Thinfilm Announces First Multi-Cell Solid-State Battery
October 15, 2020 | Globe NewswireEstimated reading time: 1 minute
Thin Film Electronics ASA, a developer of ultrathin, flexible, and safe energy storage solutions for wearable devices and connected sensors, announced significant progress in device manufacturing and packaging innovation in support of its premium microbattery products based on solid-state lithium battery ("SSLB") technology.
To enable ultra-compact, energy-dense, milliamp-hour-class batteries, Thinfilm has successfully demonstrated the first multi-cell battery based on its SSLB technology. By stacking and encapsulating multiple layers of active cell materials deposited on Thinfilm's unique stainless steel substrate, Thinfilm can flexibly scale energy storage capacity within the compact footprint required in applications with constrained form factors.
Innovations in steel-substrate cell stacking are essential to creating solid-state battery products for hearing aids, earbuds, on-body sensors, and other products prioritizing size and shape. By overcoming packaging limitations that have previously prevented wider use of solid-state technology, Thinfilm is expanding the technology's many benefits to previously unaddressed markets.
Thinfilm's consolidated manufacturing environment in Silicon Valley continues to accelerate technology and product development cycles and has led to ongoing improvements in device yield, reliability, and performance of the critical materials responsible for energy storage and charge cycling. As a result, Thinfilm's battery development engineers have recently implemented and validated multiple process integration and materials advancements in the Company's on-site, fully functional, and scale-ready flexible electronics factory.
Based on continued positive feedback regarding the advantages of Thinfilm SSLB technology, the Company has broadened its engagements with leading manufacturers of wearable devices and connected sensors. Substantive conversations with a growing list of prospects have validated Thinfilm's stated market priorities and led to the incorporation of meaningful customer feedback in the Company's SSLB roadmap and technology development priorities. For example, recent success in multi-cell stacking reflects the prioritization of energy-dense batteries suitable for integration into form-factor-constrained applications such as hearing aids, earbuds, and medical devices. Improved cycling counts, compared to legacy lithium-ion batteries, address the long-term reliability needs of devices requiring daily charging. Enhanced output currents enable reliable Bluetooth LE transmit performance needed to communicate on-body vital sign sensor data to a companion smartphone.
Suggested Items
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
Dubai Launches Global Blueprint for Artificial Intelligence
05/02/2024 | BUSINESS WIREDubai has launched a blueprint for Artificial Intelligence (AI), a yearly plan that will focus on harnessing the technology’s potential to improve quality of life around the world.
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.
IDTechEx Report on Quantum Technology: Nano-scale Physics for Massive Market Impact
04/30/2024 | PRNewswireThe quantum technology market leverages nano-scale physics to create revolutionary new devices for computing, sensing, and communications. Across the industry, quantum technology offers a paradigm shift in performance compared with incumbent solutions.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.