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Ventec International Group Co., Ltd. will showcase its latest PCB material technology innovations at the JPCA show, which is taking place at the Tokyo Big Sight East Hall from June 6-8 in Japan. The Ventec technology team will be on hand on booth #7B-32 showcasing unique laminate & prepreg capability solutions including the latest tec-speed 20.0 material – a Dk 3.48 ceramic-filled hydrocarbon thermoset material designed for high frequency applications.
Didier Mauve (Global Account Manager OEM Technology), Bill Wang (Technical & Quality Director) and Will Zhang (Staff Engineer) will be at JPCA to demonstrate the company’s firm commitment to the Japanese market and further strengthen its position as a global leader in technology for high performance thermal management and signal integrity materials.
Show highlights will include:
tec-speed 20.0 (VT-870) combines unrivaled high frequency performance (Dk 3.48 / Df 0.0037), superior loss characteristics and the highest reliability with fast availability and efficient delivery through Ventec’s fully controlled and managed global supply chain and technical support-network. tec-speed 20.0 is designed for the world's most demanding high-frequency PCB applications such as cellular base station antennas, power amplifiers, LNB for broadcast satellites, automotive radar and RFID.
VT-5A2 offers a polymer matrix that is fully compatible with Ventec laminates, epoxy or polyimide-based materials including tec-speed, making it the ideal choice for the manufacture of hybrid multilayer low-loss constructions. VT-5A2 sets itself apart by offering highest performance thermal conductivity 8 times that of FR-4 at 2.2 W/m.K, a high Tg of 190°C, best in class thermal performance (T260 >60 minutes, T288 >30 minutes and T300 >15 minutes) and MOT of 150°C. VT-5A2 is lead-free assembly compatible, fulfills RoHS and WEEE requirements and complies with UL94 V0.
VT-4B Series IMS
For superior thermal dissipation of an insulated metal substrate (IMS), VT-4B series materials offer the perfect performance and properties. VT-4B1 is designed for bending and forming. The tiny minimum radius eases fitting in tight spaces, for an elegantly engineered assembly. The extremely flexible dielectric will not crack or peel. Thermal conductivity 1.0 W/m.K, for minimum Zth 0.078°C*in2/W. From VT-4B3 to VT-4B9, the family provides a broad choice of thermal performance. 3 W/m.K to 10.0 W/m.K, and minimum Zth from 0.026°C*in2/W to 0.0078°C*in2/W satisfy demanding applications: LED lighting, high power-density converters, power supplies, automotive lighting and controls. For direct-to-metal connection of electrically isolated heat sources, VT-4B5SP selective preference substrates ensure maximum thermal efficiency and place dielectric insulation only where needed.
VT-901 (IPC QPL Listed)
Where mechanical strength and high-temperature stability are critical, VT-901 polyimide substrate has high flex strength, high glass temperature (Tg), low z-axis CTE, and long T260 and T288 times – to maintain dimensional stability and integrity even under harsh loads. VT-901 is a safe non-MDA formula, with low outgassing tested and approved by NASA, available as laminate or prepreg. Ventec’s proprietary resin system is produced entirely in-house, giving ultimate supply-chain security and quality assurance. Outstanding electrical performance offers high resistivity for electrical isolation, and resistance to arcing, tracking, and dielectric breakdown. Low dielectric constant (Dk) and dissipation factor (Df) ensure excellent signal integrity for computing and communications.
All these and more can be seen at the Ventec JPCA booth #7B-32.
About Ventec International
With volume manufacturing facilities and HQ in Suzhou, China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the global PCB industry. For more information, click here.