Flexible, Stretchable, and Wearable: If You Can Dream it, You Can Create it!
We originally intended the June issue of The PCB Magazine to be centered on flexible circuits, but it quickly became apparent that we needed to broaden the scope and include all (well, at least some) of the new and exciting things going on these days in the world of flexible everything. As such, we have garnered a trove of authors, with much information to impart on the above mentioned.
NEPCON China 2015 a Resounding Success in Shanghai
The three-day event was a complete success, bringing together nearly 22,000 trade visitors and high-quality buyers, as well as 450 leading brand names from 22 countries and regions worldwide. NEPCON China keeps up with market trends and gathers resources from all stakeholders to present a comprehensive event that covers SMT, new electronics materials, soldering, dispensing, electronics automation, measurement and other innovative technologies and products across the world.
Flexible Circuits and UAV Applications
The utility offered by flexible circuits in UAVs mimics the advantages that make it popular in other portable electronic applications: lightweight, thin, highly reliable, flexible during use, and an ability to electrically connect across multiple layers as part of a complete packaging interconnect solution.
iNEMI Managing Director: New, Disruptive Technology on the Horizon
Dr. Haley Fu, managing director of Asia Pacific for iNEMI, and Publisher Barry Matties spoke recently. Fu gave her overview of the last eight years with iNEMI along with her opinion of what the most significant changes have been, globally and for the Asia market in particular. She predicts that in the future, the PCB will probably adopt optical architectures instead of copper, because using copper for the trace means that the land space and the property will not satisfy the future high-speed data transport rate.
Being Flexible in a Rigid World
With double-digit growth in the foreseeable future, flexible printed circuits (FPC), have found a tremendous niche as an enabler for various electronic applications. This trend is expected to drive the need to increase productivity while improving performance and reducing costs. Of course, in order to sell flex, one must tackle the unenviable task of metalizing these often difficult-to-plate materials.
High-Density Interconnects: Enabling the Intelligence of Things
HDI layers and sub-composites with laser-drilled vias combined with stacked, copper-filled vias up to 16 layers have become the state-of-the-art in circuit design for the newest generation of mobile phones, wearable electronics, and IoT modules.
Insulectro Alliance with Freedom CAD
Ken Parent, Vice President of Sales at Insulectro, recently sat down with I-Connect007 Publisher Barry Matties for a quick chat about the strategic alliance that Insulectro is pursuing with Freedom CAD. Parent explains how this new strategic effort is working, and what it means for customers--and OEMs.
Nine New Exciting Products Introduced
Insulectro's VP of Sales, Ken Parent, discusses new products including high-speed laminate, high-temp flex materials, LDI dry film, conformal back-up material for flex-rigid,and printed electronics materials that will enable new technology in the PCB world. He also talks about their "Accomplish Change Together" program.
No Substitute for Experience: Dan Beaulieu on EXPO, the Industry and I-Connect007
Industry veteran and consultant Dan Beaulieu, owner of DB Management, and I-Connect007 Publisher Barry Matties, sat down at IPC APEX EXPO to reminisce on Beaulieu’s more than four decades in the business, the trend toward a more marketing savvy industry and how strategic consulting often plays out for companies in this industry.
A Conversation with Gaby Waisman, Orbotech, Ltd.
During the recent HKPCA and IPC Show, held in Shenzhen, China, I sat down with Gabby Waisman, President, Orbotech Pacific. We discussed the exciting electronics market in Asia, the market for Laser Direct Imaging (LDI), AOI and AOR among other things.
Basic Principles of Polymer Thick Film Flexible Circuits
Polymer thick film circuits are similar to their rigid and flexible counterparts; however, because of the materials and processes, they have their own very specific design rules. Because most PTF processing is most commonly based on screen printing technology, the limits of design are intrinsically linked to the printed ink's processing considerations and limitations.
Sustainability: What and Why?
Joe Fjelstad writes, "The resources of our planet are limited and thus are diminishing as we continue to unleash and ramp-up a seemingly never-ending flow of products to both serve and amuse us with output of the global electronics industry likely to be nearing the top of the list of 'offenders.' In that regard, we are becoming victims of our own success, to one degree or another."
Ventec USA Prepares for Growth
Technical Editor Pete Starkey writes, "IPC APEX EXPO 2014 in Las Vegas, Nevada, gave me the opportunity to catch up with Ventec USA President Jack Pattie and to meet the recently-appointed General Manager of the Ventec Fullerton Southern California facility Ray Young. The pair also gave an update on current developments and future company plans."