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NovaCentrix is pleased to announce the release of its newest product: jettable gold ink. The Metalon JG.line of jettable gold inks are ideal for applications like biomedical and electronics. Early customers include advanced R&D groups as well as universities and institutes.
Featuring excellent electrical and physical performance properties, the company's Metalon gold inks are the perfect solution for applications requiring bio-compatibility or high levels of corrosion resistance.
NovaCentrix gold inks can be cured with traditional thermal processes, or with PulseForge tools featuring the revolutionary Digital Thermal Processing – the only solution that can dry, sinter, and solder at an industrial scale on low-temp heat-sensitive substrates without damage.
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05/18/2023 |
Mark Gallant, DownStream Technologies
Everyday rigid FR-4 PCBs have a well-known layer stackup recipe: dielectrics, PCB conductor layers, plane layers, mask, and silkscreen (nomenclature or legend). More advanced layer types may include embedded or screened components or cavities with bonded bare die. Flex and rigid-flex stackups include those similar to rigid PCBs, such as dielectrics, conductor, mask, and silkscreen layers, but that is where the similarity ends. There are many additional layer types present for this genre of PCB. They include types like coverlay, adhesive, conductive film, conductive foil, conductive adhesive, bondply, and stiffener.
04/17/2023 |
Mark Gallant, DownStream Technologies
Flex and rigid-flex PCB constructions are not new concepts. It has become commonplace as engineers look for alternative circuit packaging for ever-shrinking electronic products. A flat, one-sheet schematic for a straight ribbon cable is analogous to its physical flat substrate. A flat, multi-sheet schematic that details circuitry for a rigid-flex design bears little visual resemblance to its three-dimensional, variable material rigid-flex assembly. However, in both schematic examples, schematic-based analysis tools are applied equally. This same truth also applies to common FR-4-based two-layer or multilayer PCBs.
01/18/2022 |
Andy Shaughnessy, Design007 Magazine
I recently spoke with Bert Horner of the Test Connection Inc., about the current state of flex and rigid-flex assembly testing. He explained some of the differences between testing flex and rigid PCBs, the requirements for testing specialties such as high-voltage flex, and the added demands of handling flexible circuits.
