MacDermid’s Research Team Talks New Cyanide-free Immersion Gold at SMTAI


Reading time ( words)

MacDermid2.jpgGoldman: There is no universal finish.

Santos: There is none that fits everything. It depends on the application, the end-use environment, which finish you need for a specific application. The talk also mentioned that there should be at least 0.1 micron of metallic tin after the reflow cycle, which is a pre-treatment process that the immersion tin goes through. So, that is exactly my poster: The reflow effect on the immersion tin solder wetting.

We also went to another talk given by George Milad about IPC thickness requirements. He mentioned that for the tin finish to be solderable after two reflow cycles, you need at least one micron of immersion tin to begin with to have free-tin at the end of the reflow cycle, so that it would still be solderable.

Goldman: And your immersion tin achieves that?

Santos: Yes. So, it's comparable to what competitors have.

Nable: This study also contributes to the understanding of how the immersion tin finish changes with thermal exposure. We wanted to dig a little bit deeper into the mechanism of how immersion tin changes.

Goldman: Surface finishes are of interest to the audience here.

Nable: Right. And that's what we do at MacDermid. We both work in the electronics solutions division and our projects particularly are more focused on final finish, surface finish type of projects. But we're not limited to that.

Goldman: Anything else going on?

Nable: I also want to share that I am a volunteer officer for our local chapter in Connecticut for SMTA, so this is really nice to be able to participate in SMTAI and meet people, and meet the other chapter officers as well.  This is the international conference, so this is where all chapters might come together.

Santos: Jun is actually the president of the SMTA Connecticut chapter.

Nable: I am. We try to organize activities or meetings that would be of benefit and relevant to our members that we can all learn from. We get ideas from SMTAI, having these technical talks to gauge the current issues and level of interest in certain topics. We try to bring that back to our local chapter because not all of our members can come to SMTAI.

Santos: The venue of previous SMTA Connecticut chapter expo and forum is just five minutes’ walk from our Waterbury, Connecticut site and fairly accessible to all local members.

Share




Suggested Items

EIPC Summer Conference 2022: Day 2 Review

06/29/2022 | Pete Starkey, I-Connect007
Örebro, Sweden on June 15 brought a bright and early start to Day 2 of the EIPC Summer Conference for those who had enjoyed the previous evening’s networking dinner, but had resisted the temptation to over-indulge or to carry on their long-awaited catch-up conversations with old friends into the small hours. All but a few were in their seats for 9 a.m., awake and attentive for Session 4 of the conference, on the theme of new process technologies, moderated by Martyn Gaudion, CEO of Polar Instruments.

Technica Heats Up ROI Discussion

05/17/2022 | I-Connect007 Editorial Team
The I-Connect007 Editorial Team speaks with Technica’s Frank Medina, Ed Carrigan, and Jason Perry about trending hotspots that provide the PCB fabricator a high return on investment (ROI). A theme that carries throughout the conversation is that traditional methods for calculating ROI are being replaced by models that include more qualitative factors.

EIPC Technical Snapshot: Supporting Autonomous Driving

05/12/2022 | Pete Starkey, I-Connect007
EIPC’s 17th Technical Snapshot webinar on May 4 focused on developments in automotive electronics, particularly on advances in the technologies required to support the evolution of autonomous driving. The team brought together two expert speakers to present their detailed views on topics encompassed within “CASE,” the acronym that appears to be taking over the automotive industry.



Copyright © 2022 I-Connect007. All rights reserved.