Stepping up to Laser Processing for Flex, Part 3: Readiness and Site Preparation
May 4, 2016 | Mike Jennings and Patrick Riechel, ESIEstimated reading time: 8 minutes
Compressed Air
Compressed air is often used on UV laser systems to purge the laser and optics areas inside the system and—in some cases—to assist the debris removal vacuum in removing debris from the processing area. Given that this air also flows over and around the system’s laser and optics, one must take into account not only air pressure and flow, but air quality as well. The use of membrane type oil/water separators is essential for ensuring laser-quality compressed air.
Standard pneumatics engineering protocols should be followed to allow for proper draining of oil or water from air lines prior to entering the system.
Environmental Air Quality
The issue of air quality isn’t limited to the quality of compressed air. The facility’s environmental air quality is also a factor. Despite air purging designs that are common in UV laser processing systems, environmental air containing high levels of particles and oils can result in high maintenance costs caused by the need to clean and replace optics more frequently.
Floor Vibration
It is also important to minimize floor vibration, which can impact system accuracy. Systems can be located anywhere in the manufacturing building, from ground floor up to the top floor of a multi-story building. While well-designed systems include vibration-mitigation mechanisms like vibration-absorption foot pads, those are typically designed to only isolate the rest of the factory from vibration from that particular system itself. Obviously, one should avoid placing the laser system near heavy machinery, too close to multiple mechanical drills, or next to other heavy vibration-inducing factory machinery such as the facility vacuum pump, air compressors, or backup generator, especially if you are placing the tool on a higher floor. Typically, the placement of multiple laser systems in the same area does not cause issues, and it is common to find single shop floors containing as many as 40–50 laser systems.
Summary
With so many processes to keep track of in a flex manufacturing line, it can be easy to get lost in the details and begin to rely on your suppliers to address any issues that might crop up. However, given that laser processing equipment and flex materials are both impacted by your facilities, your attention to and investment in clean, stable, and robust facilities and support equipment will quickly pay off in less downtime, higher yield, and—perhaps most importantly—fewer headaches!
Mike Jennings is director of product marketing with ESI’s Industrial Products Division. Patrick Riechel is product manager for ESI’s flexible circuit micromachining tools.
Page 2 of 2Suggested Items
Lockheed Martin Australia, The Department Of Defence Sign Strategic Partnership Head Contract
04/26/2024 | Lockheed MartinLockheed Martin Australia signed a landmark AUD$500 million contract with the Department of Defence to build Australia’s future Joint Air Battle Management System under project - AIR6500 Phase 1 (AIR6500-1).
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.