week, with lots of bad news coming out of Ukraine. (I’m a news junkie by trade, but I confess that some days I just unplug from the news completely to avoid overdosing on negativity.) And, as you might have guessed, this is all having ill effects on our electronics supply chain, which is already stretched thin. This is reflected in our IPC news item that shows an uptick in PCB sales in February, but a drop in bookings YOY, in part due to the trouble in Eastern Europe. But there’s positive news in this week’s top reads. We have a NextFlex article about an innovative flexible technology called flexible hybrid electronics (FHE) and a great interview by Dan Beaulieu. We also have a column by Travis Kelly, who discusses PCBAA’s efforts to lobby for American manufacturing in Washington. And last but not least, let’s welcome our two newest columnists, Paige Fiet and Hannah Nelson, who discuss their excitement about entering this industry.
Flexible Hybrid Electronics Design: Reducing Time to Market
Emerging innovations in the flexible hybrid electronics (FHE) domain are enabling new applications across multiple industries due to their highly flexible structures and additive manufacturing processes. The smaller form factor, lighter weight, and conformal capabilities are ideal for IoT edge devices in health and fitness monitoring, military asset identification and tracking, automotive displays and sensors, aerospace radar, and soft robotics. Significant industry research led by NextFlex is optimizing the processes from design through manufacture for FHE products.
Institute of Circuit Technology: A Novel Approach to Recycling PCBs
A two-year project funded by an Innovate UK SMART Grant aims to reduce the impact of e-waste using naturally derived, biodegradable and nontoxic products. Those attending the webinar for the Institute of Circuit Technology’s annual meeting on March 2 learned more about the project, as well as statutory paperwork obligations of the UK REACH regulations. Following the formal business, ICT Chair Emma Hudson introduced and moderated this technical webinar.
Finally! A Book About PCB Stackups
‘The Printed Circuit Designer’s Guide to… Stackups: The Design within the Design’ is the latest addition to I-Connect007’s comprehensive, educational library. In this book, brought to readers by Siemens Digital Industries Software and I-007eBooks, author and stackups expert Bill Hargin discusses materials, laminate datasheets, impedance planning, and more. This book provides the reader with a broader understanding of stackup planning and material selection in an effort to comprehend what Hargin calls “the design within the design.”
Real Time with… IPC APEX EXPO 2022: Rigid-Flex Specialists
As flexible circuit specialists growing their world-wide business, Flexible Circuit Technologies is planning to expand its workforce. Chris Clark, senior applications engineer, discusses the company’s 25% growth in the last year, as well as its new plant in Zhuhai, China, which will focus on rigid-flex circuitry. Chris just joined the company in the past year, but he has spent 31 years in the industry wearing whatever hat was required, and he lays out the company’s plans for the next year.
Kris Moyer Discusses New IPC Design Role
The I-Connect007 Editorial Team spoke with Kris Moyer, a longtime PCB designer who has just joined IPC’s Education Foundation. Kris was one of the judges and creators of the IPC Design competition that culminated at IPC APEX EXPO, and he was eager to discuss his new job and the cutting-edge technology he’s seen lately, including additive, flex, and rigid-flex circuits. I-Connect007 is your source for coverage of IPC APEX EXPO 2022.
Real Time with… IPC APEX EXPO 2022: High-Tech Rigid-Flex Boards and More
Jeff De Serrano, president of PCB Technologies for North America, and Editor Andy Shaughnessy discuss Jeff’s current quest to acquire a PCB fabrication facility. Just six months into his new position at PCB Technologies, Jeff explains his plans for the next few years, including the company’s focus on rigid-flex boards and their plans to invest heavily into high-tech substrates and microelectronics assembly.
Real Time with... IPC APEX EXPO: PCB Manufacturing Today
Dick Crowe speaks with Kurt Palmer, president of Burkle North America, about the trends he sees in PCB manufacturing today. From LDI to laser drills, they discuss a wide range of concerns and opportunities. If you didn't make it to IPC APEX EXPO, don't worry. We're bringing you coverage of the week's events, from ribbon cutting to teardown.
Testing Flexible Circuit Assemblies
I recently spoke with Bert Horner of the Test Connection Inc., about the current state of flex and rigid-flex assembly testing. He explained some of the differences between testing flex and rigid PCBs, the requirements for testing specialties such as high-voltage flex, and the added demands of handling flexible circuits.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
If you’re in the United States like I am, and if you celebrated with a traditional Thanksgiving dinner, like my family did, then you just might have fallen asleep sitting up in a chair (or in my case, stretched out on the couch) and missed some of the highlights in the news this week. Never fear, I woke up early to bring the top five news items you should know for this week. We have industry bookings and sales news from IPC, some news from the flex sector, an explanation of induction lamination from Happy Holden, and two different takes on “sustainability.”
Happy Thanksgiving From the I-Connect007 Team
In the United States, the Thanksgiving holiday is a celebration of gratitude and appreciation for the harvest and for the people close to us. Thankfulness, however, transcends just one day of official observance. The fourth Thursday of November is when the U.S. officially celebrates Thanksgiving Day and as we take time to observe this holiday, the I-Connect007 team wishes to offer our thanks to you, our global readers and contributors: designers, fabricators, engineers, assemblers, quality and process control gurus, chemists, physicists, supervisors, managers, entrepreneurs, business owners, standards writers, industry experts, and more. You breathe life into the vital, thriving, world-changing electronics industry. You are the real story.
All Flex Discusses Merger and New Medical Applications
I recently spoke with Jamin Taylor, vice president of sales and marketing at All Flex Flexible Circuits in Minnesota. We discussed the company’s recent merger with Printed Circuits Inc., and some creative new flex applications, including flexible heaters and catheters for the medical field. As Jamin explains, "It’s always interesting to see different technologies amongst different companies. We’re working on a few new applications and products, like being able to do some fine lines and flex materials, but with large format, a longer format than usual. Some of their capabilities with lasering and fine features really help with our long flex capability; when we merge the two, we see a new market being created for that technology."
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This month—and this year, really—has just flown by. As someone mentioned to me recently, “There are basically only three full work weeks before New Year’s Day.” Yikes. Thanksgiving is next week, which means most of your customers and suppliers will be hard to reach. Unless there’s a problem, that is! In that case, they’ll find you, even if you’re carving a turkey with the kids and grandkids. So, with a short week on the horizon, most of us are in overdrive now, trying to get ahead of the game.
Honoring Those Who Served
On this Veteran’s Day holiday, the I-Connect007 staff takes a moment to honor those men and women over the years, who served to protect and defend their country. Just on the I-Connect007 staff, we have loved ones who served, ranging from World War I to present-day active-duty military. The holiday isn’t intended to be a political statement, but rather a reflection on service, duty, and personal sacrifice. In some cases, the ultimate sacrifice. Our staff has submitted images of veterans who are near and dear to their hearts. Check them out!
Taiyo Discusses New Inkjet Technology and Solder Mask for Flex
At PCB West, Nolan Johnson spoke with Brian Wojtkiewicz of Taiyo about some of the company’s new inkjet technology, which will be manufactured in the U.S. Brian also discusses a new solder mask that has been developed especially for the flexible circuit segment of the industry. "They basically want to keep all the same specifications with regular solder mask, so we’re trying to keep all of that: the printability of it and how it looks. We’re getting a lot more interest on the colors. They just don’t want green anymore. They want it to be standard blue, reds, and whites and stuff like that."
I-Connect007 Editor's Choice: Five Must-Reads for the Week
It’s merger mania! Yes, there’s been a lot of M&A activity lately in our industry over the past few months. This week was no different when it comes to merger activities. In this week’s selections, we have news about DuPont’s acquisition of Rogers, Nano Dimension’s merger with Essemtec, and NCAB’s acquisition of Elmatica. We also have news from SMTA International, and an interview with Joe Clark of DownStream Technologies about their new flex and rigid-flex technology.
Averatek Moves Ahead With A-SAP™, ASAP
During DesignCon, the I-Connect007 Editorial Team spoke with Mike Vinson and Paul Dennig of Averatek. They discussed the company’s latest advances in air cavities and semi-additive processes, and what this new technology will mean to the industry, especially PCB designers. Vinson said, "Over the next 12 months, I think you’ll see more involvement from a number of areas—everything from sensors to the actual printed circuit boards themselves and miniaturization. This technology can enable the more advanced packages and the smaller components to be used on the printed circuit board without a great deal of expensive modification."
DownStream Adding More Flex, Rigid-Flex Functionality
I recently spoke with Joe Clark, one of the co-founders for DownStream Technologies. We discussed the company’s latest software release, which adds more flex and rigid-flex capabilities, as well as updates to the scripting in DownStream’s tools.As Joe explained, "With our current release of software, we focused in on rigid-flex designs, which is becoming a common design challenge for our customers. We’ve implemented support for rigid-flex embedded components going to the next level now, and we’re working with some large companies to define the design for manufacturing checks that would be necessary for verifying these advanced designs. So that’s coming in our DFM release that will be out later this year."
Real Time With... SMTAI: Anaya Vardya of American Standard Circuits
Anaya Vardya, president and CEO at American Standard Circuits, speaks with Nolan Johnson ahead of the SMTA International exposition. Vardya shares why American Standard Circuits will be exhibiting at the show, and outlines the topics ASC will be presenting on the show floor.
I-Connect007 Editor's Choice: Five Must-Reads for the Week
Once again, seemingly like clockwork, the controversy erupts. It’s such a divisive issue, and it seems no one can be undecided in this debate; each of us is expected to take a stand. All of society—including the media—asks, “Which side are you on?”
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
The kids and grandkids are back in school, and fall is on the way. During this busy week, we published a variety of articles, covering everything from trade shows to mergers. It’s hard to argue with IPC’s plans to require proof of vaccine or a negative COVID test to enter IPC APEX EXPO; you can expect other trade shows to follow suit in the future. We’d hate for a show to become a super-spreader event.
Siemens Webinar: Rigid-Flex Design Without Respins
Rigid-flex circuits have become almost ubiquitous over the past decade; most personal electronic devices contain at least one rigid-flex circuit. But there’s a downside to rigid-flex: Respins are almost a given with rigid-flex designs. And rigid-flex respins can be quite expensive, since this technology costs quite a bit more, on average, than flex or rigid boards.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Trade show season is around the corner, and we’re talking about real, in-person trade shows. The virtual shows served their purpose, and we may see more virtual shows in tandem with live events, but I’ll be glad to get back on the show floor and see what’s “really” going on out there. It's great to see IPC’s hand soldering competitions returning to Europe this fall.
Averatek Pushing Boundaries of Additive and Semi-Additive Processes
At the IEEE International Microwave Symposium show in Atlanta, I met with Tara Dunn, I-Connect007 columnist and VP of marketing and business development for Averatek. We sat down at the show and discussed the past year and a half, and after joking about how we felt like we were on an episode of The Twilight Zone, Tara gave me an update on Averatek’s continuing research into additive and semi-additive technologies.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This may be a global industry, but the effect is very real: holidays in the U.S. will drive the industry news cycle. In fact, I can even (unscientifically) rank the major U.S. holidays by their silencing effect on the news. Christmas leads the way, of course, followed by New Year’s, Thanksgiving, Independence Day, Memorial Day, and Labor Day. Here's a wrap-up of the biggest stories of the past week, starting before Independence Day weekend.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Optimism is on the rise. This week, we saw signs of increased confidence in the PCB industry, but this was tempered by the realities of supply chain issues and 50-week lead times for some components. We saw some M&A activity and a bit of really interesting news from Stanford University about flex. Cherie Litson brought us a story of her life in PCB design, against a backdrop of Star Trek. IPC also announced an introductory PCB design class. Isn’t it nice to have new designers again?
Catching up With Siber Circuits
Siber Circuits is a Canada-based PCB fabricator doing most of its business in the U.S. and often with defense contractors, proving against the odds that it can be done. I spoke with the owner and president, Simon Etherington, about his company and why his long-time customers love working with them.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Finally, it’s May. The snow has melted, the flowers are beginning to bloom, and summer is just around the corner. We’re slowly getting back to normal after the craziest year I can remember. And our industry is on the move! This week, we bring you a veritable seafood platter of articles and columns about PCB design, fabrication, and assembly.
Arlon President Discusses Acquisition by EMC
Arlon President Brad Foster updates Nolan Johnson on EMC’s acquisition of Arlon in December 2020. Foster shares the basic structure of the agreement, the long-term stability built into the merger, and outlines how this brings EMC, Arlon and Technica together as a team. Foster also hints at what we can expect to see from Arlon and EMC in the coming months.
IPC-2581 Revision C: Complete Build Intent for Rigid-Flex
With the current design transfer formats, rigid-flex designers face a hand-off conundrum. You know the situation: My rigid-flex design is done so now it is time to get this built and into the product. Reviewing the documentation reveals that there are tables to define the different stackup definitions used in the design. The cross-references for the different zones to areas of the design are all there, I think. The last time a zone definition was missed, we caused a costly mistake.
I-Connect007 'Just Ask' Q&A Compilation Available Now
Throughout 2020, we asked you to send us your questions for Happy Holden, John Mitchell, Joe Fjelstad, Tara Dunn, and Heidi Barnes. You all had plenty of questions for these industry experts. The following is a handy compilation of your questions and their answers.
With Flex, Sometimes You Gotta Break the Rules
Sometimes in life, we need to break the rules. For example, in junior high I had a curfew but to have my first kiss, I had to break curfew. I got grounded, but it was worth it! My last article was about reasons to follow IPC design and inspection rules. This time, we are discussing instances where, due to complex requirements, customers are not always able to follow the rules. I will also discuss some design options that will hopefully keep you from “getting grounded.”
Rooting Out an 'Us vs. Them' Mentality: An Interview with Laura Kriska
Earlier this year, I-Connect007 columnist Dan Beaulieu submitted a book review on "The Business of WE: The Proven Three-Step Process for Closing the Gap Between Us and Them in Your Workplace." As a follow up to that review, Dan has interviewed the book's author, Laura Kriska.
After Decades of E-Textiles Work, a Rising Star Award
After decades of work in my field, I was awarded the Rising Star award during IPC APEX EXPO 2021. I would like to thank my research team, all the colleagues from the D-75A-EU E-Textiles Wearables Standard Task Group in Europe, Chris Jorgensen from IPC, and Sigrid Rotzler, the Task Group vice-chair. Last but not least, I would like to express my thanks to IPC CEO John Mitchell for this award.
I-Connect007 Video: A Salute to The Industry
I-Connect007 has produced this new one-minute video to acknowledge nearly 35 years of sharing your stories. In 1987 we launched our first industry publication and we have been dedicated to covering this industry ever since. We did not start out as publishers: in fact, our background was in printed circuit board fabrication. In 1987 there were still nearly 3,000 PCB shops in North America. At the time, profits were goods, trade events included giant industry parties (remember the extravagant hospitality suites in Anaheim?), and the industry was in a state of change.
