DuPont Opens New Kapton, Pyralux Production Line in Circleville, Ohio

Reading time ( words)

DuPont Interconnect Solutions, a business within the Electronics & Industrial segment, held a ribbon-cutting ceremony with elected officials and business leaders to formally mark the completion of its $250 million capital project to expand production of Kapton polyimide film and Pyralux flexible circuit materials at the Circleville manufacturing site.

“The opening of the production line in Circleville marks a major milestone for DuPont and Electronics & Industrial,” said Jon Kemp, president of DuPont Electronics & Industrial. “The Kapton and Pyralux expansion will help ensure supply of innovative materials to meet the growing global customer demand in the automotive, consumer electronics, telecommunications, specialized industrial and defense segments. It also demonstrates our ongoing commitment to being the partner of choice for our customers and delivering them new products with higher reliability and supply assurance.”

DuPont employs more than 1,000 people across eight locations in Ohio, including 500 people at its site in Circleville. Kemp said, “DuPont is proud to play an integral role in Ohio’s plans to expand its semiconductor and electronics manufacturing ecosystem.”

This new manufacturing line uses DuPont proprietary processing capabilities to produce advanced Kapton polyimide films, which have set industry standards for more than 50 years, offering high performance, reliability and durability. Kapton polyimide films offer a unique combination of electrical, thermal, chemical and mechanical properties that withstand extreme temperature, vibration and other demanding environments.

Kapton polyimide film is also at the heart of DuPont’s Pyralux line of flexible copper-clad laminates that are available in a wide variety of copper types, thicknesses and construction options, all of which offer excellent thermal, chemical, electrical and mechanical properties. Pyralux laminates are ideal for use in a wide variety of multi-layer flex and rigid-flex applications which require advanced performance, such as low dissipation loss for high speed, high frequency, robust thermal resistance and high reliability.


Suggested Items

Flex on the Brain: The Future of Neural Interfaces

10/26/2020 | Andy Shaughnessy, Design007 Magazine
The SMTA Additive Electronics TechXchange took place virtually on October 14, with presentations from a wide variety of technologists involved in additive processes. Andy Shaughnessy describes how one of the highlights was a presentation titled “Flexible Electronics for Neural Interfaces” by Dr. Jonathan Viventi, assistant professor of biomedical engineering at Duke University.

Dale Smith and David Moody: Lenthor Pushing Limits of Flex Technology

07/21/2020 | Andy Shaughnessy, Design007 Magazine
Andy Shaughnessy recently spoke with Dale Smith and David Moody of Lenthor Engineering. Dale is Lenthor’s new chief technology officer, and David is the director of sales/marketing.

Copyright © 2022 I-Connect007. All rights reserved.