EIPC Speednews: News from the European PCB Industry


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News from Belgium

- AT&S goes for Ucamco's Ledia Direct Imager

News from Switzerland

- Huntsman is joining a research programme combining industry and academic expertise

- Your questions answered: Large Hadron Collider restart

News from the UK

- New Sales Manager at Viking Test Ltd

- ICT Annual Symposium, Black Country Museum, Dudley, 3rd June 2015

- IMAPS UK Advanced Packaging Workshop, 4th June 2015

Printed Electronics News

- OLEDS as wallpaper

- Concrete solar wall

News from WECC members

- IPC Releases Market Research Report on Issues and Outlook for Lead-Free Electronics in Military and Aerospace Applications

- IPC Standards Committee Reports - Data Generation and Transfer, Supplier Declaration, Electronic Documentation, EHS, Management, Intellectual Property

Click here for the International Events Diary 2015

Click here for the complete SpeedNews Issue 14

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Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/13/2022 | Nolan Johnson, I-Connect007
The big news in the industry this week was the new bill introduced to the U.S. Congress in support of the PCB manufacturing industry. The Supporting American Printed Circuit Boards Act of 2022, which was introduced by Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT), incentivizes “purchases of domestically produced PCBs as well as industry investments in factories, equipment, workforce training, and research and development.” The bill is a PCB-oriented complement to the semiconductor-oriented CHIPS Act of 2021.

Improved Thermal Interface Materials For Cooling High-Power Electronics

03/31/2022 | Jeff Brandman, Aismalibar North America
Heat has been a significant concern in electronics since the beginning of the electronics age when hot glowing vacuum tubes were first used to receive and transmit data bits. The transistor and integrated circuit effectively solved that basic problem, but increases in integration resulted in increased concentration of heat, exacerbated by relentless increases in operating frequency. While improvements in electronics technology have been able to mitigate many thermal issues at chip level thanks to improved semiconductor designs devised to operate at lower voltages (thus requiring less energy) the thermal management challenge continues to vex electronic product developers.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/25/2022 | Andy Shaughnessy, Design007 Magazine
It’s been a crazy week, with lots of bad news coming out of Ukraine. (I’m a news junkie by trade, but I confess that some days I just unplug from the news completely to avoid overdosing on negativity.) And, as you might have guessed, this is all having ill effects on our electronics supply chain, which is already stretched thin. This is reflected in our IPC news item that shows an uptick in PCB sales in February, but a drop in bookings YOY, in part due to the trouble in Eastern Europe. But there’s positive news in this week’s top reads. We have a NextFlex article about an innovative flexible technology called flexible hybrid electronics (FHE) and a great interview by Dan Beaulieu. We also have a column by Travis Kelly, who discusses PCBAA’s efforts to lobby for American manufacturing in Washington. And last but not least, let’s welcome our two newest columnists, Paige Fiet and Hannah Nelson, who discuss their excitement about entering this industry.



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