The Flex-to-Fit Approach
June 4, 2015 | Tara Dunn, OMNI PCBEstimated reading time: 1 minute
The flex-to-fit concept reminds us that creativity and engineering go hand-in-hand. Imagine this scenario: As an engineer, you have been tasked with the challenge of adding sensors to the front spoiler lip of the new 2015 Porsche Cayman.
There is limited space available and the cavity is thin enough that running even a small wire bundle would be difficult. What do you do? Let’s take a look at the flex-to-fit concept.
When there is not ample space for a conventional approach, this process, which is the convergence of the mechanical world and the electronics world, results in the ability to design a flexible circuit along the contour of an existing, irregularlyshaped structure. By taking the mechanical part, extruding the surface and then conforming to that surface, a flex circuit can be created that will fit perfectly within the confines of a limited space or cavity. In a recent conversation with Mike Brown, of Interconnect Design Solutions, he helped to clarify this process, and we discussed several exciting applications. He also explained the benefits to the flexible circuit design process.
Most electronic systems require an enclosure to support a rigid PCB. Looking beyond the constraints of an enclosure and incorporating flexible circuits within the contours of other existing structures, opens up endless possibilities. In the example of the Porsche Cayman, imagine this solution: The valence of the front spoiler lip is mechanically digitized and recreated in a 3D MCAD model.
To read the full article, click here.
Editor's Note: This article originally appeared in the June 2015 issue of The PCB Magazine.
Suggested Items
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.