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Designers Notebook: Flexible and Rigid-Flex Circuit Design Principles, Part 4

All of the design rules for the glass reinforced-portion of the board (land pattern geometry for mounting surface mount devices, solder mask and the like) are now well-established. One unique facet of fabricating the rigid-flex product is how the flexible portion of the circuit is incorporated with the rigid portion of the circuit. As a general rule for multilayer PCB design, furnish a balanced structure by building up the circuit layers in pairs (4, 6, 8 and so on).

The Supplier View: An Interview with Hamed El Abd

I sat down with WKK’s Hamed el Abd at CPCA, where we discussed the show, the growing trend toward automation, as well as a few other topics, namely world politics and economics and how they relate to the PCB industry.

Lean Manufacturing and NPIP for Flexible Circuits

Many companies are familiar with lean manufacturing concepts and have successfully used these techniques to improve manufacturing processes. Lean techniques, while most often used in printed circuit fabrication and assembly operations, can also be applied to nonmanufacturing processes. One such process is new part number introduction (NPIP).

IPC APEX EXPO: Gardien Discusses Providing Test Solutions with an Integrated Partnership

Gardien's VP of Quality, Todd Kolmodin, tells Guest Editor Dan Beaulieu about their customer partnership program, helping to provide solutions to their customers' test and quality issues.

IPC APEX EXPO: Design Through Box-Build Strategy Works for PNC Inc.

Guest Editor Dan Beaulieu talks with PNC's production manager, Bhavesh Sangani, about PNC's "design through box-build" strategy along with their significant capital equipment purchases over the past few years for both PCB fabrication and assembly.

Patricia (Patty) Goldman Inducted into IPC Hall of Fame

We at I-Connect007 are thrilled that our own Patty Goldman has been awarded the highest level of volunteer recognition that IPC can give to an individual, the Raymond E. Pritchard Hall of Fame Award. The award is given in recognition of superior achievement, extraordinary contributions and distinguished service to IPC and the advancement of the electronics industry.

Happy’s Essential Skills: Design of Experiments

Design of experiments (DOE) is one of the most powerful and influential engineering tools for product yield improvements, new products or processes development, or for problem solving. As mentioned in my last column, process problems led me to a career in printed circuits, and quickly solving those problems led me to a bonus stock award and a great life. Even though I knew nothing about printed circuit manufacturing processes, I was able to quickly find the root causes of all the problems and fix them. My secret? Total quality control (TQC), statistics, and DOE.

Rex Rozario, Part 4: A 10,000-ft. view of his Business Ventures, the Industry, and Life

In our final installment, Rex describes the common thread woven through all of his successful business ventures and varied interests: confidence and the fortitude to follow his dreams until they are realized. Rex also takes a look back at the evolution of the global PCB industry, and explains his approach to profitability, which includes building (and rewarding) a successful team.

Rex Rozario, Part 3: The Future Beckons

In Part 3 of our multi-part interview with industry veteran Rex Rozario, we begin with the future. Having achieved success in China, could Rex and the Graphic team have their sights trained on the U.S.? Also in this installment, Rex weighs in on China’s future, and we discuss the value of automation. Is it for everyone?

Rex Rozario: The PCB Industry’s True Renaissance Man

In this exclusive multi-part interview that was conducted recently, I-Connect007's Barry Matties will introduce you to all of the people that Rex Rozario is, and where he, his team, and Graphic PLC are headed to next.


All About Flex: Three Emerging Trends That You Can Bet On

Flexible circuits are light weight, require minimal space, can be bent into “origami” shapes for adoption to a wide range of applications. These utilitarian features give electronic designers endless options for the new and exciting products that will soon become part of our everyday life.

Manufacturing Institutes Can Boost the Nation

In his most recent State of the Union address, President Obama highlighted a remarkable trend of recent years: the turnaround in many corners of America’s manufacturing sector. Nearly 900,000 new jobs have been created by U.S. manufacturers in the last six years.

The Sum of All Parts: The Cost of Quality

Throughout the decades, irrespective of industry or sector, markets have thrived on competition. They have, however, also relied upon some semblance of unity within their respective competitors. Industries rely upon their individual member companies’ ability to work together for the greater good.

The Institute of Circuit Technology Tewkesbury Seminar, 1st March 2016

The Annual General Meeting of the Institute of Circuit Technology (ICT) was held at Puckrup Hall, near Tewkesbury in Gloucestershire, England, on 1st March 2016, and was followed by a well-attended evening seminar with presentations on a novel laser-induced deposition process, an analysis of the market for PCBs, and a review of three development projects in which the Institute had participated. The programme was introduced and moderated by ICT Technical Director Bill Wilkie.

Printing PCBs…In Your Office!

The days of producing a PCB prototype with a 3D printer may not be as distant as you think. I spoke with Simon Fried of Nano Dimension about how 3D printing is becoming a reality, and how this disruptive technology will change the way designers produce rapid prototypes.

Designers Notebook: Flexible and Rigid-Flex Circuit Design Principles, Part 3

This installment of "Designers Notebook" will focus on methods for specifying base materials, and also address copper foil variations and fabrication documentation. It is important to research the various products in order to choose the one that best meets the design requirements.

Stretchable Electronics that Quadruple in Length

EPFL researchers have developed conductive tracks that can be bent and stretched up to four times their original length. They could be used in artificial skin, connected clothing and on-body sensors.

The Quiet Mainstreaming of HDI Manufacturing

Advances in technology continue to push the envelope of what’s possible. And nowhere has the impact of those advances been felt more profoundly than in the evolution of the current class of mobile devices. Although design engineers have driven this evolution, primarily through addressing market demand for new form factor innovation, the push to meet the associated manufacturing challenges has been responsible for a revolution in PCB manufacturing.

Flex: Just What the Doctor Ordered for Medical Devices

Medical devices represent one of the fastest growing electronic markets in the United States. The drive for reduced space and weight, added functionality, and reduced cost has driven the adoption of a wide array of custom flexible circuits. The design freedom offered by this three-dimensional interconnect supports the packaging design requirements for a myriad of diverse applications within the medical electronic market.

Designers Notebook: Flex and Rigid-Flex Circuit Design Principles, Part 2

In this installment of "Designers Notebook," Vern Solberg discusses supplier assessment, planning of the flexible circuit outline, and various circuit routing principles. Communication between designer and fabricator is paramount, as well as an understanding of IPC-2223, which sets the specific requirements for the design of flex circuits.


The Pinless Registration System, Explained by DIS’ Bernd Gennat

I sat down at productronica recently with Bernd Gennat, VP sales Asia and Europe for Duetto Integrated Systems (DIS Inc), for an overview of the industry, including his company’s technology. Our discussion touched on trends in multilayer registration, market requirements in Europe compared with those in China, and the benefits of pinless over hard-tooled registration systems for current and future rigid, flex and flex-rigid constructions.

Mr. Laminate Tells All: CEM-3 Reinvents Itself (Again)—or, Atari Game Boards on eBay?

CEM-3 was unusual as the reinforcement was a combination of woven fiber-glass fabric and fiber-glass paper. The resin system was a dicy-cured epoxy resin yielding a Tg the same as FR-4 at the time, of 110–120°C range. Because it was all epoxy and all fiberglass, the properties were electrically identical to those of FR-4.

What a Long, Strange Trip it’s Been—and It’s a Long Way from Being Over

Harvey Miller has been in the PCB industry for more than 40 years, and he’s probably seen it all. I recently sat down with Harvey at a wine bar in Palo Alto to learn more about his history in the industry and where he sees it going forward. Harvey arrived wearing jogging shorts and running shoes. No surprise after what his doctor recently shared with him.

New Year, New Outlook for the Electronics Manufacturing Industry

As an advocate for the electronics manufacturing industry, my job is to educate and encourage policymakers to create a favorable legislative and regulatory environment for advanced manufacturing to grow and succeed. From that perspective, I think we should be proud of the significant progress we made in several areas in 2015.

All About Flex: Flexible Circuit Antennas

In our world of fabricating custom electronics, a circuit can generally be defined as “a path between two or more points along which an electrical current is carried.” The printed circuit board industry designs and fabricates an incredibly diverse set of rigid and flexible circuits. But it is also true this industry produces many parts that do not carry current between discreet points.

How North American Fabricators Benefit from Attending HKPCA

Two New Englanders in Shenzhen. It sounds like the title of a play, doesn’t it? Headlining the bill is Peter Bigelow of IMI, who explains to me why even small American manufacturers benefit from attending large Chinese shows like the HKPCA. He’s joined by fellow New Englander Alex Stepinski of Whelen Engineering, who discusses drill concepts and the transition to zero discharge.

In Their Words: Hong Kong Printed Circuit Association (HKPCA)

Recently, we sent a questionnaire to a number of printed circuit associations around the world, asking them to tell us a little about their organizations. With the annual HKPCA & IPC show having just ended, this information provided by HKPCA is especially interesting.

Happy’s Essential Skills: The Need for Total Quality Control (Six Sigma and Statistical Tools), Part 2

The statistical representation of Six Sigma describes quantitatively how a process is performing. To achieve Six Sigma, a process must not produce more than 3.4 defects per million opportunities. A Six Sigma defect is defined as anything outside of customer specifications. A Six Sigma opportunity is then the total quantity of chances for a defect.

In Their Words: The IPCA–India Printed Circuit Association

To better understand the many associations serving the global electronics industry, I-Connect007 conducted many interviews for this month’s issue, as well as distributed several questionnaires, one of which was to IPCA (India Printed Circuit Association). The IPCA is not part of IPC, though the two associations do collaborate. Secretary K. S. Babu responded on behalf of IPCA President Viral Bhulani.

Designers Notebook: Flex and Rigid-Flex Circuit Design Principles, Part 1

In his new Designers Notebook column, Verb Solberg discusses primary flex circuit structures, proper design for operating environment, and base material selection. The design guidelines for flexible circuits, although similar to those for rigid circuits, have distinctive differences that are influenced by specific applications and the intended operating use environments. Communication with your fabricator is paramount when designing flex and rigid-flex circuits.


All About Flex: High-Temperature Performance Flexible Circuits

Markets requiring thermal exposure at elevated temperatures include down-hole oil drilling, semiconductor processing, medical diagnostics and a multitude of military/aerospace requirements. But a limitation of flexible circuitry has been performance at extremely high temperatures.

Happy’s Essential Skills: The Need for Total Quality Control (Six Sigma and Statistical Tools): Part 1

In this first of many columns covering my "Twenty-Five Essential Skills Every Engineer Needs to Learn," I will expand on each of those skills. To read the introduction to this series, which published in the January issue of The PCB Magazine. As a quick recap, here are the 25 skills that I will be writing about over the next 18 months or so, to publish every three weeks or so in the PCB007 Daily Newsletter.

Weiner's World

In this article, industry veteran Gene Weiner looks back at some of the industry highlights in 2015, and ponders on the challenges and opportunities to expect this year. He also highlights recent industry events, including the 2015 International Printed Circuit & APEX South China Fair and SEMICON Japan.

CES: Day One

CES Unveiled is the official media event for CES. It is the first official happening of what promises to be a very busy and fascinating week. At this event, members of the press get to preview a number of innovative startups as well as some new products from a few established global brands.

IPC’s Fern Abrams: Keeping up with Regulatory Matters

Recently, I met with IPC’s Director of Regulatory Affairs and Government Relations, Fern Abrams. In the course of our conversation, we delved into everything from what her role entails and recent regulatory matters, to some of the group’s successes and why companies need to get involved (it matters to your representatives in Congress or Parliament).

2015’s Most Read PCB Articles

Every year, we like to take a look back at the most popular PCB news and articles. These are the top 10 most-read PCB articles from the past year. Check them out.

Dave Bergman: IPC’s Technology & International Reach

I met with the IPC’s VP of Standards and Technology, Dave Bergman, while in Chicago recently. I’ve known Dave for almost 30 years, so we had quite a chat, covering a lot of ground, from the efforts of IPC China and IPC India, to the standards activities that are certainly the core activity of IPC.

A Conversation with IPC President and CEO John Mitchell

I-Connect007's Patty Goldman was able to sit down with John Mitchell, president and CEO of IPC, to discuss the organization and where we are going as an industry. We discussed IPC’s four aspirational goals—standards, education, advocacy and solutions—as well as short-term goals. We also talked a bit about going virtual and becoming paperless.

All About Flex: Saying Yes

During the Reagan presidency, First Lady Nancy Reagan championed the advertising slogan “Just say no” as part of a “War on Drugs” campaign. The message of the campaign was intended to protect children from the harmful effects of illegal drug use by offering various ways of saying “no.”

What is the Internet of Things and Why Should it Matter to Us?

It is often surprising how closely our science fiction novels and movies model the future. The Internet of Things (IoT) and big data may prove to be an excellent example of this phenomenon. Coined in 1999 by Kevin Ashton (the RFID standards pioneer), the IoT is one of the least descriptive monikers of all time for something very important in the history of technology.


Catching up with Gardien’s Rick Meraw

There are companies out there who are truly changing the world—companies who are making a dent in the universe, to quote the late Steve Jobs. Gardien is one of those companies. So much so that I like to catch up with them on a regular basis because they’re always adding something to their repertoire and it’s typically something that helps improve the way we handle quality assurance in our industry.

All About Flex: Process Controls for Flexible Circuit Fabrication

Manufacturers of flexible circuits use several chemical processes for fabrication. These processes are generally located in a common area of the plant because of facility requirements and environmental considerations. These chemical operations are referred to as wet processes.

The Associations Issue

Well, it’s the end of the year. How did that happen? It really is true that every year goes by a little faster. You young whippersnappers out there won’t know what I’m talking about, but just you wait and see. We changed it up for our December issues this year. Instead of doing a year-end review, we decided to devote this month to our associations and trade organizations—at least some, because when you start poking around, you will find there are scads of them.

MacDermid’s Research Team Talks New Cyanide-free Immersion Gold at SMTAI

While at SMTAI in Chicago recently, I met with two of MacDermid’s research team, Jun Nable, research project manager, who has been with MacDermid since 2007, and Cherry Santos, associate research fellow responsible for formulation work for metal plating solutions. We talked about the posters they were presenting and why they chose SMTAI.

Catching up with Winonics’ Mark Eazell

I have always thought of Winonics as one of the hidden gems of the North American PCB industry. Their well-equipped and well-laid-out facility in Brea, California is one of the more impressive looking PCB facilities in North America today. Winonics is one of three PCB companies owned by JR Controls, the other two being Cosmotronic and Bench2Bench. I had the opportunity to talk with Mark Eazell, the general manager at Winonics, who also oversees the operation of all three JR Controls’ PCB companies.

Behind the Scenes with IPC Technical Conference Coordinator Toya Richardson

I have known and worked with IPC Technical Conference Coordinator Toya Richardson for quite a few years, but we have never had an in-depth chat about her job at IPC. In this interview, she talks about her work at IPC, their preparations for the upcoming IPC APEX EXPO 2016, and some of the latest developments at IPC.

productronica 2015: Ventec's Latest Developments in the UK

Ventec continue to invest in the pursuit of ultra-cleanliness in pre-preg fabrication and packaging in their UK distribution operation, and announce a range of complementary consumable materials - foils, drill boards and release films - as proven in their Ventec-Option laminating and drilling service, leveraging their purchasing power and sharing the cost benefits with their laminate customers.

All About Flex: Embracing the Mess

Marketing in the world of printed circuits is an important discipline, but I have learned it is better to be prepared with a nimble reaction than to expect the marketing department to consistently be successful in predicting the future. The path to the goal is often achieved much more quickly by making an early decision followed by a course correction rather than waiting for all the information.

Navigating the Global Materials Supply Chain: A Roundtable Discussion

At SMTAI recently, I-Connect007's Andy Shaughnessy sat down for a roundtable discussion with some key players from the materials side of the supply chain. Participants included two executives from Ventec: Mark Goodwin, COO USA and Europe for Ventec International Group; and Jack Pattie, president of Ventec USA. Also participating in the roundtable were Schoeller Electronics CEO Michael Keuthen and Bob Willis, from the National Physics Laboratory (NPL).

HKPCA Executive Director Daniel Chan on the Upcoming Show and More

Daniel Chan discusses the latest developments to expect at this year's HKPCA and IPC show, and the new features that the show will offer delegates and attendees. He also speaks about the trends to expect in the PCB manufacturing industry, and the major drivers of innovation.


All About Flex: Flexible PCB: What’s in a Name?

Flexible PCB is a common term that is synonymous with flexible circuits. While the term “PCB” is generally used to describe rigid printed circuitry, “flexible PCB” is a little contradictory because “boards” aren’t really flexible. Some companies, like All Flex, design and manufactures flexible PCBs, but not rigid PCBs.

Flex Talk: Thoughts on the IPC Flexible Circuits–HDI Forum

As an attendee at the IPC Flexible Circuits–HDI Conference held October 28–30, I found myself in a room full of people, all eager for technical information, with the opportunity to reconnect with industry friends and to make new connections. The audience was diverse with young people, new to our industry, sitting alongside industry veterans willingly sharing their knowledge and passion for HDI design and flexible circuit technology.

productronica 2015: Orbotech's Nuvogo 1000 Brings High Speed to Solder Mask LDI

28 watts of laser power enables the Nuvogo 1000 dual wavelength direct imaging system to achieve production throughput for solder mask up to 40 double-sided panels per hour, while retaining the versatility to image inner layer and outer layer features as fine as 24 microns.

Catching Up with Circuit Connect

When I met with Circuit Connect President Bob Lazzara and Director of Operations Paul LaLiberte, I was first struck by the passion they both have for their customers, as well as for their customers’ businesses, using the innovation they have today, as well as what they can develop together with their customers. They don’t just invite, but urge their customers to come and visit them in their very well-equipped facility in Nashua, N.H.

All About Flex: Flexible PCB: What’s in a Name?

Flexible PCB is a common term that is synonymous with flexible circuits. While the term “PCB” is generally used to describe rigid printed circuitry, “flexible PCB” is a little contradictory because “boards” aren’t really flexible. Some companies, like All Flex, design and manufactures flexible PCBs, but not rigid PCBs. There are many similarities between the two, but also significant differences.

Designs on Flex: Underwriters Laboratory and Flexible Printed Circuits

Underwriters Laboratory is a worldwide safety consulting and certification company headquartered in Northbrook, Illinois. UL certifies, validates, tests, inspects, audits, and advises on safety of electrical and electronic products.

Mr. Laminate Tells All: Where in the Holy Halogens did 900, 900, 1500 Come From?

The 900, 900, 1500 is not a combination to an enormous safe that contains the remains of Jimmy Hoffa, nor is it the weight of three elephants at the San Diego Zoo in kilograms. The 900, 900, 1500 is the maximum parts per million (ppm) of bromine and chlorine and the total bromine and chlorine in a material that can be defined as “halogen-free” in the electronics industry today. But where did these requirements come from? Clearly, 900 ppm of bromine or chlorine is obviously not halogen-free. Some would argue that it is not even low-halogen at all.

Catching up with Cosmotronic’s Gary Abel

Cosmotronic’s history spans a number of decades, from the hot-as-hell boom days of the '60s and early '70s when Southern California was leading the world in electronics, from weaponry to avionics to apace exploration. Today, as innovation has become more focused on personal electronics, Cosmotronic has been there, leading the way and serving a customer base that is uniquely similar to the one they had back in the day.

Cycle Time Reduction in a Flexible Circuit Facility

Managing product flow and cycle time across a wide range of product constructions and volumes in a high-mix flexible circuit fabrication facility can be extremely challenging. What seems to work best is a tailored hybrid system, with concepts adopted from classic just in time manufacturing (JIT), theory of constraints (TOC) and quick response manufacturing (QRM).

All About Flex: Plated Through-holes in Flexible Circuits

There is probably no more important feature than the plated through-hole (also called via or via hole) with regard to the reliability and integrity of a flexible circuit. The through-hole provides electrical connection between insulated layers and enables electrical functionality on double-sided and multilayer flexible circuits.


Flex Circuit Shielding Design Options

Shielding may not be your company’s number one design concern when thinking about your interconnect designs. But if you have to shield circuits for EMI, then you will need to depend on your supplier to assist you with their favorite shielding technique and experience.

Interim CEO Jeff McCreary Discusses Recent Changes at Isola

Isola’s Interim President and CEO Jeff McCreary explains to Barry Matties the impetus for the personnel reduction taking place at Isola, the closing of their northern California facility, and why there’s no need to panic. He also shares his view of what the industry may expect from Isola going forward and what the company is looking for in a new CEO, the name of which McCreary expects to announce in the next few months.

Testing Flexible Circuits, Part 3: The Completed Flex Circuit

Most flex houses perform a variety of tests on completed flexible circuits. The type, frequency, and complexity of these tests vary with customer and application. Test requirements are generally defined by the customer, but input is often solicited from the supplier during the quote process.

Stepping Up To Laser Processing for Flex, Part 1: Opportunities and Implications

Market demand for smaller, faster, wearable, lighter and more powerful devices continues to keep PCB manufacturers scrambling to keep up as they evolve and adapt their manufacturing capabilities to meet changing customer needs. But keeping up with the dizzying pace of change in the world of PCB manufacturing need not be a daunting task.

Testing Flexible Circuits, Part 2: Raw Materials and Components

Even though the raw materials may individually meet certain specifications, it is important to determine if the final product configuration meets those specs. So testing done at the finished circuit level is also needed. Tests specific to the finished circuit will be the topic of our next column on testing.

The Reindustrialisation of Europe

With an inquisitive mind and a head for challenges, besides the ability to think outside the box and the courage to dare to be different and strive to be first, Spirit Circuits MD Steve Driver can be relied upon to grab the attention of an audience of PCB professionals. As keynote speaker at the Institute of Circuit Technology Hayling Island Seminar, he lived up to his reputation with a motivational presentation, the two themes of which exemplified his latest entrepreneurial venture.

Final Surface Finishes for Automotive: No One-Size-Fits-All Solution

Regardless of whether your application is automotive, medical or military, there are many factors to consider when selecting a final surface finish. Cost, lead or lead-free requirements, end environment, shelf life, fine-pitch components, RF applications, probe-ability, thermal resistance and shock and drop resistance, to name a few. There is not a one-size-fits-all finish. Understanding the advantages and disadvantages of each surface finish allows the designer to select the finish that best fits each particular application.

Testing Flexible Circuits, Part I: Requirements and Procedures

In this first of a three-part series regarding tests for flexible circuits, I will examine overall requirements and procedures; the second installment will focus on raw materials, and the third and final part will focus on testing for bare flexible circuit and circuit assemblies.

HDI Technology - Flex Circuits

The flex circuit industry in North America is moving rather quickly. The packaging densities are moving to smaller and the electrical requirements much faster. In order to keep pace with the industry requirements of HDI, North American flex vendors need to invest in equipment, resources and R&D.

Catching Up to Yesterday

Recently, KPMG, an international consultancy that operates as a network of member firms offering audit, tax and advisory services, came out with their 6th annual survey of manufacturing executives focusing on global manufacturing trends.


Flex Market Evolution

Flex circuits are designed to solve electronic packaging and assembly problems, solve interconnection issues, assist in miniaturization, and provide a dynamic electro-mechanical solution. They are configured with repeatable conductors that foolproof assembly errors. Flex is used in designs where standard printed circuit boards, connectors and cable assemblies just don’t provide the right electrical or mechanical solution.

Why are PCBs Green?

Why are PCBs green? This is one of the questions I get asked when people ask of me what do I do for a living, especially after I explain that my company supplies the little green things that one will find in pretty much anything and everything you purchase today that you cannot eat or drink.

Integrating with Gardien Group's Roland Valentini

Gardien Group is one of those companies that are always looking out for their customers. The company is, without a doubt, the last word when it comes to bare board quality assurance, focused on helping customers deliver the most electrically sound boards in the business. Gardien’s technologists are experts at testing and other quality assurance disciplines. For more than 30 years, Gardien has been in the business, originally as the equipment manufacturer Mania.

Designing Flex Circuits for Domestic Prototyping

Designing a flex circuit to be prototyped domestically? No problem. Designing a rigid-flex circuit for production offshore? Got it. Designing a part that will be prototyped domestically with a seamless transition to offshore production? That can be a little more challenging.

Is Wearable Technology Just a Fad?

Wearable technology is in its infancy. The industry needs to mature and go back to basic marketing—finding a need and filling it. Flexible circuits have been around since the mid-1960s and have been successfully filling needs. Flexible circuits are ideal for wearable technology because they are thin and lightweight. As the marketing matures, the applications will come and flexible circuits will be there to fill the technical needs.

The Drive for Transparent Circuits

DKN Research develops many types of unique electronic circuits. Some products in our portfolio include ultra-thin conductor circuits as small as 0.2 microns, metal-free circuits, and some circuits up to 20 meters long. Our staff fields many inquiries for packaging of new electronic devices. Lately, there is a lot of interest in transparent flexible circuits. The increase in interest is driven by the recent market expansion of display and optical devices.

Accomplish Change Together (ACT)

Shifting strategies for selling PCBs and the materials to build them is the impetus for ACT. Insulectro's Ken Parent and Jason Marsh spoke to I-Connect007 Publisher Barry Matties about the ACT approach—and how it is helping their PCB fabricator customers increase sales and OEMs to get better products.

Agricultural Drones and Flexible Circuits

Agricultural drones are expected to have a significant impact on farming over the next few years. In the article mentioned above, the drone’s ease of use and affordability make this a tool that virtually every farmer could employ. One major complementary technology to the drone is the advances in imaging technology and analysis. Specifically, the agricultural drone gives farmers data analysis capability that they have not had before.

Eliminate Connectors with Sculptured Flex

Any time you eliminate a component, hidden costs are eliminated, such as the cost of stocking, tracking and managing the supply chain for that part number. When designing an electronic package, don’t assume that you need a component for every connection point. Sculptured flex will give some options that can make your electronic package, lighter, less costly, more reliable, and take up less space.

Coated Ultra-Thin Copper on Printed Circuit Laminates

Nano copper-based electronic ink and associated processing have been developed to create ultra-thin copper on flexible PCB substrates, allowing for much finer etch resolution and increased circuit density. The process is rapid and sufficiently low-temperature to allow deposition onto temperature-sensitive substrates such as polyimide, plastic and paper.


A Look at the High-Reliability Interconnect Market

In an interview with I-Connect007, Mark Cormier of Miraco Inc. discusses his company's activities and capabilities, the latest trends and drivers in the high-reliability segment, and their strategies when it comes to managing their assembly work as well as their audit processes to find EMS providers.

Innovative Technologies Drive PCB Industry Growth

PCB growth has slowed in recent years, though last year the growth rate was slightly higher than the 2% of the last three years. Estimates by IEK of Industrial Technology Research Institute of Taiwan show that the PCB industry will continue to grow in 2015 at a rate of 3-5% with an annual output of RMB 576 billion (USD 93.8 billion).

Rigid-Flex PCB Right the First Time--Without Paper Dolls

The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way, while maintaining good flex-circuit stability and lifespan. The next big problem to solve is the conveyance of the design to a fabricator who will clearly understand the design intent and therefore produce exactly what the designer/engineer intended.

EIPC Summer Conference: Day 2

Refreshed after an excellent conference dinner, and for most, a good night’s sleep, delegates returned for the second day of the EIPC Summer Conference in Berlin, continuing the theme of improving profitability through technical leadership and innovation to meet future market requirements, with sessions on materials and processes for high performance PCBs and advanced material testing strategies to meet OEM and ODM needs.

EIPC Summer Conference, Berlin: Day 1

Berlin, capital of Germany and a world city of culture, politics, media and science, was the venue for the 2015 EIPC Summer Conference, which attracted delegates from sixteen countries, including Russia, Hong Kong, Japan, Israel, USA and Canada, as well as the European Union, to experience a programme of 21 technical presentations over two days. Also included was a visit to the Berlin laboratories of Fraunhofer Institute, Europe’s largest application-oriented research organisation.

Enabling Smart Wearable Technology: Flexible, Stretchable Interconnect

In this article, Joan Vrtis highlights the current and forward-looking interconnect technologies enabling the stream of amazing new smart wearable electronic devices connecting the user to their personalized experience.

Flexible and Stretchable Circuit Technologies for Space Applications

This article describes two original technologies developed at imec-CMST--the ultra-thin chip package (UTCP) and stretchable moulded interconnect (SMI)--and how they could be offering new form factors with increased functional density, as well as improved reliability in harsh environments .

Novel High-Performance Substrate for Stretchable Electronics

A cornerstone feature of any viable stretchable material is its ability to return to zero after stretching. This article talks about a new transparent, high-performance thermal setting stretchable material that could open doors to a range of new and innovative products.

Wearable Technology and Flexible Circuits

Flexible circuits are an ideal fit for wearable technology. Wearable electronics need to be light, dense and bendable. While what is currently considered standard flexible circuit technology is more than adequate for many the wearable products, there are requirements that may be pushing the boundaries a bit.

A High-Reliability, Stress-free Copper Deposit for FPC, Polyimide and Rigid-Flex

Conventional electroless copper systems often required pretreatments with hazardous chemicals or have a small process window to achieve a uniform coverage without blistering. To overcome the challenge of metallizing smooth surfaces, a new stress-free electroless copper was developed to serve this important sector of the printed circuit industry.


Flexible Circuit Materials for High-Temperature Applications

To meet the increasing needs for flexible circuit materials for high-temperature applications, new test methods will need to be developed. These new methods will assign new ratings that are consistent with actual performance.

HDPUG Demonstrates Benefits of Cooperative R&D

The High Density Packaging User Group (HDPUG) is a member-driven, non-profit, project-oriented industry consortium that addresses the integration of new electronics component packaging and interconnection technologies into the supply chains of its member companies.

The Flex-to-Fit Approach

The flex-to-fit concept reminds us that creativity and engineering go hand-in-hand. When there is not ample space for a conventional approach, this process, which is the convergence of the mechanical world and the electronics world, results in the ability to design a flexible circuit along the contour of an existing, irregularly shaped structure.

Flexible, Stretchable, and Wearable: If You Can Dream it, You Can Create it!

We originally intended the June issue of The PCB Magazine to be centered on flexible circuits, but it quickly became apparent that we needed to broaden the scope and include all (well, at least some) of the new and exciting things going on these days in the world of flexible everything. As such, we have garnered a trove of authors, with much information to impart on the above mentioned.

NEPCON China 2015 a Resounding Success in Shanghai

The three-day event was a complete success, bringing together nearly 22,000 trade visitors and high-quality buyers, as well as 450 leading brand names from 22 countries and regions worldwide. NEPCON China keeps up with market trends and gathers resources from all stakeholders to present a comprehensive event that covers SMT, new electronics materials, soldering, dispensing, electronics automation, measurement and other innovative technologies and products across the world.

Flexible Circuits and UAV Applications

The utility offered by flexible circuits in UAVs mimics the advantages that make it popular in other portable electronic applications: lightweight, thin, highly reliable, flexible during use, and an ability to electrically connect across multiple layers as part of a complete packaging interconnect solution.

iNEMI Managing Director: New, Disruptive Technology on the Horizon

Dr. Haley Fu, managing director of Asia Pacific for iNEMI, and Publisher Barry Matties spoke recently. Fu gave her overview of the last eight years with iNEMI along with her opinion of what the most significant changes have been, globally and for the Asia market in particular. She predicts that in the future, the PCB will probably adopt optical architectures instead of copper, because using copper for the trace means that the land space and the property will not satisfy the future high-speed data transport rate.

An Interview with Gardien Group’s Jason Fraser

Gardien Group CEO Jason Fraser talks to Dan Beaulieu about some of the latest developments at the company, some of the technology trends driving the company's strategies, as well as provides his outlook as to where the PCB industry is headed.

Being Flexible in a Rigid World

With double-digit growth in the foreseeable future, flexible printed circuits (FPC), have found a tremendous niche as an enabler for various electronic applications. This trend is expected to drive the need to increase productivity while improving performance and reducing costs. Of course, in order to sell flex, one must tackle the unenviable task of metalizing these often difficult-to-plate materials.

IMPACT 2015: An In-Depth Look

IPC understands that presenting a unified voice for the electronics industry is essential for advancing policies that affect the industry’s long-term future and strengthens the U.S. and global economy. That is why 22 IPC member-company executives descended on the nation’s capital for IMPACT 2015: IPC on Capitol Hill, IPC’s annual advocacy event.


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