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Sustainability is happening. Your organization either sees it as a cost of doing business, or an opportunity to improve overall business operations. So, how do we embrace this shift? How do we keep up—or ahead—so we don’t get swept to the side?
Sustainability is happening. Your organization either sees it as a cost of doing business, or an opportunity to improve overall business operations. So, how do we embrace this shift? How do we keep up—or ahead—so we don’t get swept to the side?
Thinking sustainably touches virtually every aspect of our lives, from how we conduct ourselves personally to how we conduct our businesses: Don’t use something unless you have to, design products that minimize raw materials, and reclaim the materials once you’re done with them—these are the new maxims for us all. We don’t need to be misers; we just need to be smarter about our usage.
The big question is, “How do we get started?” In this issue of SMT007 Magazine, we take on that challenge. We asked several organizations either in the industry, or tangential to it, and as was expected, the responses lined up closely with their mission statements.
Sustainability is happening. Your organization either sees it as a cost of doing business, or an opportunity to improve overall business operations. So, how do we embrace this shift? How do we keep up—or ahead—so we don’t get swept to the side?
Features
Article
Columns
Hiring the right employees is always a challenge, especially in today’s business environment where there are fewer technical experts in the candidate pool and a shortage of labor overall. Once you’ve hired someone, how do you get them up to speed quickly?
Hiring the right employees is always a challenge, especially in today’s business environment where there are fewer technical experts in the candidate pool and a shortage of labor overall. Once you’ve hired someone, how do you get them up to speed quickly? In this issue, we look at skill training to maximize new hire effectiveness.
Features
Columns
Interview
In today's landscape, electronics manufacturing services face some key strategic opportunities to not only grow their businesses but also to advance the industry economically and technologically. The challenge is to collaborate as well as simultaneously compete.
Electronics manufacturing services face some key strategic opportunities to not only grow their businesses but also to advance the industry economically and technologically. In order do this effectively, the challenge is to collaborate as well as simultaneously compete. Cue the re-emergence of technical conferences as a forum for responding to the changing EMS landscape.
Features
Articles
Columns
In this issue, we deliver a wide-angle view of the industry–a perspective from a somewhat higher altitude–where we look for common areas of thought. Is there a “hive mind” to discover?
In this issue, we deliver a wide-angle view of the industry–a perspective from a somewhat higher altitude–where we look for common areas of thought. Is there a “hive mind” to discover?
Many of you have shared with us the buzz–the vibration–of an industry in ascent. We’ve seen it, felt it, heard it at industry gatherings. There’s plenty for us to do, so the question becomes, what’s on everybody’s mind?
We took a higher-level perspective and asked that very question. To understand the general mindset, we conducted a series of interviews with EMS providers in order to gather a sense of how business is progressing. The result was frank and insightful commentary.
Now, our question to you is, does this match what’s on your mind?
Features
More Content
Conferences and trade shows are valuable resources. Now that the 2022 trade show season has closed and IPC APEX EXPO 2023 is behind us, it’s time to make a strategic plan from all the pieces of information you’ve gathered for the year ahead.
Conferences and trade shows are valuable resources. Now that the 2022 trade show season has closed and IPC APEX EXPO 2023 is behind us, it’s time to make a strategic plan from all the pieces of information you’ve gathered for the year ahead.
Conferences and trade shows are valuable resources. Now that the 2022 trade show season has closed and IPC APEX EXPO 2023 is behind us, it’s time to make a strategic plan from all the pieces of information you’ve gathered for the year ahead.
On our cover, we showcase a mass of LEGO® Bricks because it represents the pieces of separate bits of information gleaned from networking with other industry professionals that we must then assemble into a cohesive strategy afterward. For us engineer types, the compulsion to make order out of those bricks is very real. Turning your conference and trade show knowledge into action in the factory should feel just the same.
Feature Articles and Interviews
Columns
Interview
New advanced component packaging techniques are moving the boundaries between printed circuit fabrication and semiconductor fabrication. In this issue, we open the discussion about how advanced packaging will change the structure of our industry.
As semiconductor companies seek ways to prolong Moore's Law, new advanced component packaging techniques are moving the boundaries between printed circuit fabrication and semiconductor fabrication. What will be the impact on the EMS industry? In this issue, we open the discussion about how advanced packaging will change the structure of our industry.
Features
Articles
Columns
In this issue, we bring you preview information for IPC APEX EXPO 2023. In the spirit of helping to plan your time at this event, consider this issue your roadmap for success before you even cross the threshold onto the show floor at the San Diego Convention Center.
In this issue, we bring you preview information for IPC APEX EXPO 2023. In the spirit of helping to plan your time at this event, consider this issue your roadmap for success before you even cross the threshold onto the show floor at the San Diego Convention Center.
FEATURED CONTENT
FEATURED COLUMNS
SPECIAL APEX COVERAGE
COLUMNS
ARTICLES
In this issue, we look at just some of the challenges in navigating the maze of workflow management. We look for the new best practices emerging from EMS firms. How does one best protect from parts issues and scheduling changes? How do your new best practices stack up?
One of the most expressed struggles in electronics assembly today is the constant fluctuation of component availability. Don’t get us wrong; component availability is not the root cause, it’s simply the symptom that is the most obvious and painful at the moment. Workflow management is an ongoing challenge, a candidate for continuous improvement. Parts shortages may, however, cause EMS companies to look harder at processes that worked before, but don’t now.
In this issue, we look at just some of the challenges in navigating the maze of workflow management. We look for the new best practices emerging from EMS firms. How does one best protect from parts issues and scheduling changes? How do your new best practices stack up?
Features
Feature Columns
Special Coverage
Columns
Article
Along with the exhibition space, SMTA International delivers one of the strongest technical conferences in the electronics manufacturing market. This issue provides you with a detailed pre-show guide for the upcoming event.
One of the best places to get back into the swing of trade shows is SMTA International (SMTAI), taking place Oct. 31–Nov. 4, in Minneapolis. The event is co-located with the four other shows that comprise the MD&M show. Besides providing an expo floor showcasing what’s new in the market, SMTAI also delivers one of the strongest technical conferences in the electronics manufacturing space. In response, we’re devoting this issue of SMT007 Magazine to pre-show coverage of SMTA International. One of our goals with this issue is to give attendees and exhibitors a detailed guide to the event. In addition, if you, or perhaps your supervisor, need some convincing as to why you should attend SMTAI this year, then this issue will help you make your case.
Features
More Show Information
Columns
Managing one’s suppliers takes extra work and attention right now, but there are methods and solutions available. There is light at the end of the tunnel, so to speak.
Our September issue examines the wider set of challenges currently in the supply chain. Managing one’s suppliers takes extra work and attention right now, but there are methods and solutions available. There is light at the end of the tunnel, so to speak. The question is, are you taking advantage of as many of these methods and solutions as you should?
Features
Feature Columns
Columns
Finding relief from supply 'pain' points should be a mix of both strategic and tactical responses. In this issue, we examine a variety of steps being taken in the industry, from the halls of government to the manufacturing floor—all meant to relieve the pressure and move you forward.
After two years in survival mode, it’s time for electronics manufacturers to go on the offensive. Finding relief from pain points should be a mix of both strategic and tactical responses. In this issue, we examine a variety of steps being taken in the industry, from the halls of government to the manufacturing floor—all meant to relieve the pressure and move you forward.
Feature Interviews
Digi-Key Drilling Down on Counterfeit with Levy Olson and Kelsey Lawrence
Q4 Concerns: Hold On to Your Hats with Shawn DuBravac
Printed Circuit Boards: Past the Lobby and Onto the Floor with U.S. Rep. B. Moore and T. Kelly
Feature Articles
A Framework for Managing Supply Chain Disruption by Chintan Sutaria
Thriving Through Greater EMS Collaboration by Christopher Peters
Columns
Supply ‘Pain’ Management by Nolan Johnson
In Search of Wisdom by Jennie Hwang
Soldering for QFP and Other Gull Wing Leaded Parts by Bob Wettermann
Teaching About Solder Paste by Dr. Ronald C. Lasky
Article
The CMMC 2.0 Countdown: Will You Be Ready When the Clock Hits Zero? By Divyash Patel
Data security is now a business imperative. Whether your approach to data security is defensive, evolutionary, or competitive, your timing can either be reactive or proactive. In this issue, we look at data security initiatives and ask, “Can this be accomplished affordably?”
Data security is now a business imperative. Whether your approach to data security is defensive, evolutionary, or competitive, your timing can either be reactive or proactive. In either case, you will be responding to data security whether you like it or not. In this issue, we look at data security initiatives and ask, “Can this be accomplished affordably?”
Features
Additional Content
Whether your goal is to expand capabilities without investing in a new facility, or encouraging customer loyalty through purchasing convenience, or some other reason, the point is that collaboration and partnership can play a pivotal role in achieving your goals.
While there’s a place for competition in the current market, collaboration is even more effective as a growth strategy. But when and how? Whether your goal is to expand capabilities without investing in a new facility, or encourage customer loyalty through purchasing convenience, the point is that collaboration and partnership can play a pivotal role in achieving those goals.
Features
Articles
Columns
The requirements for assembly continue to move toward smaller components and higher densities. But what are the challenges that accompany this steady shift? In a series of interviews, articles and columns, we learn what assemblers are really facing.
The requirements for assembly continue to move toward smaller components and higher densities. But what are the challenges that accompany this steady shift? In a series of interviews, articles and columns, we learn what assemblers are really facing.
Features
Feature Columns
Interviews
Columns
Global industry watchdogs are making the point that the Factory of the Future is actually the "Factory of the Now," and that North America is five to 10 years behind in adoption. So, what's it going to take for North America to catch up?
Global industry watchdogs are making the point that the Factory of the Future is actually the "Factory of the Now," and that North America is five to 10 years behind in adoption. So, what's it going to take for North America to catch up?
Features
Feature Columns
More Content
In this issue, we look at the state of the industry: What is being done about the supply chain? Will governments recognize what’s missing? And can the U.S. ever gain back what it once had?
Two high-profile pieces of legislation in the United States and Europe seek to encourage semiconductor capacity but leave out the equally important reliance on printed board fabrication and assembly. In this issue, we look at the state of the industry: What is being done about the supply chain? Will governments recognize what’s missing? And can the U.S. ever gain back what it once had?
Features
Real Time with… IPC Video Interviews
An Interview and More Articles
Columns
Rising input costs are causing EMS companies to rethink pricing, suppliers and supply chains, labor, and how all those interrelationships function. We report on the current status of increased input costs and explore strategies to help reduce the risk and cost associated with today's marketplace.
Rising input costs are causing EMS companies to rethink pricing, suppliers and supply chains, labor, and how all those interrelationships function. In this issue we report on the current status of increased input costs and explore strategies to help reduce the risk and cost associated with today's marketplace.
Feature Interviews
Feature Articles and Columns
Special Coverage
Columns
Just as with consumer goods, supply chain concerns can easily lead to counterfeiting issues in electronics manufacturing and cybersecurity is equally concerning. This issue contains several articles on cybersecurity, and we discuss counterfeiting challenges.
Just as with consumer goods, supply chain concerns can easily lead to counterfeiting issues in electronics manufacturing. Meanwhile, cybersecurity is equally concerning. In this issue, we bring you several articles on cybersecurity, and we discuss what you need to know to leverage smart factory offerings to better manage supply chain and counterfeiting challenges.
Features
Columns
Article
Special Section: IPC APEX EXPO 2022 on the Show Floor—Factory of the Future
This month, we bring you IPC APEX EXPO 2022 show-related interviews with IPC leadership, how-to information, preshow details, and insight from industry experts. As you pack your bags, your briefcase full of standards documents, and your trade show booths, use this issue to help you plan a successful trip.
It’s the IPC APEX EXPO Preview issue! This month, we bring you show-related interviews with IPC leadership, how-to information, preshow details, and insight from industry experts. As you pack your bags, your briefcase full of standards documents, and your trade show booths, use this issue to help you plan a successful trip.
Feature Interviews
Feature Articles
Interview
Columns
We spoke with test and inspection experts to see exactly what’s going on these days. EMS companies have new options to consider in their inspection practices with the latest technologies and methods, along with AI and advancing data collection.
For this month’s issue, we spoke with the experts to see what’s currently going on with test and inspection. EMS companies have new options to consider in their inspection practices with the latest technologies and methods, along with AI and advancing data collection. We look at how new capabilities drive on-floor best practices, and how new manufacturing challenges are influencing equipment design.
Feature Interviews
Articles
Columns
Now more than ever, market drivers, technical advances, factory automation and customer demand are pushing assembly capabilities into new territory. With these advancements, comes the need to incorporate new equipment or even new facilities.
Now more than ever, market drivers, technical advances, factory automation and customer demand are pushing assembly capabilities into new territory. With these advancements, comes the need to incorporate new equipment or even new facilities. In this issue, we investigate strategies and tactics for planning capital expenditures.
Features
Columns
Article
This month we’re considering the bill of materials (BOMs) and the unique challenges facing procurement and manufacturing under current conditions. As we explore BOMs and their future role, we discover that the need to control all of the complexity is the impetus to a creative new process.
This month in SMT007 Magazine, we’re considering the bill of materials (BOMs) and the unique challenges facing procurement and manufacturing under current market conditions. Components are hard to find, which is a situation that starts the discussion, of course. But as we find in this issue, the role of the BOM is becoming even more influential as Industry 4.0 becomes more the norm. No longer can a design team short-cut the BOM process. Join us as we explore BOMs and their future role and discover the need to control all the complexity as the impetus to a creative new process in BOM management.
In this issue, we help to define some of the communication gaps and needs between electronic manufacturing services (EMS) and PCB designers. Our interviews and articles highlight the tools and methods that help to bridge the gaps in the communication channel.
We hope that his issue will help define some of the communication gaps and needs between PCB designers and electronic manufacturing services. Our interviews and articles highlight the tools and methods that help to bridge the gaps in the communication channel.
Features
Articles
Columns
In this issue we look at the key contributing factors that affect reliability challenges on your manufacturing floor. We help you run the gamut from specifications and standards to assembly and testing.
In this issue we look at the key contributing factors that affect reliability challenges on your manufacturing floor. We help you run the gamut from specifications and standards to assembly and testing. And because reliability ultimately boils down to the solder joint, this issue includes details on the latest thinking on cleanliness, solder joints, industry standards, and more.
One key factor to a strong, reliable, successful solder joint is ensuring the right conditioning of the surfaces to be soldered. Then, once the solder joints are in place, protecting those joints from environmental stresses is crucial.
One key factor to a strong, reliable, successful solder joint is ensuring the right conditioning of the surfaces to be soldered. Then, once the solder joints are in place, protecting those joints from environmental stresses is crucial. In this issue, we investigate the current state of cleaning and coating as forms of surface preparation and protection.
Features
Articles
Columns
In this important issue, we work to raise the awareness of 3,000 volunteers working IPC committees, and the value they bring to the industry. We bring you status reports from key committees as well as a historical perspective of past achievements.
In this important issue, we work to raise the awareness of 3,000 volunteers working IPC committees, and the value they bring to the industry. We bring you status reports from key committees, along with trends the committees are identifying, as well as a historical perspective of past achievements.
In this issue, we once again take a firm hold on the supply chain. We investigate how to manage the reliability and the quality in your supply chain, question typical thinking and ask what skills your supply chain manager should possess.
We just can’t seem to keep the supply chain out of the news, now can we?
In this issue, we once again take a firm hold on the supply chain. We investigate how to manage the reliability and the quality coming from your supply chain. We question typical thinking about suppliers and criteria for success, and we ask what sort of skills your supply chain manager should possess.
After navigating through the content in this issue, you should be able to throw another loop of chain around the capstan and deliver more meaningful leverage to keep your own supply chain from going sideways.
In this issue, we explore smart processes in assembly. We look wider and deeper at smart processes by examining the value of a chief process improvement manager (CPIM) in your organization, considering smart and optimized procurement practices, and much more.
In this issue of SMT007 Magazine we invite you to put on your “thinking cap” of exploration into smart processes in assembly. First, we ask, “What is a smart process?” We also look wider and deeper at smart processes, including the value of a chief process improvement manager (CPIM) in your organization. We consider just how smart and optimized procurement practices can positively affect more than simply finding the lowest prices. We also bring you a recent technical paper on PCQR2, and we discuss the role process engineering has on the profitability of your business.
Think we’re done? Not yet. Our columnists explore UL certification, how IoT is changing how we design boards, salvaging valuable components for reuse, and counterfeit components. Plus, we include a short overview of control theory for deeper smart process background.
So, put on your “thinking cap” and join us!
Article
Imagine, if you will, an IPC APEX EXPO without a physical venue. Join your colleagues as we all journey into “The Virtual Zone.” We also include highlights from the recent virtual edition of the CES 2021 show.
Imagine, if you will, an IPC APEX EXPO without a physical venue. Join your colleagues as we all journey into “The Virtual Zone.” We also include highlights from the recent virtual edition of the CES 2021 show.
Features IPC APEX EXPO 2021 Preview
Real Time with... IPC APEX EXPO VIRTUAL: The Top Five Things You Need to Know About...
CES 2021 Special Coverage
Columns
Continuous improvement not only can improve the targeted process, but often results in additional hidden benefits. In this issue, we launch our year exploring continuous improvement.
Continuous improvement not only can improve the targeted process, but often results in additional hidden benefits. Moreover, continuous improvement need not be a large project; numerous small improvements can snowball into large gains.
As we start the new year—what we are calling the year of continuous improvement—it’s a good time to start with the simple process improvement formula: X = Xc – 1. When you look at any current process (Xc), the question you want to ask (and have your coworkers ask) is, “How can we reduce (Xc) by (1)?” It could be one day, one hour, one minute, one less piece of material, one less percent of scrap, one less form to fill out, or it could even be lowering a risk factor or other even less tangible things. By reducing (Xc) by (1) we now have a new (X) and the process starts over.
The tricky part can be deciding what to choose for your first (X). In the early phases of process improvement, the common advice is to start with small improvement projects and grow from there. By doing so, you and your team will be able to feel and celebrate the success and benefits gained.
Features
Columns
Technical Article
Even in our skilled, technology-heavy industry, some entry-level manufacturing positions seem to turn over as rapidly as the drive wheels of a locomotive. You can, however, stop the churn-and-burn approach and start recruiting young, well-trained employees more likely to stay put.
Even in our skilled, technology-heavy industry, some entry-level manufacturing positions seem to turn over as rapidly as the drive wheels of a locomotive. You can, however, stop the churn-and-burn approach and start recruiting young, well-trained employees more likely to stay put. How, exactly? That’s what this issue is all about.
As the wise conductor on The Polar Express says, "One thing about trains: It doesn't matter where they're goin'. What matters is deciding to get on."
It's time to start believing in the process of hiring and training for the long haul.
Features
Feature Columns
Articles
The role of test and inspection is shifting. But how does the role of test and inspection change?
The role of test and inspection is shifting and it is this shifting that we set out to study for this issue. We explore answers to the following questions: How does the role of test and inspection change? What are manufacturers asking of their inspection equipment? What are manufacturers supplying in response? Who’s leading the changeover—equipment manufacturers or their customers? These questions—and this shift in role for inspection—is the natural result of digital factory infrastructure development in the form of AI, interoperability protocols and big data. In the long term, expect a lot of development attention to go from collecting data to analyzing and using that data.
Features
Columns
Article
This month (just in time for strategic planning), we talk roadmaps with those who make them and those who use them.
We reached out to a number of organizations doing roadmap work, as well as industry professionals volunteering during their personal time. What’s clear is that creating a technology roadmap is not an easy task. This month (just in time for strategic planning), we talk roadmaps with those who make them and those who use them.
Features
Articles/Interviews
Columns
As sure as the sun rises, defects cost you resources. They cascade through the product’s life cycle and can affect your company’s reputation. Businesses lose money when they burn extra resources, like labor, capacity, employee morale, and potential customer liability. This month, we ask the question, “What are the best methodologies for maximizing manufacturing reliability?”
Features
Happy Holden Presents: Special Coverage From IPC High-Reliability Forum
Articles
Columns
If inventory management is still mostly a manual procedure on your shop floor, then there’s an opportunity to reduce labor, increase efficiencies, and improve profit margins. We take stock of the industry protocols, blockchain solutions, and new inventory management hardware and software.
If inventory management is still mostly a manual procedure on your shop floor, then there’s an opportunity to reduce labor, increase efficiencies, and improve profit margins. We take stock of the industry protocols, blockchain solutions, and new inventory management hardware and software.
Features
Articles
During this COVID-19 outbreak, businesses around the world are rethinking their manufacturing and supply chain strategies. In this issue, we bring you ideas, examples, and resources to help you rethink your own business practices. Join us as we consider the process of rethinking manufacturing.
During this COVID-19 outbreak, businesses around the world are rethinking their manufacturing and supply chain strategies. Join us as we consider the process of rethinking manufacturing. We reached out to a wide range of thought leaders on the topic, and they certainly had something to say. Inside the issue, you’ll find feature interviews with IPC’s Shawn Dubravac and Matt Kelly, Robert Murphy from Rockwell Automation, Dave Ryder and Eric Cormier from Prototron, and Chris Peters from the U.S. Partnership for Assured Electronics. You will also find insights from Robert Murphy, Ross Berntson, and Dan Beaulieu.
Features
Columns
Responding to rapid changes in our industry and the demands put on it is a test of leadership and corporate skill sets. This issue looks at how we adapt, respond, and change in order to move forward.
Responding to rapid changes in our industry and the demands put on it is a test of leadership and corporate skill sets. This issue looks at how we adapt, respond, and change in order to move forward. As we all try to make sense of the world around us these days, we invite you to put your brain to the test with our optical illusion cover. How many levels do you see? Illusions like this remind us that we don’t always see what we think we do at first glance.
Features
Feature Columns
There is more happening in the solder and soldering technology space than one might think. In this issue, we chart the flux and flow of advancements in soldering.
There is more happening in the solder and soldering technology space than one might think. In this issue, we chart the flux and flow of advancements in soldering. In our February "Fine Pitch" issue, we learned that the critical point for the manufacturing of electronics using smaller and smaller components was the soldering process—sticking the components to the board, simply put. There was so much information in this space that we decided to come back with a focus solely on the topic of solder technology.
Features
Feature Columns
Columns
We continue our exploration of implementation details for smart factories with resources and ongoing examples demonstrating that the real innovation in a smart factory comes from your business practices. Don't miss our exclusive in-depth conversation with aviation design superstar Burt Rutan following his IPC APEX EXPO 2020 keynote.
We continue our exploration of implementation details for smart factories with resources and ongoing examples demonstrating that the real innovation in a smart factory comes from your business practices. Don't miss our exclusive in-depth conversation with aviation design superstar Burt Rutan following his January 2020 keynote at IPC APEX EXPO.
Features
Articles
Columns
In part 1 on this subject, while we set out to explore implementation details for smart factory concepts and expected to talk about sensors and protocols it became clear as we dug deeper, that, in the end, the real smart factory innovation involves your business practices.
In part 1 on this subject, we set out to explore implementation details for smart factory concepts and expected to talk about sensors and protocols. As we dug deeper, it became clear that, in the end, the real smart factory innovation involves your business practices.
Next month, we continue our look at smart factory implementations from planning to rollout and from investment to profitability. Stay tuned!
Features
Articles
Columns
While this issue may be about finer pitches in manufacturing and packaging, to successfully manufacture circuit boards in this time of shrinking components and board features, the secret is to ensure success with the solder joints.
While this issue may be about finer pitches in manufacturing and packaging, to successfully manufacture circuit boards in this time of shrinking components and board features, the secret is to ensure success with the solder joints. Manufacturers will need the tools, options, and human expertise to succeed at this level.
Features
Feature Columns
Articles
Columns
IPC APEX EXPO celebrates 20 years, which makes the event’s history a 21st-century story. In this issue, you will find the history, the present, and the future of the electronics manufacturing industry.
Our IPC APEX EXPO preview issue! IPC APEX EXPO celebrates 20 years, which makes the event’s history a 21st-century story.
In this issue, you will find the history, the present, and the future of the electronics manufacturing industry. See you in San Diego!
Features
Special Features
Article
Columns
No matter your age or experience level, we all need to be continuous learners. In this issue we bring you some of the newest and highest impact topics. Read about insightful industry perspectives.
No matter your age or experience level, we all need to be continuous learners. In this issue we bring you some of the newest and highest impact topics. Read about insightful industry perspectives and the latest announcements from productronica 2019 to help further your expertise.
FEATURES
Interviews:
Article:
Risk Mitigation: An Essential Guide by Kimberly Johnson and Tony Torres
Columns:
More content:
This month, we embark on a tour of the industry, capturing different perspectives and bringing them to the fore. Sometimes, the best view of an industry or a community is through individual experiences. In this issue, we talk to members of the electronics industry who were willing to share their voices and points of view.
This month, we embark on a tour of the industry, capturing different perspectives and bringing them to the fore. Sometimes, the best view of an industry or a community is through individual experiences. In this issue, we talk to members of the electronics industry who were willing to share their voices and points of view.
Features
Feature Columns
Articles
With so many new and emerging market drivers and influences—from technology to new product applications, environmental and government pressures, and human factors, such as staffing and expertise—the landscape of the industry is undergoing multiple changes.
With so many new and emerging market drivers and influences—from technology to new product applications, environmental and government pressures, and human factors, such as staffing and expertise—the landscape of the industry is undergoing multiple changes.
This issue launches a multi-month, thoughtful look across all of our magazine titles as we explore the shifts and the trends causing these changes.
Features
Article
Columns
There are rules, and then there are recommendations; one person’s rule might be another person’s recommendation and vice versa. That is where standards come into play. What are they? What do they mean? How do they get specified? And what are the impacts on our industry?
There are rules, and then there are recommendations; one person’s rule might be another person’s recommendation and vice versa. That is where standards come into play. What are they? What do they mean? How do they get specified? And what are the impacts on our industry?
This month, we hear from a variety of industry leaders who weigh in on how standards are created and their impact on us all.
Features
Articles
Columns
In this issue, we look at how the new manufacturing demands are driving change and innovation in conformal coating products, systems, and technologies.
In this issue, we look at how the new manufacturing demands are driving change and innovation in conformal coating products, systems, and technologies.
Features
Columns
It should come as no surprise that solder and solder joints are often at the center of attention in electronics assembly when discussing failures and reliability. Enter “Reliability Man” the hero who must persevere against all the challenges thrown in his path.
It should come as no surprise that solder and solder joints are often at the center of attention in electronics assembly when discussing failures and reliability. This issue includes articles and columns from industry experts as well as insightful technical papers from IPC APEX EXPO 2019 on the cutting-edge of failure and reliability research.
Features
Feature Columns
Articles
Columns
Do we really think that we can speed up existing processes? Will faster workers or a new line with more throughput be enough to grow with the increased demand? Or does this new market require thinking about the capacity problem in a completely new way?
Do we really think that we can speed up existing processes? Will faster workers or a new line with more throughput be enough to grow with the increased demand? Or does this new market require thinking about the capacity problem in a completely new way?
Michael Ford, senior director of emerging industry strategy at Aegis Software, sets the tone in his conversation with Barry Matties. Ford makes a strong case that the easiest way to streamline your facility is to reduce downtime.
We follow with Brent Fischthal and Jenny Yuh discussing the role optical inspection can have in streamlining assembly both on the floor and as a process improvement.
Denis Barbini, general manager at Laserssel, continues the streamlining theme where they’ve been raising awareness about their novel laser-based soldering technology.
Features
Columns
This issue features extensive in-depth discussions with CMs and assemblers representing a wide range of specialties. Learn how these companies help their clients succeed and grow into #happySMTcustomers.
This issue features extensive in-depth discussions with six different contract manufacturers and assembly houses representing a wide range of specialties, from prototype/startup specialists to medium-scale production and high-complexity mil/aero. Learn how these companies help their clients succeed and grow into #happySMTcustomers.
We start with part six of Dr. Jennie Hwang’s ongoing column featuring the role of bismuth in electronics.
Next, we kick off our coverage of how to make customers successful with “That One Thing,” the first of our overview features. Our showcase contract manufacturers all had a lot to say about the question, “What is the one thing your customers can do to be successful?” Read their insights here.
Then, we give the podium to our returning columnist, Ray Prasad. Following Prasad is our second overview feature, “The Perfect Job,” where our showcase companies share their insight on how to make the handoff to manufacturing as worry-free as possible.
What follows are shortened interviews with each showcase company: mil/aero specialist, Zentech (John Vaughan); Milwaukee Electronics/Screaming Circuits (Duane Benson); Green Circuits (Joe Garcia); Whizz Systems (Muhammad Irfan); and the whole team at Data Electronic Devices (DataED).
Intermixed with the interviews, you’ll also find Mike Fiorilla’s column, The Mannifest. Mike shares practical insight on how to manage your double-sided assemblies. You’ll also meet Alfred Macha with his column on performance improvements through process validation.
In the anchor slot on this issue is columnist Bob Wettermann with his discussion on damaged corner repair techniques.
Features
Columns
It's a courageous new world for our industry, the sheer number of new technologies in development will change not only what we build but how we build it. And the brave youth coming up behind us are perfectly willing to make use of these new technologies.
In our industry, the sheer number of new technologies in development will change not only what our industry builds but how we build it. And the youth coming up behind us are perfectly willing to make use of these new technologies. It's not a brave new world; it is a courageous new world. Apparently, no one told these young people that it couldn’t be done.
Our issue launches with coverage of the IEEE Rising Stars Conference. Next, columnist Eric Camden ponders the impact of “tribal knowledge” in the evolution from design concept to production in his aptly-titled “These Darn Kids/Back In My Day.”
Speaking of kids, our next piece takes us back to Rising Stars perspectives from conference attendees. Following right behind is Barry Matties’ conversation with Jeffrey Diament, a young engineer (and Princeton graduate) developing new sensors at startup Instrumems. Next, Craig Reiselt, CEO at Octane Open Concepts, discusses Octane’s innovative tools for CM floor optimization.
Turning our attention to emerging technologies, we bring you two interviews on battery and sensor technology currently under development with help from the Nano and Advanced Materials Institute (NAMI) based out of Hong Kong. Tracy Liu and David Yeung discuss their work and the forthcoming rollout of their products.
We’re also delighted to premiere a brand-new column! Mike Fiorilla from Manncorp Inc. kicks it off with “When Is It the Right Time To Automate?” Closing the latch on this issue is Vic Markarian from Cadence Systems.
Features
New Column
We’ve been building automated factories for quite a while. However, the time has come for smart factories in our segment of the electronics industry. In this issue, we explore smart factories, the technologies required, and the shift in thinking that Industry 4.0 and smart factories will bring to our world.
We’ve been building automated factories for quite a while. However, the time has come for smart factories in our segment of the electronics industry. In this issue, we explore smart factories, the technologies required, and the shift in thinking that Industry 4.0 and smart factories will bring to our world.
For our first practical example, Barry Matties brings us up to date with DSG’s facility in China. In this factory tour and interview with Mauro Dallora, we learn about the current ongoing expansion and future plans that illustrate how smart factory fundamentals can be a big help to your business.
In “Building a Smart Factory Supply Line”, Barry relays his experiences from his tour of the 236,000 square meter Victory Giant Technology Campus. VGT is a Chinese-based manufacturer implementing smart factory solutions as they continue their growth from traditional manufacturing to automated systems, with an impressive expansion plan.
Neil Sharp discusses four core electronic component packaging issues in “Improving the Efficiency of Your PCBA Production.” Then, Happy Holden’s feature article lays the philosophical groundwork for thinking about smart factories of the future.
A few more interesting interviews come to you from Phoebe Francis, a representative for the Wireless Power Consortium (WPC)—a group at the center of standardizing wireless power systems and Anfield Group’s Chris Humphreys who discusses current cybersecurity concerns in the industry.
Happy Holden returns with “A Working Definition of Automation” and a 10-question quiz about smart factory data in “What Do You Know About Automation?”
In “How Smart is Your Factory?” regular columnist, Eric Camden, reminds us that working smart is not simply equipment and data capture. Bob Wettermann’s column this month focuses on “Inspection of BGAs After Rework.”
Features
Columns
Articles
Survival of the fittest is a maxim in business as well as ecology. In any environment with steadily evolving conditions, success strategies must change to stay on top. This month we look at your selling strategies.
Component supplies, prices, and lead times are in a great deal of turmoil due to a sustained increase in demand for parts, pricing pressures on manufacturers, and premature parts obsolescence. All these factors wreak havoc on electronics manufacturing.
Component supplies, prices, and lead times are in a great deal of turmoil. And there are a LOT of moving parts to this set of circumstances, ranging from a sustained increase in demand for parts, to pricing pressures on manufacturers and premature parts obsolescence. All these factors wreak havoc on electronics manufacturing. In this issue, we explore the drivers and the coping mechanisms from all points of the supply chain.
Feature Articles
Columns
The electronics manufacturing industry continues to grow and change, and there’s no better place to participate in the excitement than at IPC APEX EXPO 2019. In this issue we preview the show, the new events, exhibitions, new technologies, awards, competitions, and standards work.
The electronics manufacturing industry continues to grow and change, and there’s no better place to participate in the excitement than at IPC APEX EXPO 2019. In this issue we preview the show, the new events, exhibitions, new technologies, awards, competitions, and standards work. We even step back with two members of the APEX EXPO board of directors responsible for starting APEX. So take your seat, whether as an attendee or as an industry representative, and let’s get this show started.
Table of Contents
Features
Articles
Interviews
Whether or not you believe this is a golden age for medical devices, there’s no denying that the amount of innovation underway in medical electronics is staggering.
Whether or not you believe this is a golden age for medical devices, there’s no denying that the amount of innovation underway in medical electronics is staggering. If you’re not currently contributing to medical device development, chances are you might find yourself working with medical devices at some time in the future. In this issue, we take you deeper into the technologies, trends, and compliance constraints you’re likely to encounter in your next (or first) medical device.
Table of Contents
Features
Columns
Bonus article
The PCB assembly industry is edging closer to the true vision of Industry 4.0. With IPC’s Connected Factory Exchange (CFX) standard—a common machine communications standard for the electronics assembly supply chain—electronics manufacturing is on its way to become even smarter.
The PCB assembly industry is edging closer to the true vision of Industry 4.0. With IPC’s Connected Factory Exchange (CFX) standard—a common machine communications standard for the electronics assembly supply chain—electronics manufacturing is on its way to become even smarter. This issue of SMT007 Magazine looks at the latest developments in the CFX standard and its overall impact on the PCB assembly process.
FEATURES:
MORE CONTENT:
Internet of Things (IoT), Industry 4.0, artificial intelligence (AI), automation, virtual reality/augmented reality/mixed reality (VR/AR/MR)—and now extended reality (XR)—these are just a few of the trends that are expected to shape the world we are living in today. How will these megatrends impact PCB manufacturing and assembly?
When it comes to megatrends, resistance is futile! Internet of Things (IoT), Industry 4.0, artificial intelligence (AI), automation, virtual reality/augmented reality/mixed reality (VR/AR/MR)—and now extended reality (XR)—these are just a few of the trends that are expected to shape the world we are living in today. How will these megatrends impact PCB manufacturing and assembly?
Articles:
IoT: Driving Change in Manufacturing by Stephen Las Marias
XR Update: Emerging Realities by Dan Feinberg
How CIM and IoT Can Make Your Factory Smart by Zac Elliott
AI-Powered Inspection Interview with Peter Krippner
Innovation is the Motto, Efficiency is the Aim: The Smart Robot Revolution is Here by Pratik Kirve
Columns
The Megadrivers by Stephen Las Marias
Artificial Intelligence: Super-Exciting, Ultra-Competitive by Dr. Jennie S. Hwang
Are Megatrends Putting Your Product at Megarisk? by Eric Camden
Filling the Gap: Underfill Rework by Bob Wettermann
Conformal Coatings: An Evolving Science by Phil Kinner
To clean or not to clean, that is the question...whether tis nobler in the mind to suffer outrageous field failures or take arms against a sea of particles! Alas, cleaning PCB assemblies raises many pros and cons. This issue of SMT007 Magazine will help you decide whether to clean, or not clean your PCB assemblies.
There are many pros and cons to cleaning your PCB assemblies. Cleaning can be an additional capital expenditure, and with miniaturized devices and components, cleaning has become quite difficult to accomplish given the low-standoff heights and component densities in boards. There’s also the issue on shorter and shorter product lifecycles—your phone, for instance. On the other hand, cleaning ensures quality and reliability. So, cleaning depends on many factors. This issue of SMT007 Magazine features the challenges, latest developments, and strategies for cleaning, and will help you decide whether to clean, or not clean your PCB assemblies.
Table of Contents
Features
Columns
Articles
While it is not set in stone, following best practices helps ensure manufacturing excellence. This month we look at best practices in the PCB assembly industry and how to incorporate them into your own manufacturing environment.
While it is not set in stone, following best practices helps ensure manufacturing excellence. This month we look at best practices in the PCB assembly industry and how to incorporate them into your own manufacturing environment.
Table of Contents
Features:
Columns
Articles
Manufacturers are having to navigate critical challenges that rock their boat when faced with assembling flexible printed circuits.
Manufacturers are having to navigate critical challenges that rock their boat when faced with assembling flexible printed circuits. The flex market continues to be one of the fastest growing segments of the circuit board industry, mainly driven by the significant rise in the consumer electronics sector. In this issue, we examine these concerns and highlight some of the strategies and techniques used to address them.
Table of Contents:
Features
Columns
Articles
In line with its significant improvement over current generation of wireless technologies, 5G also offers device and systems manufacturers a challenge—electrical and functional testing, among others—as they deal with the technology’s millimeter wave frequencies.
In line with its significant improvement over current generation of wireless technologies, 5G also offers device and systems manufacturers a challenge—electrical and functional testing, among others—as they deal with the technology’s millimeter wave frequencies. This month’s issue of SMT007 Magazine looks into how the industry can successfully tackle this process.
Table of Contents:
Features
Feature Column
Columns
Articles
A look into the latest developments, challenges, and opportunities in automotive electronics, and why this market continues to drive the overall electronics manufacturing industry.
This month’s issue of SMT007 Magazine looks into the latest developments, challenges, and opportunities in automotive electronics, and why this market continues to drive the overall electronics manufacturing industry.
Features
Articles
This month, we examine how Industry 4.0 trends and the increasing power of data impact the PCB assembly industry.
In this month’s issue of SMT007, we examine how Industry 4.0 trends and the increasing power of data impact the PCB assembly industry. How will these two elements take assembly processes to the next level? Our experts weigh in.
Table of Contents
Features
Columns
Articles
This month’s issue of SMT007 Magazine highlights the challenges between the customer-supplier relationship, the feedback that matters, and how electronics assemblers ensure 100% customer satisfaction.
Working closely with your customers is critical, now more than ever. Nothing is more reassuring to customers than your willingness to listen and communicate with them no matter what the situation is. This month’s issue of SMT007 Magazine highlights the challenges between the customer-supplier relationship, the feedback that matters, and how electronics assemblers ensure 100% customer satisfaction.
TABLE OF CONTENTS
Features
Columns
Articles
SMT007 Magazine looks into the key considerations when investing in new equipment—not just on who’s got the latest and the greatest, but on how people decide what to buy, when to buy it, and how those decisions are made.
SMT007 Magazine looks into the key considerations when investing in new equipment—not just on who’s got the latest and the greatest, but on how people decide what to buy, when to buy it, and how those decisions are made.
Table of Contents
Features
IPC APEX EXPO 2018 Pre-Show Coverage
Columns
Articles
The solder paste printing process accounts for almost 70% of PCB assembly defects. We review the critical factors causing these issues in the solder paste printing operation.
The solder paste printing process accounts for almost 70% of PCB assembly defects. This month, we look into the critical factors causing these issues, and features strategies, tips and tricks to help assemblers improve the yield and quality in their solder paste printing operation.
Table of Contents
Features
Columns
Interview
This month we look into the issues facing assemblers when dealing with HDI boards, and highlight why close collaboration and communication with the designers right from the very start will ensure assembly success.
This month we look into the issues facing assemblers when dealing with HDI boards, and highlight why close collaboration and communication with the designers right from the very start will ensure assembly success.
Table of Contents
Features
Columns
Interview
There are many perspectives and challenges in creating perfect solder joints. We present parameters and strategies that can help assemblers improve their soldering process to achieve reliable solder joints.
There are many perspectives and challenges in creating perfect solder joints. We present parameters and strategies that can help assemblers improve their soldering process to achieve reliable solder joints.
Table of Contents
Features
Columns
Interview
There are many challenges when it comes to the rework and repair of PCB assemblies. This month, our technical authors highlight the strategies they suggest to improve the process.
There are many challenges when it comes to the rework and repair of PCB assemblies. This month, our technical authors highlight the strategies they suggest to improve the process.
Table of Contents
Features
Bonus Articles
This month, we take a look into the importance of workforce training and education on the continuous improvement of the PCB assembly process.
This month, we take a look into the importance of workforce training and education on the continuous improvement of the PCB assembly process.
Table of Contents
Features
Columns
Articles
Interview
In this issue we look into the latest technology trends, new manufacturing challenges, and outlook for the military and aerospace markets, and how they are impacting the PCB assembly industry.
In this issue, we look into the latest technology trends, new manufacturing challenges, and outlook for the military and aerospace markets, and how they are impacting the PCB assembly industry.
Table of Contents
Features
Special Section
Columns
Articles
This month we look into the myriad challenges in inspection, and highlights the need for newer AOI technologies to improve production yields and ensure reliability.
This month we look into the myriad challenges in inspection, and highlights the need for newer AOI technologies to improve production yields and ensure reliability.
Table of Contents
Features
Columns
Interview
This month, we explore the challenge of finding the right talent in the electronics manufacturing industry.
This month, we explore the challenge of finding the right talent in the electronics manufacturing industry.
TABLE OF CONTENTS
FEATURES
ARTICLES
COLUMNS
It is of the utmost importance that the soldering process should be perfect. But soldering is just too complex a process, and further complicating the situation, the requirements and technologies vary between our industry’s market segments.
It is of the utmost importance that the soldering process should be perfect. But soldering is just too complex a process, and further complicating the situation, the requirements and technologies vary between our industry’s market segments. This month, we look into some of the different factors and challenges impacting yield when it comes to soldering, and provides strategies on addressing them.
Table of Contents
Features
Columns
Interviews
We take a look into the different challenges that assemblers face when dealing with flex circuits, and highlights strategies to address them in this issue.
We take a look into the different challenges that assemblers face when dealing with flex circuits, and highlights strategies to address them in this issue.
Table of Contents
Features
Columns
Articles
In this issue we highlight some of the latest technologies aimed at addressing the current manufacturing challenges in the electronics assembly industry.
In this issue we highlight some of the latest technologies aimed at addressing the current manufacturing challenges in the electronics assembly industry.
Table of Contents
Features
Columns
Articles
We look into the impact of plating and surface finishing in PCB assemblies in this issue. These processes especially effect solderability and solder joint reliability.
This month, we look into the impact of plating and surface finishing in PCB assemblies. These processes especially effect solderability and solder joint reliability.
Table of Contents:
Features
Columns
Articles
In this issue, we look into the challenges for sales and marketing executives in the PCB assembly industry, and the key attributes of a salesperson, and provide effective sales strategies to use to be successful in this industry.
In this issue, we look into the challenges for sales and marketing executives in the PCB assembly industry, and the key attributes of a sales person, and provide effective sales strategies to use to be successful in this industry.
Table of Contents
Features
Columns
Interviews
Articles
This issue of SMT Magazine looks into the impact of vias on PCB assemblies.
This issue of SMT Magazine looks into the impact of vias on PCB assemblies.
Features
Columns
Interviews
In this issue we look into what makes a great leader, and the changing roles of the leader in the PCB assembly industry.
This issue of SMT Magazine looks into what makes a great leader, and the changing roles of the leader in the PCB assembly industry.
Table of Contents
Features:
Columns
Interview
Articles
In this issue we look into the latest military and aerospace electronics technology trends, manufacturing challenges, and outlook, and how they impact the PCB assembly industry.
In this issue we look into the latest military and aerospace electronics technology trends, manufacturing challenges, and outlook, and how they impact the PCB assembly industry.
Features
Columns
We take a pause from covering technology trends, challenges, and next-generation solutions this month. Instead, we are focusing on our readers—to give a voice to their thoughts on the industry, companies, jobs, interests, and even pain points.
We take a pause from covering technology trends, challenges, and next-generation solutions this month. Instead, we are focusing on our readers—to give a voice to their thoughts on the industry, companies, jobs, interests, and even pain points.
Features
Columns
Event Review
Articles
This month, we focus the discussion on test and inspection technologies that help identify PCB assembly defects for the improvement of associated manufacturing processes.
This month, we focus the discussion on test and inspection technologies that help identify PCB assembly defects for the improvement of associated manufacturing processes.
Features
Columns
Articles
This month, we address the challenges, best practices, and critical factors to consider in solder paste printing amid tighter tolerances and smaller pitches, lines and spaces.
This month, we address the challenges, best practices, and critical factors to consider in solder paste printing amid tighter tolerances and smaller pitches, lines and spaces.
Featured Interviews by Stephen Las Marias, I-Connect007
The Solder Paste Factor in Printing – with Mitch Holtzer
Solder Paste Printing: Challenges and Best Practices – with Watson Tseng
Solder Jet Printing: Keeping Up with the Challenges – with Thomas Bredin
Solder Paste Dispensing: Breaking the Limits of Printing – with Eric Gu
SPI Parameter Considerations for Tighter Tolerances – with JM Peallat and CC Hee
Improving the Solder Paste Printing Cycle Times – with Adam Sim
Solder Paste Printing: A User’s Perspective – with J. Apolinario, A. Bantigue and R. Bebe
Solder Paste Printing: The Reliability Factor – with Knoll Evangelista
Columns
Editor’s Note: Solder Paste Printing Exploration, by Stephen Las Marias, I-Connect007
Across the Board: Pad Defined vs. Mask Defined: Which Method is Optimal? by Mitch Holtzer, Alpha Assembly Solutions
Jumping Off the Bandwagon: The Production Engineering Student as Customer, by Tom Borkes, The Jefferson Institute
Knocking Down the Bone Pile: To Bake or Not to Bake (in Rework)—That is the Question, by Bob Wettermann, BEST Inc.
SMT Quick Tips: Selecting a Selective Soldering System, Part 3, by Robert Voigt, DDM Novastar
SPECIAL INSERT: IPC's IMPACT Washington, D.C. 2016, Who, What, Where, and Why, by Patty Goldman, I-Connect007
Veteran IMPACT Washington D.C. Attendee Matt Turpin on the Event’s Benefits
IPC’s Hasselmann on IMPACT Washington, D.C. 2016: Why it Matters
STI Electronics Participating in IPC’s IMPACT Washington, D.C.
Creation Technologies on IMPACT Washington D.C. 2016
IPC is One Thing, but Constituents are Quite Another
The Many Reasons Why People Attend IMPACT Washington D.C.
Making Connections at IMPACT Washington, D.C. 2016
A First-Timer’s Perspective on IMPACT Washington, D.C.
Shaping the Issues that Matter Most at IMPACT Washington, D.C. 2016
Article
3D Solder Joint Reconstruction on SMD based on 2D Images, by P. Vitoriano and T. Amaral, Visteon
This month, SMT Magazine features strategies to help reduce handling errors and improve efficiencies in your assembly lines.
Features
Columns
Articles
This month, SMT Magazine features strategies for improving process engineering to achieve an efficient, reliable, and reproducible assembly and manufacturing processes.
Features
Columns
Article
The March issue features strategies for building the highest yield on the lowest cost possible to provide the greatest value to your customers.
This month, SMT Magazine features strategies for building the highest yield on the lowest cost possible to provide the greatest value to your customers.
Features
Columns
Articles
Interview
This issue of SMT Magazine features the latest technology and process developments happening in the SMT, PCB assembly and EMS industries, and what to expect in the future.
This issue of SMT Magazine features the latest technology and process developments happening in the SMT, PCB assembly and EMS industries, and what to expect in the future.
Features
New Year Outlook: Electronics Hardware by Dr. Jennie S. Hwang
High-Reliability Interconnects for High-Power LED Assembly by Ravi M. Bhatkal, Ph.D.
EMS: Quo Vadis? (Where are you Going?) by Frederick Blancas
Two-Print Stencil Solutions for Flip Chip/SMT Assembly by William Coleman
Challenges and Opportunities for Smaller EMS for Onshoring by Gary Tanel
Efficiency, Energy and Convenience: Driving New Solutions and Markets Interview with Craig Hunter
Greener Cleaning by Mike Konrad
Magnetically Aligned Novel ACA Revolutionizes 3D Chip Stacking by Dr. S. Manian Ramkumar
Articles and Columns
Editor’s Note - New Paradigms by Stephen Las Marias
Electrolube: We Like Problems! by Pete Starkey
The Jefferson Project, Part 2: Automation as a Counterweight to Low Labor-Rate Assembly Interview with Tom Borkes
Rework Site Printing using Mini Stencils—Plastic Adhesive vs. Metal by Bob Wettermann
Industry 4.0: Creating a Standard with Dan Hoz and Ofer Lavi Ben David
We examined the medical market to learn what impact it has on the electronics industry and where it might be in five years. This issue also covers key trends driving medical electronics and the challenges and opportunities in the industry.
We examined the medical market to learn what impact it has on the electronics industry and where it might be in five years. This issue also covers key trends driving medical electronics and the challenges and opportunities in the industry.
Featured Columns:
Medical Electronics: Manufacturing Vitals by Stephen Las Marias
New Year Outlook: China's Five Year Plan by Jennie Hwang
Features:
Why Medtech Manufacturers Should Automate Fluid Dispensing Operations by Kelvin Fernandez
Top 10 Factors to Consider When Selecting a Medical EMS Company by M. Ohady & D. Estes
Medical EMS: Opportunities Abound by Frederick Blancas
Valtronic Highlights Vital Components in Medical Electronics Manufacturing an Interview with Jay Wimer
Medical Electronics: Risks and Opportunities for Electronics Manufacturers an Interview with Brian Morrison
The Jefferson Project: Educating the Next Generation in Applied Manufacturing Sciences (Part 1) Tom Borkes Interview
Columns:
Lost in the System: How Traceability Can Solve the Problem of Counterfeit Materials by Michael Ford
Selecting a Wave Soldering System, Pt. 3 by Robert Voight
Article:
Vapor Phase Technology is a Viable Solution, but Carries a Learning Curve by Steven Frazer
The spotlight this month is on industry associations, their goals, pivotal roles in technology advancements in EMS and SMT industries, and how they are helping their members on their journey to manufacturing success.
The spotlight this month is on industry associations, their goals, pivotal roles in technology advancements in EMS and SMT industries, and how they are helping their members on their journey to manufacturing success.
Features
SMTA: Working Hard for the Global Industry Interview with Bill Barthel
A Closer Look at SMTA Q&A with Tanya Martin
PC: Connecting Electronics Industries Q&A with John Mitchell
SMART Group: The Guiding Influence in the Electronics Industry with Keith Bryant
OEM Applications: MacDermid’s OEM Director Embraces Renewed Focus with Lenora Toscano
VDMA Productions: Pushing Forward the German Electronics Manufacturing Industry with Dr. Eric Maiser
iNEMI: Leading the Way to Successful Electronics Manufacturing with Bill Bader
Articles
Digitization on the Horizonby Jorey Guzman
Low-Temperature Thick Film Pastes Permit Lead-Free Soldering by Steven Grabey
EMS Providers: Maintaining Competitiveness and Seeking Significance by Frederick Blancas
Columns
Observations from productronica 2015 by Stephen Las Marias
No Time for a Board Spin? Selective Solder Mask Removal by Bob Wettermann
Selecting a Wave Soldering System, Part 2 by Robert Voigt
This month we explore how the Industrial Internet of Things (IoT), data, and analytics can help electronics assemblers take their manufacturing processes to the next level.
This month, we look at how the Industrial Internet of Things (IoT), data, and analytics can help electronics assemblers take their manufacturing processes to the next level.
ARTICLES
The SMT Internet of Things—Back to Basics by Michael Ford
Industry 4.0: Implications for the Asia Pacific Manufacturing Industry by Krishnan Ramanathan
Improving Production Efficiencies with Better Data Strategies Interview with Bill Moradkhan
Connecting the Enterprise Interview with Mike Hannah
Managing Big Data from an Analog World by Chandran Nair
Made in USA and Total Cost: Six Ways U.S. Sourcing Saves Money by Gary Burnett
Streamlining PCB Assembly and Test NPI with Shared Component Libraries by Pat McGoff
COLUMNS
The New Industrial Era by Stephen Las Marias
A Look at the Theory Behind Tin Whisker Phenomena, Part 3 by Dr. Jennie S. Hwang
Selecting a Through-Hole Soldering System, Part 1 by Robert Voigt
In this issue, we offer strategies and technologies that will help electronics assemblers reduce cycle times in their processes to improve their efficiencies and increase their productivity.
In this issue, we offer strategies and technologies that will help electronics assemblers reduce cycle times in their processes to improve their efficiencies and increase their productivity.
FEATURES:
Value Stream Mapping: Operationalizing Lean Manufacturing,by Erwin Patrocinio
Choosing the Right Component to Reduce Cycle Times ,Interview with Edward Neff
Cycle Time Reduction in the Eye of AOI, Interview with Norihiko Koike
Reducing Cycle Times with Innovative Bonding Solutions, Interview with Gudrun Weigel
Technologies to Enable Quick-Turn PCB Assemblies, by Khurrum Dhanji
Process Improvements for Cycle Time Reduction, Interview with Randall Williams
Is Automation the Answer to Cycle Time Reduction? Interview with George Liu
Inspection Innovations to Reduce Cycle Time, Interview with Guido Bornemann
COLUMNS:
The Need for Speed by Stephen Las Marias
Reducing Print Cycle Times by Mitch Holtzer and Lourenco Nampo
Cycle Time Reduction with WORK, Part Iby Steve Williams
In the "Cars" issue of SMT Magazine we highlight the latest technological advances in automotive electronics and illustrate how this sector is driving the electronics assembly, testing and inspection industries.
This month, SMT Magazine is packed with highlights on how the latest technological advances in automotive electronics are driving innovations in the electronics assembly, testing and inspection industries.
Column — What's Driving Automotive Electronics?
Column — Surface Mount Technology Association—a New Milestone
Feature — The "New Face" of Automotive Traceability
Feature — Automotive EMS: Going Beyond Assembly
Interview — Big Strategies for Success
Feature — Material Considerations for Advanced Driver Assistance Systems Assembly
Article — A Case Study on Evaluating Manual and Automated Heat Sink Assembly using FEA and Testing
Feature Interview — Experience is Key
Feature Interview — From Inspecting to Measure: How Automotive Electronics are Driving AOI Developments
Interview — The Demands on Automated Fluid Dispensing
Feature Interview — Addressing the Need for Reliable, Accurate Inspection Results
Article — Tin Whisker Self-Mitigation in Surface Mount Components Attached with Leaded Solder Alloys
Feature Interview — Choosing the Right Conformal Coating
Feature Interview — Driving Innovation
Column — DoD's First Pass at Grey Market Regulation
Feature Interview — Automotive Electronics Driving Innovations in Test
Feature — Benefits of Paralyne Conformal Coatings in Automotive Applications
Feature — Selecting a Reflow Oven, Part 2
This month, we take on those pesky process failures—from soldering defects and device cleanliness, to challenges of mission-critical product and the link between head-in-pillow defects and warpage.
This month, we take on those pesky process failures—from soldering defects and device cleanliness, to challenges of mission-critical product and the link between head-in-pillow defects and warpage.
FEATURES
The War on Soldering Defects: HiP and NWO by Jason Fullerton
Declaring War on Failure in Electronics by Joe Fjelstad
How Clean is Clean Enough to Achieve Reliable Electronic Hardware?
Addressing Quality and Manufacturability Challenges of Mission-Critical Products by Amy Yin Chen
Collaboration: OEM & EMS to Combat HiP Defects by Alex Chan et al.
Case Study: Detecting Process Defects by Bob Willis
ARTICLES
Reducing Risks to Employees' Health with Extraction and Filtration Technology by Stefan Meissner
Interview — Stencils: Why They Still Matter by Barry Matties
COLUMNS
A Letter from the New Editor by Stephen Las Marias
Don't Allow Standards to Get the Better of You by Michael Ford
Selecting a Reflow Oven, Part 1 by Robert Voigt
Supply Chain Risk Mitigation Applications for the Grey Market by Stephan Halper
This month, SMT Magazine tackles the supply chain—from various approaches to making it work for you, to what history has shown about its many iterations, and how some suppliers are setting the bar very high for the future of supply chain management.
This month, SMT Magazine tackles the supply chain—from various approaches to making it work for you, to what history has shown about its many iterations, and how some suppliers are setting the bar very high for the future of supply chain management.
Articles
Columns
More
This month, feature contributors from Keysight Technologies, XJTAG, Göpel and Sonoscan shed light on the trends and challenges of test and inspection.
This month, feature contributors from Keysight Technologies, XJTAG, Göpel and Sonoscan shed light on the trends and challenges of test and inspection.
Features
High-Density Interconnect and Embedded Board Test, by Mark Lau, Keysight Technologies Inc.
Test Match—Partnering Specialist Boundary-Scan with ICT, by Robert Thompson, XJTAG
In-line Solder Penetration Testing with 3D X-ray Inspection, by Andreas Türk, Goepel Electronic
Acoustic Surface Flatness of Components and Boards, by Tom Adams, Sonoscan Inc.
Articles
Event Review: 6th Electronic Materials and Processes for Space Workshop (EMPS-6), by Barrie Dunn, EMPS
Interview: Inspection—the Last Line of Defense, by Barry Matties with Viscom’s Guido Bornemann
Column
Across the Board: In-Circuit Pin Testing: An Excellent Potential Source of Value Creation, by Mitch Holtzer, Alpha
More
This month, experts from Flextronics, Ericsson AB, MTEK Consulting AB, and Speedline Technologies contribute to our features focusing on paste printing and component placement.
This month, experts from Flextronics, Ericsson AB, MTEK Consulting AB, and Speedline Technologies contribute to our features focusing on paste printing and component placement.
Features
Miniaturization with the Help of Reduced Component-to-Component Spacing, by Jonas Sjoberg, et al., Dow Chemical Company
Solder Paste Printing: Quality Assurance Methodology, by Lars Bruno, Ericsson AB and Tord Johnson, MTEK Consulting AB
Enclosed Media Printing as an Alternative to Metal Blades, by Michael L. Martel, Speedline Technologies Inc.
Columns
SMT Prospects & Perspectives: The Theory Behind Tin Whisker Phenomena, Part 1, by Jennie Hwang
SMT Quick Tips: Selecting an Automatic Pick-and-Place Machine, Part 3, by Robert Voigt, DDM Novastar
This month, experts from Indium, Inventec, Vitronics, Micronic Mydata and BEST Inc. weigh in on soldering technologies and solutions, from reliability issues to position accuracy machines and alternatives to polyimide tape, and more!
This month, experts from Indium, Inventec, Vitronics, Micronic Mydata and BEST Inc. weigh in on soldering technologies and solutions, from reliability issues to position accuracy machines and alternatives to polyimide tape, and more!
Table of Contents
Features
Columns
Videos: Real Time with…IPC APEX EXPO 2015: Brian Chung, Nordson Asymtek and Michael Ford, Mentor Graphics
Industry experts from Indium, Mentor Graphics, and Alpha Circuit are on hand this month to guide us through issues related to thermal management, including latest trends, alternative approaches and streamlining PCB thermal design.
Industry experts from Indium, Mentor Graphics, and Alpha Circuit are on hand this month to guide us through issues related to thermal management, including latest trends, alternative approaches and streamlining PCB thermal design.
Table of Contents
Features
Articles
Columns
More…
Technologists have studied tin whiskers for decades, but the proliferation of lead-free electronics has pushed these microscopic fibers to the forefront of assembly challenges. This month, the mitigation of tin whiskers is tackled, with articles by Dr. Ron Lasky (Indium); Dr. Viktor Karpov (Univ. of Toledo); Dr. Jennie Hwang (H-Technologies); Dr. Michael Osterman (CALCE); Andrzej Czerwinski (Institute of Electron Technology); Scott Sentz (AEM); and Dave Hillman (Rockwell Collins).
Table of Contents:
Features
Columns
It’s a new year, and we’re celebrating by focusing on a new, up-and-coming technology that could have a real effect on our industry: structural electronics.
This month, you’ll find feature articles by Dr. Peter Harrop of IDTechEx, and Joe Fjelstad of Verdant Electronics, as well as an article on alternative solvents by Rajat Basu and Ryan Hulse of Honeywell International. We’re also introducing a new columnist, Robert Voigt of DDM Novastar, who discusses how to select the right SMT equipment.
Feature Articles:
The Rise of Structural Electronics by Dr. Peter Harrop
3D Printing in Electronics—a Perspective by Joe Fjelstad
An Alternative Solvent with Low Global Warming Potential, by Rajat Basu and Ryan Hulse
Columns:
The Way I See It: The Tipping Point, by Ray Rasmussen
SMT Quick Tips: How to Select a Stencil Printer, by Robert Voigt
The Short Scoop: Stencil Printing in PCB Cavities, by Rachel Miller-Short
The January issue contains an interesting mix of feature articles chosen to help you manage your business.
What better way to start the New Year than with a focus on management?
The January issue of SMT Magazine has every aspect covered, with articles from Components Direct’s Steve Martin addressing the impact of e-commerce on the component supply chain; George Henning of OCM Manufacturing advising how to choose between turnkey and consignment manufacturing; ESCATEC’s Daniel Pfeifer explaining how to give your global company a local advantage; and much more.
As always, read the latest columns from Editor Ray Rasmussen, Dr. Jennie S. Hwang; Karla Osorno; and more.
Coating and Cleaning are the two focuses in this month's edition of SMT. Learn how to make good decisions in this issue.
The February issue of SMT Magazine addresses cleaning and coating: Conformal coating inspection methods; the effective removal of OA flux residues; plasma polymerization for conformal coating; benchtop PCB cleaning; and an in-depth comparison of conformal coatings.
This issue also features our exclusive IPC APEX EXPO 2013 Pre-show Coverage, which includes information on technical conference sessions, standards development meetings, certification programs, IPC Buzz Sessions, a Real Time with... video overview, and much more.
Our March issue includes several articles on the subject of Legislation and Environmental issues.
The March issue of SMT Magazine looks at the industry’s many environmental issues, including the impact of legislation with a focus on RoHS and REACH compliance and enforcement, ITAR compliance, conflict minerals, and corporate social responsibility.
Also included in this issue is our exclusive IPC APEX EXPO 2013 post-show coverage. Our veteran team of guest editors and staff bring you the latest from the show floor, including new technologies and products, a review of key panel discussions, and, of course, our in-depth Real Time with… video interviews.
SMT Assembly Processes Part I: Stencil Printing. This is the first part of our two-part series on assembly processes.
The April issue of SMT Magazine addresses SMT Assembly Processes, including stencil paste printing/dispensing, component handling, ESD control, component placement, and odd-form placement.
The issue features 3M's James T. Adams, explaining how to find the perfect cover tape; Dr. Bill Coleman, vice president of technology at Photo Stencil, addressing the stencil printing of small apertures; Ricky Bennett and Eric Hanson covering low surface energy coatings; and many more articles and columns from industry experts, including, Zulki Khan, Eric Klaver, Karla Osorno, and Michael Ford.
SMT Assembly Processes Part II: The Soldering Technology Edition. This is the 2nd part of our two-part series on assembly processes.
The May issue of SMT Magazine focuses on soldering issues and features authors from Rehm Thermal Systems and Balver Zinn who examine the surface tension and load-carrying capacities of solder. Seth J. Homer and Dr. Ron Lasky of Indium Corporation discuss ways to reduce voiding in QFN packages.
Additional articles and columns from industry experts, including, Dr. Jennie Hwang, Zulki Khan, Sjef van Gastel, Karla Osorno, and new columnist Rachel Short can be found in the issue as well.
This month, SMT Magazine features articles by industry experts on high-reliability issues facing a range of sectors: mil/aero, medical, counterfeit components, and more!
The theme for the June issue of SMT Magazine is high-reliability with a focus on standards and specifications; counterfeit components; certification; security, testing, and quality assurance issues.
Read in-depth articles from the best in the industry including Ed Habtour, U.S. Army Material Systems Analysis Activity, and Cholmin Choi, Michael Osterman, and Abhijit Dasgupta, CALCE. The feature article presents a novel approach to improve reliability in U.S. Army vehicles. Lavanya Rammohan, Frost & Sullivan, explains the EMS provider’s role in combating counterfeit components.
As always, the June issue also includes several columns from our industry experts, including Derek Snider, Michael Ford, Rachel Miller-Short and Karla Osorno.
Thermal management is in the hot seat this month, with feature contributors from Koki Company Ltd., Christopher & Associates, Air-Vac Engineering, and Verdant Electronics, taking on a range of thermal management issues, including applications of lead-free alloy solder pastes, through-hole rework of thermally challenging components and assemblies, and so much more!
From our columns department, Jennie Hwang, Karla Osorno, Eric Klaver and Ray Rasmussen are on hand to enlighten and inform.
Don’t miss our highlights, with current headlines from throughout the industry and feature video from our Real Time with... series.
With packages becoming denser all the time, how does this affect the PCB assembly process? In this issue, our expert contributors explain the ins and outs of high-density packaging.
It’s no secret that packages are becoming denser all the time. But how does this affect the PCB assembly process? In this issue of SMT Magazine, our expert contributors explain the ins and outs of high-density packaging, as well as tips and techniques for dealing with packages chock full of ever-increasing levels of technology.
Hear from our contributors and columnists as they discuss best practices for assembling today’s high-density packages. Atotech’s Olaf Kurtz, Jürgen Barthelmes, Eckart Klusmann, Robert Rüther, and Stephen Kenny discuss strategies for using layers of cost-effective palladium. And a team from Altera Corporation and Amkor Technologypresent a case study that evaluates the use of molded flip-chip BGA packages in 28nm FPGAs.
As always, catch up on the latest columns from Sjef van Gastel, Rachel Short, Michael Ford, Karla Osorno, Zulki Khan, and much more.
This issue features Julie Silk's article "Brittle Failure in Pb-free BGA Solder Joints"
Pass the test with SMT! In this issue, we explore the latest and greatest test and inspection processes related to PCB assembly. Our contributors from Agilent, Teradyne, ASSET Intertech and Cincinnati Sub Zero focus on ICT, HALT, HASS, and much more.
At the end of each year, our contributors look back at the year that was, and make predictions about the upcoming 12 months.
As 2013 comes to a close, our columnists look back on the past year and make predictions for the upcoming year. In the December issue of SMT Magazine, Publisher Ray Rasmussen wraps up 2013 and discusses what we might expect to see in 2014. Dr. Jennie S. Hwang looks back on her predictions from last year and details where she got it right, and wrong. Rachel Short explains why your relationship with your stencil maker will be so important in 2014. And Michael Forddiscusses why he believes electronics manufacturing is experiencing its "teen" years: Full of expectation, but lacking capital.
As always, this month we feature columns by our team of experts, including Sjef van Gastel, Zulki Khan, and Karla Osorno.
No one likes to repair packages. Rework & repair of advanced packages is becoming increasingly complex, not to mention costly. Explore how to repair large area and column grid array assemblies.
The repair and rework of packages is becoming more complex and expensive, especially with today’s advanced packages. In the November issue of SMT Magazine, our contributors and columnists get to the bottom of rework, modification and repair. Air-Vac Engineering’s Brian Czaplicki discusses the advanced rework of bleeding-edge packaging systems. And an article by Jet Propulsion Laboratory’s Reza Ghaffarian, Ph.D., details the rework and reliability of high-I/O CGA assemblies.
As always, this month we feature columns by our team of experts, including Ray Rasmussen, Dr. Jennie Hwang, Karla Osorno, and Eric Klaver.
All this, industry news highlights, and upcoming events can be found in this month’s issue.
Lead-free Developments: It’s been over seven years since RoHS became the law of the land in Europe but many OEMs & EMS companies still find themselves facing increasing challenges related to lead-free processes.
We’ve seen a myriad of developments in lead-free solder and surface finishes since RoHS went into effect seven years ago. But the state of lead-free changes almost every day. In the October issue of SMT Magazine, our contributors and columnists explore the often confusing world of lead-free processes. Nihon Superior’s Tetsuro Nishimura discusses the bleeding edge of lead-free soldering. And a case study by Continental Corporation’s José Mar’a, Serv’n Olivares and Cynthia Gómez Aceves details how TOF SIMS analysis helped provide insight into wetting issues with lead-free HASL processes.
As always, this month we feature columns by our team of experts, including Ray Rasmussen, Michael Ford, Sjef van Gastel, Rachel Short, and Zulki Khan. All this, industry news highlights, and upcoming events can be found in this month’s issue of SMT Magazine.
Our year-end issue takes a look forward to 2015, with features from Mentor Graphics, Sanmina, Alpha Circuit and IMI, that discuss the supply chain, SMT advancements and more.
Our year-end issue takes a look forward to 2015, with features from Mentor Graphics’ Michael Ford, Alpha Circuit’s Yash Sutariya, Sanmina’s Mulugeta Abtew, and IMI’s Frederick Blancas. Don’t miss this Outlook 2015 issue that addresses the supply chain, SMT advancements, production planning, and more!
This month, experts from OK International / Metcal, Ersa GmbH, and BEST Inc. weigh in on rework & repair topics ranging from challenges for mobile devices to new technology for rework systems and more!
In the November issue of SMT, feature article contributors Paul Wood (OK International/Metcal), Joerg Nolte (Ersa GmbH) and Bob Wettermann (BEST Inc.)deliver updates on the latest rework and repair processes and equipment.
Non-feature contributions include technical articles from Plasmatreat, Henkel, and Sonoscan. Plus, fresh Real Time with... videos straight from SMTAI 2014.
This month, experts from Lockheed Martin and Verdant Electronics present their perspective on cutting-edge alternatives to soldering. Other contributors include CML EurAsia and Jabil Circuits.
SMT Magazine delves into alternatives to soldering this month, with experts from Lockheed Martin and Verdant Electronics, who offer their perspectives on this hot topic. In other articles, contributors from CML EurAsia offer their take on sourcing concepts for PCBs, and I-Connect007’s Richard Ayes interviews Jabil Circuits Inc on the topic of flexible manufacturing. Don’t miss this issue!
In this issue we focus on what's current and what the future holds for PEC.
Dr. Harry Zervos of IDTechEx presents a case study on printed electronics suppliers, cost structures, and challenges. Sumit Kumar Pal of Frost & Sullivan's Technical Insights explains how traditional processes are enabling next-gen technologies such as printed electronics.
And columnist Joe Fjelstad of Verdant Electronics puts printed electronics in historical perspective, discussing PEC's potential future uses and inherent limitations. I-Connect007 editor Richard Ayes discusses printed electronics assembly with Rafael Nestor Mantaring of Integrated Micro-Electronics Inc.
You’ll also find an article on inline AXI technology by a new contributor, Ondrej Simecek of Test Research Inc., as well as regular columns by Michael Ford and Ray Rasmussen.
All this, plus industry news highlights and upcoming events, can be found in this month's issue of SMT Magazine.
It must be summer, because this month, SMT Magazine is turning up the heat on thermal management! Features include Gregor Langer, Markus Leitgeb, et al., who look into advanced thermal management solutions for high-power applications.
Carlos Montemayor investigates the high-temperature reliability limits for silicone adhesives, and Mark Challingsworth examines trends in thermal management for electronic circuits.
Be it X-rays, drop shock performance or tweaking test fixtures to meet today's needs, we've got it covered in this issue...
Alejandro Castellanos, et al of Flextronics explains how this company uses X-ray inspection to fight head-in-pillow defects. Ronald Frosch of AT&S discusses a novel method for forecasting drop shock performance. Rob Humphrey of XJTAG looks at a variety of ways to achieve signal integrity in test fixtures. Alan Albee of Teradyne focuses on the changing economics of in-circuit test. And NK Chari of Agilentexplains solid management practices for PCBA test.
You’ll also find an article by Dan Hoz of Mentor Graphics, as well as columns by Dr. Jennie Hwang, Ray Rasmussen, Todd Kramer, and Sjef van Gastel.
All this, plus industry news highlights and upcoming events, can be found in this month’s issue of SMT Magazine.
In Part 3 of our assembly process series, SMT Magazine uncovers what happens after the soldering process in an issue devoted to cleaning and coating. How clean is clean? Which cleaning process is best suited for which technology? These questions and more are addressed this month by experts from University of Denmark, AIM Solder and NexLogic.
Plus, show coverage from IPC APEX EXPO, including interviews, overviews, pictures and more!
This month, our cover story from Shea Engineering Services probes the stencil manufacturing process, including stencil printing experiments. Also featured this month: Testing Intermetallic Fragility on ENIG upon Addition of Limitless Cu (Universal Instruments Corp.); Making Sense of Accuracy, Repeatability and Specification for Automated Fluid Dispensing (Nordson ASYMTEK); Big Ideas on Miniaturisation(DEK).
Don’t miss new Real Time with… video content from productronica 2013, SMTA and more!
In Part 2 of our assembly process series, we help make the connections! This month, solders, soldering & solderless technology are the focus, with features from Flextronics, the Aerospace Corp., and an IPC APEX EXPO preview!
In Part 2 of our assembly process series, SMT Magazine helps make the connections! This month, we dig deeper into the no-clean vs. water-soluble solder paste argument, the overstress of components during the soldering process, the feasibility of low/no-silver solder pastes, the influence of microstructure on bismuth lead-free solders, and high-temperature assembly materials.
Plus: IPC APEX EXPO preview!
It’s all about reliability this month, with features from Trace Labs, Nihon Superior, Cisco BFK Solutions, Steve Williams, and more!
This month, Trace Labs’ Renee Michalkiewicz covers the corrosion and reliability characteristics of fluxes; Nihon Superior supplies a comprehensive analysis of lead-free solder joint reliability and Cisco offers a complete look at predicting pad crater failures. Steve Williams and BFK Solutions round out our line-up of features!
Don’t miss new Real Time with… video content from HKPCA and productronica 2013!
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