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NexLogic Technologies, Inc. announced recently it is entering into the era of assembling and manufacturing implantable medical devices, which is a new and rapidly growing segment in the burgeoning medical electronics market.
As the name suggests, implantable medical devices are surgically inserted into various parts of the human body. They range from cardiac pacemakers or blood pressure sensor monitors onto smaller devices implanted into different human organs.
NexLogic has aggressively pursued a disciplined customer facing policy to maintain leadership with PCB design and manufacturing technology trends and to successfully comply with emerging OEM medical electronics design and manufacturing demands. PCB technology has evolved from through-hole to surface mount and now to comply with OEM demands, it is moving rapidly into hybrid assembly and manufacturing marrying both SMT and microelectronics technologies. In particular, PCB microelectronics assembly and manufacturing play a major role in producing implantable medical devices.
Zulki Khan, President of NexLogic Technologies, Inc., said, “Over time, we’ve been getting ready for these new medical device customers by performing research into both ingestible and implantable medical devices. Plus, we’ve made significant CAPEX and have increased our process engineering capabilities. Today, we’re putting that knowhow into highly advanced proprietary customer projects. We’re now closely working with our newly acquired major OEM customers who are producing implantable medical devices.”
With its advanced PCB microelectronics assembly and manufacturing line, NexLogic is well positioned to comply with today’s implantable medical device requirements and meet Food and Drug Administration (FDA) regulations pertaining to implantable medical devices.
To effectively support its implantable and ingestible medical electronics devices customers, NexLogic provides them with seasoned, well-trained, and certified engineering and technical professionals.
Plus, the company has on its premises an ISO 14644-1 Class 4/10,000 and the equivalent Federal Standard 209E (FS209E) Class 1000 clean room as an integral part of its PCB microelectronics services and manufacturing capability.
Also, the company’s PCB microelectronics assembly and manufacturing line includes such leading systems and equipment as a Kulicke & Soffa (K&S) IConn MEM Plus high performance wire bonder for gold and silver alloy wire bonding and a Nordson EFD precision fluid dispenser system.
Other equipment includes multiple Hesse Bondjet 820 fully automatic fine wire bonders, multiple MRSI 705 auto die placement devices, Janome JR3303 Robotic level flux and epoxy dispenser, TPT-HB16 Wire/Ball Bonder, Royce 620 Multi-test Bond Tester and sheer strength puller, and Keyence VK-X1000 Profile Measurement Microscope for wire bond inspection and verification.
