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HDPUG Demonstrates Benefits of Cooperative R&D

The High Density Packaging User Group (HDPUG) is a member-driven, non-profit, project-oriented industry consortium that addresses the integration of new electronics component packaging and interconnection technologies into the supply chains of its member companies.

The Flex-to-Fit Approach

The flex-to-fit concept reminds us that creativity and engineering go hand-in-hand. When there is not ample space for a conventional approach, this process, which is the convergence of the mechanical world and the electronics world, results in the ability to design a flexible circuit along the contour of an existing, irregularly shaped structure.

Flexible, Stretchable, and Wearable: If You Can Dream it, You Can Create it!

We originally intended the June issue of The PCB Magazine to be centered on flexible circuits, but it quickly became apparent that we needed to broaden the scope and include all (well, at least some) of the new and exciting things going on these days in the world of flexible everything. As such, we have garnered a trove of authors, with much information to impart on the above mentioned.

NEPCON China 2015 a Resounding Success in Shanghai

The three-day event was a complete success, bringing together nearly 22,000 trade visitors and high-quality buyers, as well as 450 leading brand names from 22 countries and regions worldwide. NEPCON China keeps up with market trends and gathers resources from all stakeholders to present a comprehensive event that covers SMT, new electronics materials, soldering, dispensing, electronics automation, measurement and other innovative technologies and products across the world.

Flexible Circuits and UAV Applications

The utility offered by flexible circuits in UAVs mimics the advantages that make it popular in other portable electronic applications: lightweight, thin, highly reliable, flexible during use, and an ability to electrically connect across multiple layers as part of a complete packaging interconnect solution.

iNEMI Managing Director: New, Disruptive Technology on the Horizon

Dr. Haley Fu, managing director of Asia Pacific for iNEMI, and Publisher Barry Matties spoke recently. Fu gave her overview of the last eight years with iNEMI along with her opinion of what the most significant changes have been, globally and for the Asia market in particular. She predicts that in the future, the PCB will probably adopt optical architectures instead of copper, because using copper for the trace means that the land space and the property will not satisfy the future high-speed data transport rate.

An Interview with Gardien Group’s Jason Fraser

Gardien Group CEO Jason Fraser talks to Dan Beaulieu about some of the latest developments at the company, some of the technology trends driving the company's strategies, as well as provides his outlook as to where the PCB industry is headed.

Being Flexible in a Rigid World

With double-digit growth in the foreseeable future, flexible printed circuits (FPC), have found a tremendous niche as an enabler for various electronic applications. This trend is expected to drive the need to increase productivity while improving performance and reducing costs. Of course, in order to sell flex, one must tackle the unenviable task of metalizing these often difficult-to-plate materials.

IMPACT 2015: An In-Depth Look

IPC understands that presenting a unified voice for the electronics industry is essential for advancing policies that affect the industry’s long-term future and strengthens the U.S. and global economy. That is why 22 IPC member-company executives descended on the nation’s capital for IMPACT 2015: IPC on Capitol Hill, IPC’s annual advocacy event.

Stretchable Inks: Changing the Wearables Market and the Landscape of Manufacturing

I-Connect007 Publisher Barry Matties and DuPont’s Steven Willoughby and Michael Burrows spoke recently and discussed new material for wearable electronics: stretchable inks. Wearable electronics is a fast growing sector of the electronics industry that is inspiring new and exciting products, as well as changing the requirements for becoming an electronics manufacturer.


High-Density Interconnects: Enabling the Intelligence of Things

HDI layers and sub-composites with laser-drilled vias combined with stacked, copper-filled vias up to 16 layers have become the state-of-the-art in circuit design for the newest generation of mobile phones, wearable electronics, and IoT modules.

Design Considerations: Flexible Circuit vs. Traditional PCB

The tactics for flexible circuit design don’t differ much from that of traditional PCBs. All of the typical specifications still apply and we add a few more things that require special attention. Cover layers require bigger openings than traditional solder mask, trace directions matter in the flex areas and miters should be round instead of angular.

Insulectro Alliance with Freedom CAD

Ken Parent, Vice President of Sales at Insulectro, recently sat down with I-Connect007 Publisher Barry Matties for a quick chat about the strategic alliance that Insulectro is pursuing with Freedom CAD. Parent explains how this new strategic effort is working, and what it means for customers--and OEMs.

An Optical Update with TTM

Barry Matties recently met with Marika Immonen, manager of R&D optical interconnects at TTM Technologies. They last spoke one year ago. This time, they discussed the optical project that she’s been leading, as well as the future of optical technology in the PCB industry.

Nine New Exciting Products Introduced

Insulectro's VP of Sales, Ken Parent, discusses new products including high-speed laminate, high-temp flex materials, LDI dry film, conformal back-up material for flex-rigid,and printed electronics materials that will enable new technology in the PCB world. He also talks about their "Accomplish Change Together" program.

Inkjet-printed Liquid Metal Could Bring Wearable Tech, Soft Robotics

New research shows how inkjet-printing technology can be used to mass-produce electronic circuits made of liquid-metal alloys for "soft robots" and flexible electronics.

Matrix Product Lines: Laminates and Drills

Fred reviews the Panasonic line of laminates, including high speed and flex materials. Hans discusses Jinzhou's new drill design for high aspect ratio drilling, as well as the opening of several high-tech re-pointing centers in North America.

Multek CTO Excited About the Challenges of the Fast-Moving Wearables Market

I-Connect007 Publisher Barry Matties and recently-appointed Multek CTO Dr. Joan Vrtis sat down at IPC APEX EXPO to discuss the rapidly evolving wearables market, especially for medical, and the myriad questions that must be addressed. Other topics include Multek’s contribution to the wearables industry and what it sees as the main challenges to putting their circuits into various applications.

No Substitute for Experience: Dan Beaulieu on EXPO, the Industry and I-Connect007

Industry veteran and consultant Dan Beaulieu, owner of DB Management, and I-Connect007 Publisher Barry Matties, sat down at IPC APEX EXPO to reminisce on Beaulieu’s more than four decades in the business, the trend toward a more marketing savvy industry and how strategic consulting often plays out for companies in this industry.

Are There Advantages to Changing Your Registration System?

I-Connect007 Publisher Barry Matties recently had a conversation with DIS's Tony Faraci at IPC APEX EXPO 2015, to learn more about their pinless registration system. What was most interesting to Barry are the potential advantages a pinless system offers and if so, why the process has not been widely adopted.


RF Microwave Boards: What's Driving the Technology?

Dan Beaulieu speaks with John Bushie from American Standard Circuits at IPC APEX EXPO. They discuss RF microwave boards, which are being driven by the need for better impedance control.

Ingredients for Success at All Flex

Dave Becker from All Flex talks with guest editor Kelly Dack about the five Keys for success in PCB manufacturing, It’s not just the technology! You have to spend time on corporate culture. The five key ingredients are…

A Conversation with Andy Michniewicz

Gul Technologies (Gultech) is not your traditional offshore supplier. It is a true industry leader when it comes to technology. A few months ago, I sat down to talk with Mayne-McKenney’s Andy Michniewicz. His company represents Gultech here in North America and they were just starting a project to expand Gultech’s market reach on this side of the globe. I found that interview interesting enough that I wanted to follow up and see how things were going now that a few months have passed.

Opportunities for 3D Printed Structural Electronics

Today's 3D printers have many limitations, but the boundaries are being pushed and exciting developments are continuously being made. One of the most promising recent developments in the world of 3D printing is multimaterial printing, which holds the key to the emergence of 3D printed electronics.

CES 2015: Preview and Predictions

Looking back over the last five years of CES and analyzing predictions and items featured by the large exhibitors, you'd likely assume the 2015 show would feature more advanced 3D TVs, as they were predicted to take over the market...wrong!

Japan PWB Market: 2015

The downturn in business for the Japanese PWB industry can be blamed on a domino effect. The rigid circuit board segment relied heavily on business from domestic electronics companies such as Panasonic, Sony, and Sharp. Unfortunately, these electronics giants continue to lose market share and the downturn in business directly impacts the PWB industry.

A Conversation with Gaby Waisman, Orbotech, Ltd.

During the recent HKPCA and IPC Show, held in Shenzhen, China, I sat down with Gabby Waisman, President, Orbotech Pacific. We discussed the exciting electronics market in Asia, the market for Laser Direct Imaging (LDI), AOI and AOR among other things.

Printed Electronics in Perspective

A significant amount of press coverage has been given to printed electronics over the last several years. What appears to have precipitated the explosion of interest in the middle of the last decade was a report that suggested PE would dominate electronic production by the mid-2020s with an annual market of over $300 billion. Joe Fjelstad takes a closer look.

Basic Principles of Polymer Thick Film Flexible Circuits

Polymer thick film circuits are similar to their rigid and flexible counterparts; however, because of the materials and processes, they have their own very specific design rules. Because most PTF processing is most commonly based on screen printing technology, the limits of design are intrinsically linked to the printed ink's processing considerations and limitations.

Sustainability: What and Why?

Joe Fjelstad writes, "The resources of our planet are limited and thus are diminishing as we continue to unleash and ramp-up a seemingly never-ending flow of products to both serve and amuse us with output of the global electronics industry likely to be nearing the top of the list of 'offenders.' In that regard, we are becoming victims of our own success, to one degree or another."


Ventec USA Prepares for Growth

Technical Editor Pete Starkey writes, "IPC APEX EXPO 2014 in Las Vegas, Nevada, gave me the opportunity to catch up with Ventec USA President Jack Pattie and to meet the recently-appointed General Manager of the Ventec Fullerton Southern California facility Ray Young. The pair also gave an update on current developments and future company plans."
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