I-Connect007 Editor's Choice: Five Must-Reads for the Week


Reading time ( words)

This week, we’ve covered a variety of bases in our newsletters and websites. In my top five picks, we have news about columnist Tara Dunn moving to Averatek to work with their A-SAP additive processes, and an interview with Audrey Sim regarding the “hybrid” model adopted by the HKPCA for its upcoming Electronic Circuits World Convention.

We also have a compilation of the questions that readers have asked Joe Fjelstad and news about DownStream Technologies adding support for flex, rigid-flex, and embedded component designs. Finally, we share a review of some of KYZEN’s new training sessions on cleaning electronic assemblies—virtual courses that pack a lot of information into 15-minute snapshots. Knowing how tight everyone’s schedules are now, 15-minute events might be the ticket.

Just Ask Joe Fjelstad: The Exclusive Compilation
Published November 19

Our “Just Ask” series continues to be popular with readers from across the electronics development spectrum, and columnist Joe Fjelstad was happy to answer your queries about topics new and old. There’s a thirst for knowledge in our industry, and we’ll keep bringing you the experts who have the information you need.

HKPCA’s Audrey Sim Details Upcoming Electronic Circuits World Convention
Published November 18

After covering a variety of virtual trade shows this fall, I can’t say I’m shocked to see the Hong Kong Printed Circuit Association holding their 2020 Electronic Circuits World Convention as both a virtual and physical show. In this interview, Audrey Sim of HKPCA details this hybrid event, which will be virtual for all three days, while the last day’s forum will also be a live event. This might be a great model for trade shows as we move forward. The show takes place from November 30 through December 2.

New DownStream Software Supports Flex, Rigid-Flex, and Embedded Component Designs
Published November 17

Flex and rigid-flex keep marching on, making inroads into many of our military, aerospace, and household devices. Now, DownStream Technologies has added support for flex, rigid-flex, and embedded component designs to their CAM350, DFMStream, and BluePrint-PCB flows. DownStream will now support importation and visualization of flex, rigid-flex, and embedded designs in 2D and 3D.

High-Tech, High-Value Cleaning Answers Made Easy With KYZEN’s Tech-2-Tech
Published November 19

This summer, KYZEN introduced its Tech-2-Tech training initiative, a series of 15-minute virtual sessions focused on cleaning electronic assemblies. In this review, Technical Editor Pete Starkey discusses his takeaways from a number of these training sessions, including “the five forces of cleaning” and how surprised he was to learn so much in a quarter of an hour. One upcoming holiday session will cover “Smart pH Employment in Electronic Cleaning: What Is the pH of Eggnog?” 

Tara Dunn Transitions to New Role at Averatek
Published November 19

Tara Dunn recently joined Averatek, the company that created the A-SAP high-density additive manufacturing process. In this interview with Editors Michelle Te and Nolan Johnson, Tara discusses her new role as vice president of marketing and development at Averatek and why she believes that the additive process represents the future of high-density PCB manufacturing.

Share




Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

12/02/2022 | Nolan Johnson, I-Connect007
Normally, the holiday season is a slow(ish) news time, but this year just feels different. My opinion is that the technology industry banked up a whole bunch of innovations and new products during the pandemic disruptions, which are coming to market as quickly as possible. The November/December news is full of technology discussion, as my selections this week clearly demonstrate.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

11/11/2022 | Nolan Johnson, I-Connect007
The industry news cycle seems to be picking up speed lately. Of course, 30 days into the quarter is about when public companies announce their results, and in the midst of this worldwide financial situation, we’ve got all eyes on anything coming out from our counterparts in the industry. I’ve noticed that global corporate results (Nan Ya PCB and TTM, in particular) do seem to be on everyone’s radar. In addition to financial news, trade shows are popping back up around the world—Europe, India, and a special report from editor Andy Shaughnessy, who took his own road trip to Raleigh, reporting on PCB Carolina, which had its own heyday this year.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/14/2022 | Nolan Johnson, I-Connect007
I’ve been in Washington, D.C., most of this week, attending and reporting on the IPC Advanced Packaging Symposium. You’ll see more content from me in the weeks and months to come as I sort through and highlight the varied aspects of this ground-breaking event. If you’re in this industry, advanced packaging will affect you, make no mistake about it.



Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.