Advanced Copper Foil Secures a Non-Provisional Patent for New Product: Poly-Supported Copper Foil


Reading time ( words)

Advanced Copper Foil has secured an international patent for Poly-Supported Copper Foil, promoted under the name ACF-Screen. This patent is non-Provisional under International Application number PCT/050938.

ACF-Screen is comprised of a proprietary protective Poly Release film, which is adhered to sheets of ultra-thin copper foil in a cleanroom environment. This product provides complete protection of the copper surface throughout the entire cycle of PCB layup and lamination. ACF-Screen utilizes an inert adhesive which results in a guaranteed residue-free copper surface during subsequent processing. The release film will withstand temperatures of the lamination cycle, allowing for easy removal during break-down. ACF-Screen will eliminate anomalies caused by bending or creasing of copper foils during handling, while always completely protecting the surface from foreign materials and contamination. This product is available on copper foils from 5 µm, 9 µm to 70 µm.  ACF-Screen is available on Standard, VLP, HVLP and ANP (Almost No Profile) copper foils.

“This product is going to revolutionize the industry. It will ease the handling of copper foils compared to loose foils, resulting in more efficient and speedier layup process,” says Shane Stewart, Product Manager.

ACF will be showcasing this product at the IPC APEX show in San Diego on February 14-16. Drop by the booth (#3701) for more information and to request samples of this new revolutionary product.

About Advanced Copper Foil

Advanced Copper Foil is a company dedicated to High Performance Copper Foils and their applications in the Printed Circuit and Battery Shielding Industries. Advanced Copper Foil is committed to providing PCB Fabricators, Laminate Manufacturers and Battery Shielding Companies with a cost-effective alternative to the traditional products on the market today. For further information visit: www.advancedcopperfoil.com

Share




Suggested Items

EIPC Summer Conference 2022: Day 2 Review

06/29/2022 | Pete Starkey, I-Connect007
Örebro, Sweden on June 15 brought a bright and early start to Day 2 of the EIPC Summer Conference for those who had enjoyed the previous evening’s networking dinner, but had resisted the temptation to over-indulge or to carry on their long-awaited catch-up conversations with old friends into the small hours. All but a few were in their seats for 9 a.m., awake and attentive for Session 4 of the conference, on the theme of new process technologies, moderated by Martyn Gaudion, CEO of Polar Instruments.

EIPC Summer Conference 2022: Day 1 Review

06/28/2022 | Pete Starkey, I-Connect007
At last, a live EIPC conference and this time in the Swedish city of Örebro, “where history and contemporary culture converge,” a pleasant and convenient location for an event that included a privileged visit to the Ericsson facility in Kumla. Around 100 delegates made the journey and the Örebro Scandic Grand Hotel was an excellent conference venue for the June 14-15 conference.

PCB Plating Still Comes Down to Physics

06/21/2022 | I-Connect007 Editorial Team
We asked columnist Michael Carano to discuss the latest innovations in plating equipment and chemicals, as well as some of the drivers in this segment, and the biggest challenges and opportunities he sees in plating today. As Michael points out, despite all of the technological advances in this industry, process engineers still need a solid understanding of Faraday’s Law and Ohm’s Law to successfully plate PCBs.



Copyright © 2022 I-Connect007. All rights reserved.