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Setting the Record Straight: CEO Asher Levy on the Future of Orbotech

With the recent planned acquisition of Orbotech in place by maker KLA-Tencor, much of the industry has speculated about Orbotech’s future. Barry Matties spoke with CEO Asher Levy about what lies in store for the Orbotech group and, more specifically, their PCB division should the deal close.

GreenSource: Good for the Industry, Good for the World

Whelen Engineering has recently spun off their new printed circuit manufacturing facility to service the merchant market as a new business entity, GreenSource Fabrication LLC.

Succeeding at the Velocity of Technology: An IPC APEX EXPO 2018 Wrap-Up

After many months of planning, IPC APEX EXPO 2018 proved to be a success. From revolutionary advancements displayed on the show floor to expert insights conveyed in technical conference sessions and professional development courses, IPC APEX EXPO provided the learning and connections that helped 4,574 attendees from 43 countries prepare for the future.

Catching up with Dan Thau of Millennium Circuits Limited

Millennium Circuits Limited is one of the fastest growing printed circuit board suppliers in our country today. Located in Harrisburg, Pennsylvania, this company has grown exponentially since it began some 12 years ago.

Conversations on the Floor: IPC APEX EXPO 2018

This year’s show was one of the best in recent history, both in attendance and enthusiasm. The exhibit floor was sold out, and every single person I talked to was extremely optimistic about business in 2018. What follows are a series of observations and excerpts from conversations I had with some of the most interesting people I met.

The Vast Offerings in Laminate Technologies from TUC

While at IPC APEX EXPO a few weeks ago, I sat down with George Hsin, chief strategy officer for TUC Worldwide, and Alan Cochrane, president of TUC North America. I was interested in learning more about the company and their laminate products and Alan was happy to fill me in.

From Math to Marketing: Orbotech CMO’s Worldview of the Industry

Barry Matties met with Orbotech’s corporate VP of Business Development and CMO, Lior Maayan, in Shenzhen and spoke about the next-generation processes currently challenging Orbotech's R&D team. Most notable among them are additive technologies like the automated optical shaping solution, and the growth of MSAP, flex, and HDI.

A Discussion About Everything Under the Sun

From flex circuits to HDI, Industry 4.0, leading market drivers, and materials—this wide-ranging discussion with Sunshine Global Circuits CTO David Aldape highlights the latest and future developments, challenges, and opportunities in the PCB manufacturing industry.

ESI Targets Growing HDI Space

At the recent HKPCA and IPC Show 2017 in Shenzhen, China, Chris Ryder, director of product management for HDI at Electro Scientific Industries Inc. (ESI), discusses how laser-based processing is addressing the challenges in HDI development, and MSAP technology and its impact on the PCB industry.

What Happens to Our Industry Without a Skilled Workforce?

I’d like to discuss a critical issue facing our industry – the skills gap – and IPC’s commitment to supporting its members as we collectively seek to find solutions.


Weiner’s World—March 2018

SEMICON China 2018 was amazing in its size and attendance. More than 1,000 exhibitors filled an event record of more than 74,000 square meters of exhibition space—the size of nearly 10 professional soccer fields. This year's theme was "collect, collaborate, innovate."

RTW IPC APEX EXPO: Arlon Achieves IPC Validation Services Accreditation

John Wright, quality manager at Arlon Electronic Materials, discusses how the company recently achieved IPC validation services accreditation.

RTW IPC APEX EXPO: IPC Solutions Program—Transportation and Workforce Development Initiatives

Sanjay Huprikar, IPC's VP of solutions, discusses the IPC solutions program, including transportation and workforce development initiatives.

RTW IPC APEX EXPO: Miraco Company and Services Introduction

Miraco's current quality manager, William Pfingston, fills Guest Editor Steve Williams in on the company's contract manufacturing capabilities and services, including strengths in design and flex circuits. He also talks about the company's expansion and organizational changes.

RTW IPC APEX EXPO: Rogers' High-Frequency/High-Temp Substrates

Tony Mattingly, senior product manager at Rogers Corporation, discusses the company's new substrates for high-frequency/high-temperature applications.

RTW IPC APEX EXPO: Insulectro Discusses Importance of Helping PCB Shops

Chris Hunrath, VP of technology at Insulectro, discusses their recent expansion of inventory, especially substrate materials, the need for quick access, and the importance of working closely with their customers and OEMs.

RTW IPC APEX EXPO: Catching Up with Cirexx International

Philipp Menges, president of Cirexx International, discusses yearly company updates and growing markets, including automotive, medical, and military.

RTW IPC APEX EXPO: IPC—Industry Trends Moving Forward

Sharon Starr, director of market research for the IPC, discusses industry trends moving forward covering both EMS and PCB. She also mentions the upcoming studies IPC will be conducting in 2018.

Three New Mars2020 Rover Technologies: What Powers the “Body Parts” on the Mars2020 Rover?

The Mars2020 Rover Mission, designed by JPL, is the next NASA Mars Exploration Program mission that is planned to launch in 2020. Some goals of the mission include to check for past signs of life, to help prepare for manned Mars missions, and to collect soil samples and cache them on the surface for potential return to Earth by a future mission.

Bridging Knowledge and Understanding of Thermal Management Materials

At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.


A Plug-in that Connects CAD Software to 3D Printer

Nano Dimension's DragonFly 2020 Pro 3D Printer is a highly accurate and versatile inkjet deposition and curing system for printing professional multilayer circuit boards, structural electronics and antennas. In a sweeping discussion with Nano Dimension USA President Simon Fried, all my questions were answered about this innovative technology.

RTW IPC APEX EXPO: Prototron Moves Offshore

Prototron's Dave Ryder and Russ Adams discuss the company's recent decision to begin manufacturing high-volume jobs overseas. They also discuss some of the partner shops' capabilities, including flex and rigid-flex, which were driven by customer demand.

RTW IPC APEX EXPO: Insulectro Showcases New Low-Loss Materials

Norm Berry, director of laminates and OEM marketing for Insulectro, discusses the company's new low-loss products and resin systems that benefit high-speed, high-frequency PCB designs.

New Year, New Equipment—Right?

This month, we will discuss the equipment purchasing decision-making process. How many of you can recall the earliest “dippy dunk” PCB shops, so-called because that’s exactly how it was done? There were no conveyorized lines, no automatic hoists, no load/unload stations, maybe not even a lab for analyzing the plating baths.

Part 2: EIPC’s Winter Conference in Lyon, France: Day 2 Review

The final session, on European needs for new technology, product safety and training, was introduced and moderated by EIPC board member Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group.

EIPC’s Winter Conference in Lyon, France: Day 2 Review

The first day of the conference had started and ended in the dark—a long and technically intense day! After a convivial conference dinner and a good night’s sleep we were back on the bus, this time in daylight at the slightly later time of 8:00 a.m., for the journey from downtown Lyon back to Alstom’s conference facility in Villeurbanne, and it wasn’t raining. In fact, there was even some sunshine later in the day!

Part 2: EIPC’s 2018 Winter Conference in Lyon, Review of Day 1

We continue with the rest of Pete Starkey’s report on Day 1 of the EIPC Winter Conference in Lyon, France. Included in this segment are presentations by Ventec, Ericsson, TTM and others, plus photos of their evening tour of Alstom.

Start Your IPC APEX EXPO Show Experience Here

As many prepare to travel to California from February 24 to March 1, IPC APEX EXPO 2018 will offer a collection of exciting events for both newcomers and industry veterans, including educational opportunities and showcase exhibitions. Want a sneak peek into the upcoming events at IPC APEX EXPO 2018? This exclusive pre-show coverage publication from I-Connect007 is all about San Diego or bust!

Orbotech’s Strategic Decision for End-to-End Partnership Benefits Everyone

Barry Matties met with Sharon Cohen, president of Orbotech West, at productronica 2017 to discuss what’s new at Orbotech, specifically their shift to be more customer-centric and to provide regional coverage across the globe. He also discusses the current trends in the marketplace and Industry 4.0.

EIPC’s 2018 Winter Conference in Lyon, Review of Day 1

Venue for the 2018 EIPC Winter Conference was the splendid new Alstom Transport Information Solutions facility in Villeurbanne, in the Lyon metropolitan area of the Auvergne-Rhône-Alpes region in eastern France. An extremely popular event—117 delegates represented a total of 20 countries, unprecedented in recent years, and only just fitted into Alstom’s conference suite. Indeed, some were even standing at the back!


IPC APEX EXPO: App is Where It’s At

In an interview with I-Connect007, IPC Exhibits Manager Kim DiCianni discusses the IPC APEX EXPO 2018 app and how this powerful tool will keep attendees on track. She also highlights its usefulness for exhibitors.

The Best It’s Ever Been, Every Year: The Goal for IPC, Part 1

The end of 2017 caps an exciting time for IPC and IPC China as membership has grown substantially, in part because of new offerings from the organization to its Asian members. Meeting with Barry Matties at HKPCA, John Mitchell and Phil Carmichael discuss the areas of focus for IPC in the upcoming year, first and foremost being education and welcoming a new generation into the industry.

Staying Ahead of Market Trends Through Education

ESI equipment has been in high demand with the recent rise of flex and HDI. But when Barry Matties met with Patrick Riechel and John Williams at HKPCA, they explained that it is really ESI’s future protection and flexibility in the process that keeps them ahead of the market and allows for ongoing success.

Cicor’s Approach to Miniaturization: Cost of Function, and More

Barry Matties spoke with Karl Heinz-Fritz, VP of technology, about Cicor’s newest product line, which can shrink the size of a circuit by up to 40%, and the importance of measuring the cost of functionality.

In Terms of Experience, a 10,000-foot View of China

In the past 30+ years of PCB manufacturing in China, you would be hard-pressed to find someone more connected to the pulse of the Asian market than Gene Weiner. Barry Matties met with the industry veteran at HKPCA to get his take on the show, the current and future market conditions of China, and any effect the new U.S. administration might have on trade relations going forward.

CES 2018, Augmented Reality and Much More

The actual CES show is spread across many locations in Las Vegas. The main exhibit halls are at or near to the Las Vegas Convention Center with three buildings, two floors each, all filled with hundreds of booths. Then there is The Sands Convention Center with multiple halls filled to the brim and hotels with their own convention centers and floors of exhibitor suites. With almost 200,000 in attendance, all locations are very busy.

Getting the Heat Out

Increasing consumer demands for high performance and the need for high reliability in sectors such as automotive, LED lighting, and renewable energy mean that thermal management is now front and center on the priority list for PCB manufacturing.

CES 2018 Showstoppers: LaunchIt and Press Event

“ShowStoppers LaunchIt is about giving innovative entrepreneurs a shot at getting the attention of angel investors on the lookout for innovation and new ventures. It’s also about gaining additional visibility with other industry influencers and dealmakers, as well as with the press who are always looking for the ‘what’s new’ story at CES.”

Preview: CES 2018 Unveiled

The official CES events started only about 15 hours ago. I have already been to CES Unveiled, an amazing (but somewhat long) NVIDIA press event, and now the Panasonic press conference is soon to begin, launching the Press Day activities. So far, it’s been amazing!

Weiner’s World—December 2017

Hold on to your seats! 2018 will be a year full of rapid changes, surprises, and growth. M&A activities will flourish. The supply chain will suffer shortages and changes as demand increases, copycats will rush to market, and new markets and potential suppliers will vanish before they are established.


Automation and Traceability Critical for High-Throughput Probe Testing

Peter Brandt, atg’s director of sales for Europe, India and Japan, joined Barry Matties at productronica to share his views on regional variations in electrical testing requirements, automation, traceability, and how to anticipate and satisfy the future demands of the market. Group general manager Dr. Jochen Kleinertz also comments on the need for close cooperation with customers to guide the R&D effort.

Institute of Circuit Technology Harrogate Seminar 2017

A return to the historic spa town of Harrogate in Yorkshire, England for the Institute of Circuit Technology Northern Seminar, to enjoy a diverse programme of presentations on safety standards, research in selective metal deposition, and developments in imaging and inspection techniques.

RTW HKPCA & IPC Show 2017: IPC Asia’s Philip Carmichael on the Changes in PCB Value Chain

During the 2017 International Printed Circuit & APEX South China Fair (HKPCA & IPC Show 2017) in Shenzhen, IPC Asia President Philip S. Carmichael speaks with I-Connect007 Managing Editor Stephen Las Marias about the move in the value chain that’s driving the electronics manufacturing industry forward.

HDI: Today, Tomorrow and the Future

For the November issue of The PCB Magazine, our editorial team interviewed some of the top HDI experts in the PCB supply chain. Joining us on the conference call were Steve Bird, PCB/flex technology manager at Finisar, and Tony Torres of APCT.

HDI: Born in the USA and Making a Comeback

There is no denying that high-density interconnect (HDI) has been around a long time—over 25 years, believe it or not. From almost the moment of its conception in the U.S., the technology was adopted by and used almost exclusively in Asia.

Video from productronica 2017: DIS Improves Registration of Flex and Rigid-Flex PCBs

From the show floor at productronica 2017, we stopped by the DIS booth for a conversation with Tony Faraci. Here, he explains how DIS has tackled the challenges of handling and alignment of flex-rigid multilayer builds (especially cut-out pre-preg layers and packing pieces) and automated what was previously an operator-dependent manual process.

Video from productronica 2017: Rogers Discusses Trends Driving Growth

Dirk Lefelon, European sales manager for Rogers Corporation, discusses his group’s final 2017 results. He also explains what the new year will bring, including increased investment in capacity for the European market, especially for the automotive segment.

Happy Holden and Charles Pfeil Discuss the Past and Future of PCB Design, Part 1

When it comes to the PCB design community and the challenges facing it, as well as where design has been and where it’s heading, there aren’t many people as qualified to speak on the topic as long-time industry veterans Happy Holden and Charles Pfeil. Joined by I-Connect007’s Barry Matties at the recent AltiumLive 2017 event in San Diego, the three sat down for a discussion about the current state of PCB design, what the future holds, and what it means to be a designer.

New I-Connect007 Team Members Tour American Standard Circuits

Recently, Anaya Vardya, CEO of American Standard Circuits, invited two of I-Connect007’s newest team members, IT coordinator Jonathan Zinski and Editor Kiersten Rohde, to tour his facility in West Chicago, Illinois. Happy Holden, resident PCB expert, also joined the newbies on their field trip to ASC. In the following articles, Jonathan and Kiersten describe their experience touring ASC. Special thanks to Anaya for hosting the I-Connect007 team.

Catching up with…Brigitflex

Today, Brigitflex is building unique custom-made boards for companies all over the world, from large defense and aerospace companies to small incubator companies inventing new products. They have become well-known as the shop to go to when nobody else can solve your problems.


Final Finishes: Taking Gold Thickness into Account

Martin Bunce was one of several people from MacDermid Enthone who presented at SMTA International this year. He sat down with me for a chat about his paper on final finishes, particularly with regard to controlling gold thickness.

A Guide to IPC Survey and Report Season

IPC Director of Market Research Sharon Starr found time to discuss the recently conducted and published surveys and research reports and a few others still in the works. These reports are free to survey participants, which is certainly a great incentive for taking the time to complete them. (Hint: That’s a call to action for those of you sitting on the sidelines.)

HDI’s Beneficial Influence on High-Frequency Signal Integrity

The increasingly widespread use of finepitch ball-grid array (BGA), chip scale packaging (CSP), and other evolving technology form-factors means that new fabrication techniques must be used to create printed circuit boards (PCBs).

Strategies for Developing Copper Plating Systems

I-Connect007's Patty Goldman met with Dr. Albert Angstenberger, global technology manager for metallization with MacDermid Enthone Electronics Solutions, while at SMTA International. He presented a most interesting paper on copper pillar plating systems that we hope to publish in The PCB Magazine sometime in the future.

IPC Status Update: Training, Standards, and More!

At the recent IPC Fall committee meetings that are co-located with the SMTA International conference and show, IPC’s president and CEO, John Mitchell, sat down for a chat with me for an update on what’s happening at IPC.

Update on IPC’s Validation Services and Hints of What’s to Come

SMTA International is the perfect time to get updates on IPC happenings. One that I’m always curious about is the Validation Services programs. At the busy show, I managed to find a quiet spot so Randy Cherry, IPC’s director of Validation Services, could fill me in on the latest.

Patty's Perspective: (Signal) Integrity for All

Our topic this month is signal integrity, certainly a common one in our industry. Signal integrity is achieved by controlling impedance, so my advice is to do that. There, I’m done. Just kidding…of course I’m not done. But if you are in PCB manufacturing and you think this is just a design problem and doesn’t concern you, please think again.

3D Printed Electronics for Printed Circuit Structures

Printed electronics is a familiar term that is taking on more meaning as the technology matures. Flexible electronics is sometimes referred to as a subset of this and the printing approach is one of the enabling factors for roll-to-roll processes.

Institute of Circuit Technology Hayling Island Seminar 2017

This year’s event had a well-chosen and varied programme featuring presentations on process chemistry and R&D consortia, a discussion of controversial standards proposals and a review of the experiences of commissioning new technology in a start-up factory.

RTW SMTAI: Prototron Continues its Growth

Dave Ryder and Russ Adams of Prototron Circuits discuss the firm's 30th anniversary and their continued growth. Prototron recently hired several new staff members, and the company still has one open position to fill.


The State-of-the-Art in PCB Pre-production Engineering

If there’s one benefit of old age, it’s being able to remember the introduction to our industry of technologies that may be taken for granted by the present generation, but were revolutionary at the time. I can recall the history of Ucamco as far back as the late 1980s when, as one of the very early adopters of the DISC laser plotter and its associated electronic PCB front-end tooling system, our company gained entry to a spectacular new world of pre-production engineering capability.

Ventec Shares Their Insights on the Laminate Market, Part II

The discussion on laminates and markets with Ventec’s Mark Goodwin continues as he talks about the importance of service, where Ventec is headed, and offers some advice on partnering with your supplier.

Weiner’s World—August 2017

IPC is planning to hold a special meeting on automotive electronics for senior executives during IPC APEX EXPO 2019. The meeting will be planned and produced by the IPC Ambassador Council. Its presentations will feature senior members of the entire automotive electronics supply chain.

Laser Patterning & Metallization to Reduce Process Steps for PCB Manufacturing

This paper details a new methodology for the plating of conductive features onto glass dielectrics. A laser is used to ablate material from a glass substrate in the desired pattern, and copper is “seeded” into these features using laser-induced forward transfer of a copper foil.

Patty's Perspective: How do You Define Process Step Elimination and Automation?

This month, we can call our theme PSE&A—a fancy acronym for process step elimination and automation. Sounds straightforward, but what exactly do we mean by “process step elimination?” Does it refer to shortening the numerous steps involved in making a printed circuit board? There sure are a lot of them, but they all must be necessary—or why would we have them?

IMPACT Interview: Fern Abrams, IPC

At the recent IMPACT Washington D.C. 2017 event, I-Connect007's Patty Goldman speaks with IPC's Fern Abrams to get the inside story on the meeting with EPA.

Victory Giant Technology: The Qualified Forerunner of PCB Smart Factories

The topic of the July issue of PCB007’s China Online Magazine is “Automatic PCB Factories,” focusing on the pressures of cost, delivery time and process, and the irreversible trend toward automated PCB factories. Centering on this theme, we interviewed Andy Zhou, COO of Victory Giant Technology (HuiZhou) Co. Ltd., the first domestic PCB manufacturer who carries out large-scale implementation of intellectualization throughout the factory.

Catching up with Prototron Circuits Tucson GM Kim O’Neil

This has been an exciting year for Prototron, which has achieved Mil-PRF-31032 and gone into the flex business. Most recently, Prototron received word that they had achieved their AS9100 Rev D, which made me want to check in with Kim O'Neil and find out more.

The Speed of Nouya: Interview with Bao Xinyang of Shanghai Nanya

The theme of the June issue of PCB007 China Magazine is "High-Speed Materials." As is becoming more widely understood, domestic material supply is the only way for China’s high-frequency, high-speed circuit board industry to grow.

IPC: Department of Labor Releases RFI to Seek Information on Overtime Regulations

This week, the Department of Labor (DOL) released a Request for Information (RFI) to gather additional feedback from the public on the overtime regulations, which define and delimit exemptions from the Fair Labor Standards Act’s minimum wage and overtime requirements for certain executive, administrative, professional, outside sales and other employees.


A Conversation with New Isola Chief Revenue Officer Michael White

In a recent conference call with Isola’s new Chief Revenue Officer Michael White, I-Connect007 Publisher Barry Matties, and Managing Editor Patty Goldman gained a deeper understanding of the internal reorganization happening right now with Isola and Mike’s plans for Isola’s marketing team.

Review of the 2017 IPC Reliability Forum

IPC continues to lead our industry by example with their inaugural Reliability Forum, held in Chicago in April. The event was focused on manufacturing high-performance products and featured industry royalty from both a speaker and audience standpoint.

Embedded Technology: A Useful Tool in Freedom CAD’s Toolbox

Freedom CAD has been designing and fabricating boards with embedded technology for years, and doing some pretty innovative work along the way. I asked Scott McCurdy, Freedom CAD’s director of sales and marketing, to share some details about their embedded processes, as well as the challenges and opportunities that embedded technology offers.

The Skills Gap – Meet People Where They Are!

A perennial concern in the U.S. electronics manufacturing industry is the lack of skilled talent in many parts of the country. According to a recent IPC member survey, most companies have a hard time recruiting qualified production workers, engineers, and other technical professionals.

Patty's Perspective: What Happens in Washington Doesn’t Stay in Washington—It Reaches All of Us

I went to my second IMPACT Washington, D.C. event this year (May 1–3) and, as much as I applauded last year’s event, this one far surpassed it—just ask anyone who was there. In this month’s issue, a special section on IMPACT backs that claim.

Mr. Laminate Tells All: PTFE is About to be Banned by IEC TC111

There, I said it. Technical Committee 111 of the International Electrotechnical Commission (IEC) is preparing to effectively ban PTFE (polytetrafluoroethylene) materials from electronics. As history goes, the electronics industry has focused on only two of the four halogens (bromine and chlorine) to be limited in order to be called “halogen-free” or more accurately “low-halogen.” But now, fluorine is being dragged down too, just because of its location in the periodic table.

Weiner’s World – June 2017

On the way back from Hong Kong last week I had the good fortune of meeting an officer of Allegro Microsystems and enjoyed a wide ranging discussion with him. One of the "take home" items was concern about an expanding shortage of rare earth metals used to make ICs for the burgeoning automotive sensor market. The second was how important the roles of partnering and consortia are in the rapidly advancing autonomous automotive electronic field.

Rex Rozario, OBE, Wins Two Awards in Two Weeks

During their recent summer conference, the European Institute of Printed Circuits (EIPC) presented Rex Rozario with its distinguished Honourary Fellowship of the Institute Creditation for his contributions to the world electronics interconnection industry. Then at the Devon County Show, Rozario received the Pride of Devon Award for his contributions to Devon businesses and local radio.

The Significance of the PCB in the Value Chain of the European EMS Industry

At SMT Nuremberg, Pete Starkey meets with Dieter Weiss, who comments upon the significance of the PCB in the value chain of the European EMS industry, and looks to a future where we embrace an open-minded attitude and a willingness to work together.

A Brief Tutorial on Embedded Capacitors

Compunetics has been operating in the embedded components market for more than 20 years. Initially driven by their parent company’s need for high layer-count, high-density embedded capacitance cards for their OEM product offerings, technology and processes were developed which are mature and reliable.


A Twist on Printed Electronics: Printing on 3D Shapes

Barry Matties speaks with Optomec’s Pascal Pierra about their LENS printer systems and Aerosol Jet technology, which allows manufacturers to print applications like sensors and antennas on 3D objects. The process is significantly faster and greener than competing technologies.

Better Together: How HDP User Group Showcases the Industry’s Best Side

HDPUG is a non-profit trade organization comprised of members from top companies in the electronics industry, from materials suppliers and manufacturers, to OEMs and end users. Key activities include collaborating on issues facing multiple industries and bringing people together on projects who might not have met otherwise. Barry Matties met HDPUG’s European representative and project facilitator Alun Morgan at the recent EIPC Summer Conference to learn more about the group and current projects.

14th Electronic Circuits World Convention

The 14th Electronic Circuits World Convention (ECWC14) started in Seoul to the usual fanfare after the opening ceremonies of KPCA 2017. The ribbon-cutting ceremony was conducted by KPCA’s Jung Bong Hong and the representatives of the other WECC members: WECC Secretary General Rex Rozario; Jin Zhangi (CPCA); Alun Morgan (EIPC); Vikram Desai (Electronic Industries Association of India); Canice Chung (Hong Kong PCA); David Bergman (IPC); Kushal Patel (IPCA); Toshifumi Kobayashi (JPCA), and Rich Wu (TPCA).

Happy Holden Second Recipient of I-Connect007 'Good for the Industry' Award

Our second 'Good for the Industry' award has been presented to Happy Holden. After working with Happy for a number of years it is clear to see that he is dedicated to improving the industry. He has a long history in the PCB industry, starting off with HP in the '70s. Not only did he develop HDI, but he then wrote the HDI Handbook, which is provided to readers at no charge.

President Donald Trump Launches Workforce Development Week

Earlier this week President Donald Trump announced “Workforce Development Week.” As such, President Trump spent the last four days promoting job creation and even signed executive order expanding apprenticeship programs.

Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 2

The second day saw the conference room full once more, the late networking session in the bar having resulted in no significant casualties, and I was pleased to accept the invitation to moderate the first session, on processes and materials for flexible PCBs.

Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1

Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.

Embedded Technology: It’s All Around Us

In the early ‘80s, the PCB company I worked for was testing some of the first material for buried resistors. I can’t recall what customer it was for, or how far along the project got, but over the years it seemed like the technology was slow to be adopted and perhaps ahead of its time.

Walt Custer’s Market Report

At the recent EIPC Conference, Walt Custer delivered his annual report detailing the trends he’s been seeing in the electronics industry for 2016 and into the first quarter of 2017. Barry Matties sat down with Walt to discuss his findings, including his forecast for the upcoming year. Also discussed are Walt’s prognosis for the market segments with the most promise and those that cause him concern.

A Conversation with an Industry Twenty-Something

At a recent SMTA Expo, I met with Matt Hammesfahr, a salesperson with Amitron. Matt is young, by our industry standards—in his midtwenties. Just a few years out of college, Matt holds a business degree and is already a top salesman with the company. Here’s one of those twenty-somethings we keep saying we want to attract to our industry. How did this happen? I had to get the story.


HDP User Group 2017 European Meeting Highlights Technology Progress

The conference facility at the offices of Oracle, in the royal burgh of Linlithgow in West Lothian, Scotland, was the venue for the 2017 European meeting of the High Density Packaging User Group. I was delighted and privileged to be invited once again to sit in on the open session, an intense programme of technical presentations and discussions, project reviews, status updates and new project proposals.

How to Find –and Retain– the Right People for the Right Jobs

I sat down recently with Rebecca Brennan, director of human resources, and Aimee Miller, director of corporate communications for Compunetics and Compunetix. I already knew a little bit about their programs, having spent time at Compunetics in past years. I was looking forward to learning more about their methods.

Weiner’s World—May 2017

China’s central bank is effectively anchoring the yuan to the dollar, a policy twist that has helped stabilize the currency in a year of political transition and market jitters about China’s economic management. The yuan weakened more than 6% against the dollar in 2016; this year, it is up roughly 1%, and the expectation that the currency will fluctuate—a gauge known as implied volatility—is around its lowest in nearly two years.

Growth Ahead for Flexible Hybrid Electronics Industry

According to Zion Research, “global demand for the flexible electronics market was valued at $5.13B in 2015 and is expected to generate revenue of $16.5B by 2021, growing at a CAGR of slightly above 21% between 2016 and 2021.” Key elements of the market, in the view of most analysts, include flex displays, sensors, batteries, and memory.

Help Wanted With IMI’s Peter Bigelow

In preparation for this month’s topic, especially what companies in our industry are currently experiencing when it comes to finding and hiring the right people, I sought out Peter Bigelow, president and CEO of circuit board fabricator IMI Inc. We spoke in February at IPC APEX EXPO.

Deep Into Technology at Compunetics

There aren’t many printed circuit companies in my neck of the woods. There is one, however, that has always fascinated me, and that is Compunetics, in Monroeville, Pennsylvania, a suburb of Pittsburgh. Having worked with them on the electrophoretic photoresist, a PPG product, many years ago, it was great to stop by and catch up with CTO Tim Schmitt and Technical Applications Manager Jesse Ward, along with General Manager Burhan Capar, a relative newbie to the company.

Ding Cheng of BYD Electronic: Embracing the FPC Factory Model of the Future

The topic of the third issue of PCB007 China Magazine is "The Wide World of Flex." Around this theme, we asked one of the leaders of China's FPC industry, Ding Cheng, general manager of the FPC Division of Shenzhen BYD Electronic Parts Company, to share his perspective about trends in flex, and where he thinks that market is headed in the future.

IMPACT 2017: Electronics Industry Leaders Meet with Members of Congress and Trump Administration on Capitol Hill

IPC places a high priority on making our presence known in the halls of government to educate our government officials on the policies that will strengthen the advanced manufacturing industry.

Help Wanted—and How!

It seems that I am extra-sensitive to topics in the news that coincide with an upcoming magazine topic—I see headlines in newspapers, suddenly the subject comes up in conversations, in email, and even in other media. And I think, is it just me or is everyone talking about this at the same time?

Weiner’s World—April 2017

China’s economy accelerated for a second straight quarter as investment picked up, retail sales rebounded, and factory output accelerated in March. Gross domestic product increased 6.9% in the first quarter from a year earlier, compared with a 6.8% median estimate in a Bloomberg survey.


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