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The substrate-like-PCB market is expected to grow at a CAGR of 12% during the forecast period (2020−2025). Owing to the rising adoption of substrate-like-PCB in OEMs, smart consumer electronics and wearable devices, there is a growth of the substrate-like-PCB market. The need for miniaturization and efficient interconnect solutions is also contributing to substrate-like PCB market growth. At present market is heavily dependent on high-end smartphone growth. For instance, Huawei started to produce substrate-like-PCB for the Premium phone P30 Pro released in March 2019.
Industry experts have identified an increasing amount of focus on reducing the size of electronic packages, to reduce power consumption and boost functionality. All the miniaturized components need to be arranged within a limited dimension, which is not feasible in conventional printed circuit boards (PCBs). This limitation is driving the need for the substrate-like-PCB market. One of the key substrate-like-PCB market trends is the development of an advanced system in package (SiP) modules. The application of SiP modules is increasing due to benefits like bundling of communication units like Wi-Fi, modem, and Bluetooth in one package. With the rising trends in technologies such as IoT, 5G, smart cars, it is required that the size of the PCB would be miniaturized and the substrates become much more powerful.