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Bell Awarded Funding for Phase 1B of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program

05/30/2024 | Bell
Bell Textron Inc., a Textron Inc. company, has been down-selected for Phase 1B of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program.

DuPont Announces Leadership Transition

05/29/2024 | DuPont
DuPont announced that its Board of Directors has selected Lori D. Koch, DuPont's Chief Financial Officer, to succeed Edward D. Breen as the company's Chief Executive Officer. Effective June 1, 2024, Mr. Breen will transition from the role of CEO to full-time Executive Chairman of the Board of Directors. Additionally, Ms. Koch is expected to join the Board of Directors at its next regularly scheduled meeting in June.

Airbus to Establish Tech Hub in Japan

05/27/2024 | Airbus
Airbus has announced plans to establish a Tech Hub in Japan. The new initiative is designed to develop partnerships in the country to advance research, technology and innovation in aerospace and push boundaries to prepare for the next generation of aircraft.

RTX's Collins Aerospace Awarded Survivable Airborne Operations Center Subcontract

05/27/2024 | RTX
Collins Aerospace, an RTX business was awarded a multi-billion-dollar subcontract as part of a team led by SNC to design, develop and deliver systems and products for a new aircraft under the U.S. Air Force's Survivable Airborne Operations Center (SAOC) program.

Dana on Data: The Insane PCB DFM Process

05/22/2024 | Dana Korf -- Column: Dana on Data
This industry just doesn’t like to change. Line width/space is consistently narrowed; layer counts are now over 120 layers; via diameters constantly shrink. But a fabricator still can’t build per the supplied data package because of design, document, and capability mismatch errors. I have been writing for I-Connect007, and of the 41 articles and interviews I have done, 39 have focused on highlighting designer-to-fabricator data transfer issues with proposed solutions. Little has changed to improve the transfer. This industry seems to accept receiving erroneous PCB data.
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