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Eltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards, provided an update regarding its intention to apply to the Israel Land Authority (ILA) for an allocation of land in the north of Israel where Eltek intends to build a second production facility.
The Ministry of Economics approved a recommendation to the ILA to allocate land in the north of Israel to Eltek without the need for a bidding process. Such recommendation provides for an exemption period of 24 months from the requirement to acquire the land by means of a tender. The land development cost is expected at a 30% discount to prevailing market prices. Following receipt of the Ministry of Economics recommendation, our board of directors instructed management to apply to the ILA for the necessary permits and to finalize the terms of a long term pre-paid lease.
Eli Yaffe, Eltek's CEO, commented: "We are considering expanding to a new and second advanced facility within a few years. This is a major part of our long term and strategic roadmap in order to grow and accelerate the expansion of our business."
Eltek is at an early stage of this process and there can be no assurance that it will obtain all the necessary permits for a new plant from the ILA, or that it will be able to finance such project.
Denis Jacques, Technic Inc.
About three decades ago, immersion silver, a nitrate-based process, gained a lot of market share in the world of PCB final finishes. More economical than ENIG, flat, solderable, and conductive, it had everything going for it—everything but corrosion resistance in a harsh environment, that is. Champagne voids were also an issue, along with line reduction. But the worst drawback, the characteristic that made the part short over time, was creep corrosion. A build-up of copper sulfide salt that grows in contact with a sulfur-rich environment, heat, and moisture resulted in failures in the field. This was enough to scar the process for good.
Pete Starkey, I-Connect007
Örebro, Sweden on June 15 brought a bright and early start to Day 2 of the EIPC Summer Conference for those who had enjoyed the previous evening’s networking dinner, but had resisted the temptation to over-indulge or to carry on their long-awaited catch-up conversations with old friends into the small hours. All but a few were in their seats for 9 a.m., awake and attentive for Session 4 of the conference, on the theme of new process technologies, moderated by Martyn Gaudion, CEO of Polar Instruments.
I-Connect007 Editorial Team
The I-Connect007 Editorial Team speaks with Technica’s Frank Medina, Ed Carrigan, and Jason Perry about trending hotspots that provide the PCB fabricator a high return on investment (ROI). A theme that carries throughout the conversation is that traditional methods for calculating ROI are being replaced by models that include more qualitative factors.